MX364462B - Corte de material transparente con láser ultrarrápido y óptica de haces. - Google Patents
Corte de material transparente con láser ultrarrápido y óptica de haces.Info
- Publication number
- MX364462B MX364462B MX2016007974A MX2016007974A MX364462B MX 364462 B MX364462 B MX 364462B MX 2016007974 A MX2016007974 A MX 2016007974A MX 2016007974 A MX2016007974 A MX 2016007974A MX 364462 B MX364462 B MX 364462B
- Authority
- MX
- Mexico
- Prior art keywords
- laser
- transparent material
- material cutting
- ultrafast laser
- beam optics
- Prior art date
Links
- 239000012780 transparent material Substances 0.000 title 1
- 230000003287 optical effect Effects 0.000 abstract 2
- 238000005553 drilling Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Laser Beam Processing (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361917140P | 2013-12-17 | 2013-12-17 | |
| US201462022888P | 2014-07-10 | 2014-07-10 | |
| US14/529,801 US9687936B2 (en) | 2013-12-17 | 2014-10-31 | Transparent material cutting with ultrafast laser and beam optics |
| PCT/US2014/070275 WO2015095014A1 (en) | 2013-12-17 | 2014-12-15 | Transparent material cutting with ultrafast laser and beam optics |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| MX2016007974A MX2016007974A (es) | 2017-01-11 |
| MX364462B true MX364462B (es) | 2019-04-26 |
Family
ID=53367591
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MX2016007974A MX364462B (es) | 2013-12-17 | 2014-12-15 | Corte de material transparente con láser ultrarrápido y óptica de haces. |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US9687936B2 (OSRAM) |
| EP (1) | EP3083126B1 (OSRAM) |
| JP (1) | JP6571085B2 (OSRAM) |
| CN (1) | CN106170367A (OSRAM) |
| MX (1) | MX364462B (OSRAM) |
| RU (1) | RU2673258C1 (OSRAM) |
| TW (1) | TWI645929B (OSRAM) |
| WO (1) | WO2015095014A1 (OSRAM) |
Families Citing this family (58)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014079478A1 (en) | 2012-11-20 | 2014-05-30 | Light In Light Srl | High speed laser processing of transparent materials |
| EP2754524B1 (de) * | 2013-01-15 | 2015-11-25 | Corning Laser Technologies GmbH | Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie |
| EP2781296B1 (de) | 2013-03-21 | 2020-10-21 | Corning Laser Technologies GmbH | Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser |
| US20150059411A1 (en) * | 2013-08-29 | 2015-03-05 | Corning Incorporated | Method of separating a glass sheet from a carrier |
| US20150165560A1 (en) | 2013-12-17 | 2015-06-18 | Corning Incorporated | Laser processing of slots and holes |
| US9701563B2 (en) | 2013-12-17 | 2017-07-11 | Corning Incorporated | Laser cut composite glass article and method of cutting |
| US11556039B2 (en) | 2013-12-17 | 2023-01-17 | Corning Incorporated | Electrochromic coated glass articles and methods for laser processing the same |
| US20150166393A1 (en) * | 2013-12-17 | 2015-06-18 | Corning Incorporated | Laser cutting of ion-exchangeable glass substrates |
| US9850160B2 (en) | 2013-12-17 | 2017-12-26 | Corning Incorporated | Laser cutting of display glass compositions |
| US9676167B2 (en) | 2013-12-17 | 2017-06-13 | Corning Incorporated | Laser processing of sapphire substrate and related applications |
| US9815730B2 (en) | 2013-12-17 | 2017-11-14 | Corning Incorporated | Processing 3D shaped transparent brittle substrate |
| US10442719B2 (en) | 2013-12-17 | 2019-10-15 | Corning Incorporated | Edge chamfering methods |
| US10293436B2 (en) | 2013-12-17 | 2019-05-21 | Corning Incorporated | Method for rapid laser drilling of holes in glass and products made therefrom |
| KR102445217B1 (ko) | 2014-07-08 | 2022-09-20 | 코닝 인코포레이티드 | 재료를 레이저 가공하는 방법 및 장치 |
| KR20170028943A (ko) * | 2014-07-14 | 2017-03-14 | 코닝 인코포레이티드 | 조정가능한 레이저 빔 촛점 라인을 사용하여 투명한 재료를 처리하는 방법 및 시스템 |
| CN107073641B (zh) | 2014-07-14 | 2020-11-10 | 康宁股份有限公司 | 接口块;用于使用这种接口块切割在波长范围内透明的衬底的系统和方法 |
| US10335902B2 (en) | 2014-07-14 | 2019-07-02 | Corning Incorporated | Method and system for arresting crack propagation |
| CN208586209U (zh) | 2014-07-14 | 2019-03-08 | 康宁股份有限公司 | 一种用于在工件中形成限定轮廓的多个缺陷的系统 |
| US10047001B2 (en) | 2014-12-04 | 2018-08-14 | Corning Incorporated | Glass cutting systems and methods using non-diffracting laser beams |
| JP2018507154A (ja) | 2015-01-12 | 2018-03-15 | コーニング インコーポレイテッド | マルチフォトン吸収方法を用いた熱強化基板のレーザー切断 |
| WO2016138054A1 (en) | 2015-02-27 | 2016-09-01 | Corning Incorporated | Optical assembly having microlouvers |
| CN107922237B (zh) | 2015-03-24 | 2022-04-01 | 康宁股份有限公司 | 显示器玻璃组合物的激光切割和加工 |
| WO2016160391A1 (en) | 2015-03-27 | 2016-10-06 | Corning Incorporated | Gas permeable window and method of fabricating the same |
| EP3295226A1 (en) | 2015-05-13 | 2018-03-21 | Corning Incorporated | Light guides with reduced hot spots and methods for making the same |
| KR102499697B1 (ko) * | 2015-07-10 | 2023-02-14 | 코닝 인코포레이티드 | 유연한 기판 시트에서의 홀의 연속 제조 방법 및 이에 관한 물품 |
| DE102015111490A1 (de) * | 2015-07-15 | 2017-01-19 | Schott Ag | Verfahren und Vorrichtung zum lasergestützten Abtrennen eines Teilstücks von einem flächigen Glaselement |
| US20180166353A1 (en) * | 2015-08-21 | 2018-06-14 | Corning Incorporated | Glass substrate assemblies having low dielectric properties |
| US10442720B2 (en) * | 2015-10-01 | 2019-10-15 | AGC Inc. | Method of forming hole in glass substrate by using pulsed laser, and method of producing glass substrate provided with hole |
| EP3957611A1 (en) | 2016-05-06 | 2022-02-23 | Corning Incorporated | Transparent substrates with improved edge surfaces |
| US10410883B2 (en) | 2016-06-01 | 2019-09-10 | Corning Incorporated | Articles and methods of forming vias in substrates |
| US10794679B2 (en) | 2016-06-29 | 2020-10-06 | Corning Incorporated | Method and system for measuring geometric parameters of through holes |
| JP7090594B2 (ja) | 2016-07-29 | 2022-06-24 | コーニング インコーポレイテッド | レーザ加工するための装置および方法 |
| KR102423775B1 (ko) | 2016-08-30 | 2022-07-22 | 코닝 인코포레이티드 | 투명 재료의 레이저 가공 |
| KR102078294B1 (ko) | 2016-09-30 | 2020-02-17 | 코닝 인코포레이티드 | 비-축대칭 빔 스폿을 이용하여 투명 워크피스를 레이저 가공하기 위한 기기 및 방법 |
| LT3529214T (lt) * | 2016-10-24 | 2021-02-25 | Corning Incorporated | Substrato apdorojimo stotis lakšto formos stiklo substratų lazeriniam mašininiam apdorojimui |
| US10752534B2 (en) | 2016-11-01 | 2020-08-25 | Corning Incorporated | Apparatuses and methods for laser processing laminate workpiece stacks |
| US10688599B2 (en) | 2017-02-09 | 2020-06-23 | Corning Incorporated | Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines |
| CN110869845A (zh) | 2017-04-12 | 2020-03-06 | 法国圣戈班玻璃厂 | 电致变色结构及分离电致变色结构的方法 |
| DE102017208290A1 (de) | 2017-05-17 | 2018-11-22 | Schott Ag | Vorrichtung und Verfahren zum Bearbeiten eines Werkstücks entlang einer vorbestimmten Bearbeitungslinie |
| US10580725B2 (en) | 2017-05-25 | 2020-03-03 | Corning Incorporated | Articles having vias with geometry attributes and methods for fabricating the same |
| US11078112B2 (en) | 2017-05-25 | 2021-08-03 | Corning Incorporated | Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same |
| US10626040B2 (en) | 2017-06-15 | 2020-04-21 | Corning Incorporated | Articles capable of individual singulation |
| US10947148B2 (en) | 2017-08-07 | 2021-03-16 | Seagate Technology Llc | Laser beam cutting/shaping a glass substrate |
| US10906832B2 (en) * | 2017-08-11 | 2021-02-02 | Corning Incorporated | Apparatuses and methods for synchronous multi-laser processing of transparent workpieces |
| US10689286B2 (en) | 2017-10-13 | 2020-06-23 | Seagate Technology Llc | Separation of glass shapes using engineered induced thermal gradients after process cutting |
| US12180108B2 (en) | 2017-12-19 | 2024-12-31 | Corning Incorporated | Methods for etching vias in glass-based articles employing positive charge organic molecules |
| US11554984B2 (en) | 2018-02-22 | 2023-01-17 | Corning Incorporated | Alkali-free borosilicate glasses with low post-HF etch roughness |
| TWI677395B (zh) * | 2018-03-31 | 2019-11-21 | 財團法人工業技術研究院 | 硬脆材料切割方法及其裝置 |
| US10615044B1 (en) * | 2018-10-18 | 2020-04-07 | Asm Technology Singapore Pte Ltd | Material cutting using laser pulses |
| CN110039205B (zh) * | 2019-04-30 | 2021-07-20 | 大族激光科技产业集团股份有限公司 | Led晶圆片的加工方法 |
| EP3745471A1 (en) * | 2019-05-31 | 2020-12-02 | OSRAM Opto Semiconductors GmbH | Method of laser treatment of a semiconductor wafer comprising algainp-leds to increase their light generating efficiency |
| EP3770698B1 (fr) * | 2019-07-26 | 2025-03-12 | Comadur SA | Pierre minérale de type monocristalline munie d'un cone de recentrage d'un pivot, et son procédé de fabrication |
| RU2720791C1 (ru) * | 2019-09-06 | 2020-05-13 | Общество с ограниченной ответственностью "НАУЧНО-ТЕХНИЧЕСКОЕ ОБЪЕДИНЕНИЕ "ИРЭ-Полюс" (ООО НТО "ИРЭ-Полюс") | Способ лазерной обработки прозрачного хрупкого материала и устройство его реализующее |
| CN110711937B (zh) * | 2019-11-14 | 2022-01-04 | 安徽同兴科技发展有限责任公司 | 一种切割机激光对焦的参数确定方法 |
| CN114178710B (zh) | 2020-08-24 | 2024-11-26 | 奥特斯(中国)有限公司 | 部件承载件及其制造方法 |
| CN112372151A (zh) * | 2020-10-29 | 2021-02-19 | 大昶(重庆)电子科技有限公司 | 一种玻璃用镭切设备及其生产工艺 |
| JP2024518987A (ja) * | 2021-05-13 | 2024-05-08 | アプライド マテリアルズ インコーポレイテッド | ターボバースト超高速レーザパルスによる材料処理 |
| CN116100156A (zh) * | 2021-11-11 | 2023-05-12 | 北京赢圣科技有限公司 | 锁频单脉冲深紫外超快激光精密打标透明材料的方法和系统 |
Family Cites Families (91)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1790397A (en) | 1931-01-27 | Glass workins machine | ||
| US3647410A (en) | 1969-09-09 | 1972-03-07 | Owens Illinois Inc | Glass ribbon machine blow head mechanism |
| US3775084A (en) | 1970-01-02 | 1973-11-27 | Owens Illinois Inc | Pressurizer apparatus for glass ribbon machine |
| US4646308A (en) | 1985-09-30 | 1987-02-24 | Spectra-Physics, Inc. | Synchronously pumped dye laser using ultrashort pump pulses |
| US4918751A (en) | 1987-10-05 | 1990-04-17 | The University Of Rochester | Method for optical pulse transmission through optical fibers which increases the pulse power handling capacity of the fibers |
| US4764930A (en) | 1988-01-27 | 1988-08-16 | Intelligent Surgical Lasers | Multiwavelength laser source |
| US4907586A (en) | 1988-03-31 | 1990-03-13 | Intelligent Surgical Lasers | Method for reshaping the eye |
| US5040182A (en) | 1990-04-24 | 1991-08-13 | Coherent, Inc. | Mode-locked laser |
| WO1993008877A1 (en) | 1991-11-06 | 1993-05-13 | Lai Shui T | Corneal surgery device and method |
| US5265107A (en) | 1992-02-05 | 1993-11-23 | Bell Communications Research, Inc. | Broadband absorber having multiple quantum wells of different thicknesses |
| CA2112843A1 (en) | 1993-02-04 | 1994-08-05 | Richard C. Ujazdowski | Variable repetition rate picosecond laser |
| JPH06318756A (ja) | 1993-05-06 | 1994-11-15 | Toshiba Corp | レ−ザ装置 |
| US5637244A (en) * | 1993-05-13 | 1997-06-10 | Podarok International, Inc. | Method and apparatus for creating an image by a pulsed laser beam inside a transparent material |
| US6489589B1 (en) | 1994-02-07 | 2002-12-03 | Board Of Regents, University Of Nebraska-Lincoln | Femtosecond laser utilization methods and apparatus and method for producing nanoparticles |
| US5436925A (en) | 1994-03-01 | 1995-07-25 | Hewlett-Packard Company | Colliding pulse mode-locked fiber ring laser using a semiconductor saturable absorber |
| US5400350A (en) | 1994-03-31 | 1995-03-21 | Imra America, Inc. | Method and apparatus for generating high energy ultrashort pulses |
| US5778016A (en) | 1994-04-01 | 1998-07-07 | Imra America, Inc. | Scanning temporal ultrafast delay methods and apparatuses therefor |
| JP2526806B2 (ja) | 1994-04-26 | 1996-08-21 | 日本電気株式会社 | 半導体レ―ザおよびその動作方法 |
| WO1995031023A1 (en) | 1994-05-09 | 1995-11-16 | Massachusetts Institute Of Technology | Dispersion-compensated laser using prismatic end elements |
| US6016324A (en) | 1994-08-24 | 2000-01-18 | Jmar Research, Inc. | Short pulse laser system |
| US5776220A (en) | 1994-09-19 | 1998-07-07 | Corning Incorporated | Method and apparatus for breaking brittle materials |
| US5696782A (en) | 1995-05-19 | 1997-12-09 | Imra America, Inc. | High power fiber chirped pulse amplification systems based on cladding pumped rare-earth doped fibers |
| JPH09207343A (ja) * | 1995-11-29 | 1997-08-12 | Matsushita Electric Ind Co Ltd | レーザ加工方法 |
| US5736709A (en) | 1996-08-12 | 1998-04-07 | Armco Inc. | Descaling metal with a laser having a very short pulse width and high average power |
| US7353829B1 (en) | 1996-10-30 | 2008-04-08 | Provectus Devicetech, Inc. | Methods and apparatus for multi-photon photo-activation of therapeutic agents |
| US6156030A (en) | 1997-06-04 | 2000-12-05 | Y-Beam Technologies, Inc. | Method and apparatus for high precision variable rate material removal and modification |
| BE1011208A4 (fr) | 1997-06-11 | 1999-06-01 | Cuvelier Georges | Procede de decalottage de pieces en verre. |
| DE19728766C1 (de) | 1997-07-07 | 1998-12-17 | Schott Rohrglas Gmbh | Verwendung eines Verfahrens zur Herstellung einer Sollbruchstelle bei einem Glaskörper |
| US6078599A (en) | 1997-07-22 | 2000-06-20 | Cymer, Inc. | Wavelength shift correction technique for a laser |
| DE19750320C1 (de) | 1997-11-13 | 1999-04-01 | Max Planck Gesellschaft | Verfahren und Vorrichtung zur Lichtpulsverstärkung |
| WO1999029243A1 (en) | 1997-12-05 | 1999-06-17 | Thermolase Corporation | Skin enhancement using laser light |
| US6501578B1 (en) | 1997-12-19 | 2002-12-31 | Electric Power Research Institute, Inc. | Apparatus and method for line of sight laser communications |
| JPH11197498A (ja) | 1998-01-13 | 1999-07-27 | Japan Science & Technology Corp | 無機材料内部の選択的改質方法及び内部が選択的に改質された無機材料 |
| US6272156B1 (en) | 1998-01-28 | 2001-08-07 | Coherent, Inc. | Apparatus for ultrashort pulse transportation and delivery |
| JPH11269683A (ja) | 1998-03-18 | 1999-10-05 | Armco Inc | 金属表面から酸化物を除去する方法及び装置 |
| US6160835A (en) | 1998-03-20 | 2000-12-12 | Rocky Mountain Instrument Co. | Hand-held marker with dual output laser |
| US6256328B1 (en) | 1998-05-15 | 2001-07-03 | University Of Central Florida | Multiwavelength modelocked semiconductor diode laser |
| JPH11347758A (ja) | 1998-06-10 | 1999-12-21 | Mitsubishi Heavy Ind Ltd | 超精密加工装置 |
| US6407360B1 (en) | 1998-08-26 | 2002-06-18 | Samsung Electronics, Co., Ltd. | Laser cutting apparatus and method |
| EA199900040A1 (ru) * | 1998-10-13 | 1999-10-28 | Ооо "Лазтекс" | Способ резки пластин хрупких материалов |
| US7649153B2 (en) * | 1998-12-11 | 2010-01-19 | International Business Machines Corporation | Method for minimizing sample damage during the ablation of material using a focused ultrashort pulsed laser beam |
| US6445491B2 (en) | 1999-01-29 | 2002-09-03 | Irma America, Inc. | Method and apparatus for optical sectioning and imaging using time-gated parametric image amplification |
| US6381391B1 (en) | 1999-02-19 | 2002-04-30 | The Regents Of The University Of Michigan | Method and system for generating a broadband spectral continuum and continuous wave-generating system utilizing same |
| US6484052B1 (en) | 1999-03-30 | 2002-11-19 | The Regents Of The University Of California | Optically generated ultrasound for enhanced drug delivery |
| US6373565B1 (en) | 1999-05-27 | 2002-04-16 | Spectra Physics Lasers, Inc. | Method and apparatus to detect a flaw in a surface of an article |
| US6449301B1 (en) | 1999-06-22 | 2002-09-10 | The Regents Of The University Of California | Method and apparatus for mode locking of external cavity semiconductor lasers with saturable Bragg reflectors |
| US6573026B1 (en) | 1999-07-29 | 2003-06-03 | Corning Incorporated | Femtosecond laser writing of glass, including borosilicate, sulfide, and lead glasses |
| US6339208B1 (en) | 2000-01-19 | 2002-01-15 | General Electric Company | Method of forming cooling holes |
| US6552301B2 (en) | 2000-01-25 | 2003-04-22 | Peter R. Herman | Burst-ultrafast laser machining method |
| JP4659300B2 (ja) | 2000-09-13 | 2011-03-30 | 浜松ホトニクス株式会社 | レーザ加工方法及び半導体チップの製造方法 |
| KR100673073B1 (ko) | 2000-10-21 | 2007-01-22 | 삼성전자주식회사 | 레이저 빔을 이용한 비금속 기판의 절단 방법 및 장치 |
| SG108262A1 (en) | 2001-07-06 | 2005-01-28 | Inst Data Storage | Method and apparatus for cutting a multi-layer substrate by dual laser irradiation |
| US6552298B1 (en) * | 2001-09-28 | 2003-04-22 | Corning Incorporated | Apparatus and method for making a lens on the end of an optical waveguide fiber |
| FR2855084A1 (fr) | 2003-05-22 | 2004-11-26 | Air Liquide | Optique de focalisation pour le coupage laser |
| JP2005138143A (ja) | 2003-11-06 | 2005-06-02 | Disco Abrasive Syst Ltd | レーザ光線を利用する加工装置 |
| JP4418282B2 (ja) | 2004-03-31 | 2010-02-17 | 株式会社レーザーシステム | レーザ加工方法 |
| US7804043B2 (en) | 2004-06-15 | 2010-09-28 | Laserfacturing Inc. | Method and apparatus for dicing of thin and ultra thin semiconductor wafer using ultrafast pulse laser |
| JP4692717B2 (ja) | 2004-11-02 | 2011-06-01 | 澁谷工業株式会社 | 脆性材料の割断装置 |
| JP4222296B2 (ja) | 2004-11-22 | 2009-02-12 | 住友電気工業株式会社 | レーザ加工方法とレーザ加工装置 |
| JP4490883B2 (ja) | 2005-07-19 | 2010-06-30 | 株式会社レーザーシステム | レーザ加工装置およびレーザ加工方法 |
| RU2288196C1 (ru) * | 2005-08-26 | 2006-11-27 | Борис Григорьевич Бердитчевский | Способ создания цветных изображений в прозрачных стеклах |
| US9138913B2 (en) * | 2005-09-08 | 2015-09-22 | Imra America, Inc. | Transparent material processing with an ultrashort pulse laser |
| US7626138B2 (en) | 2005-09-08 | 2009-12-01 | Imra America, Inc. | Transparent material processing with an ultrashort pulse laser |
| EP1875983B1 (en) | 2006-07-03 | 2013-09-11 | Hamamatsu Photonics K.K. | Laser processing method and chip |
| US8168514B2 (en) | 2006-08-24 | 2012-05-01 | Corning Incorporated | Laser separation of thin laminated glass substrates for flexible display applications |
| DE102007024700A1 (de) * | 2007-05-25 | 2008-12-04 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur Materialbearbeitung mit Laserstrahlung sowie Vorrichtung zur Durchführung des Verfahrens |
| JP5345334B2 (ja) | 2008-04-08 | 2013-11-20 | 株式会社レミ | 脆性材料の熱応力割断方法 |
| JP5071868B2 (ja) * | 2008-08-11 | 2012-11-14 | オムロン株式会社 | レーザ加工方法、レーザ加工装置、光学素子の製造方法、および光学素子 |
| US20100252959A1 (en) | 2009-03-27 | 2010-10-07 | Electro Scientific Industries, Inc. | Method for improved brittle materials processing |
| WO2010129459A2 (en) | 2009-05-06 | 2010-11-11 | Corning Incorporated | Carrier for glass substrates |
| EP2480507A1 (en) * | 2009-08-28 | 2012-08-01 | Corning Incorporated | Methods for laser cutting articles from chemically strengthened glass substrates |
| US20120234807A1 (en) | 2009-12-07 | 2012-09-20 | J.P. Sercel Associates Inc. | Laser scribing with extended depth affectation into a workplace |
| KR102088722B1 (ko) * | 2010-07-12 | 2020-03-17 | 로핀-시나르 테크놀로지스 엘엘씨 | 레이저 필라멘테이션에 의한 재료 가공 방법 |
| WO2012070490A1 (ja) * | 2010-11-24 | 2012-05-31 | 株式会社フジクラ | 微細孔の製造方法および微細孔を有する基体 |
| RU2459691C2 (ru) * | 2010-11-29 | 2012-08-27 | Юрий Георгиевич Шретер | Способ отделения поверхностного слоя полупроводникового кристалла (варианты) |
| US8539794B2 (en) | 2011-02-01 | 2013-09-24 | Corning Incorporated | Strengthened glass substrate sheets and methods for fabricating glass panels from glass substrate sheets |
| US8933367B2 (en) | 2011-02-09 | 2015-01-13 | Sumitomo Electric Industries, Ltd. | Laser processing method |
| WO2012108052A1 (ja) | 2011-02-10 | 2012-08-16 | 信越ポリマー株式会社 | 単結晶基板製造方法および内部改質層形成単結晶部材 |
| DE102011000768B4 (de) | 2011-02-16 | 2016-08-18 | Ewag Ag | Laserbearbeitungsverfahren und Laserbearbeitungsvorrichtung mit umschaltbarer Laseranordnung |
| KR101120471B1 (ko) | 2011-08-05 | 2012-03-05 | (주)지엘코어 | 다중 초점 방식의 펄스 레이저를 이용한 취성 재료 절단 장치 |
| US10239160B2 (en) | 2011-09-21 | 2019-03-26 | Coherent, Inc. | Systems and processes that singulate materials |
| TW201343296A (zh) | 2012-03-16 | 2013-11-01 | Ipg Microsystems Llc | 使一工件中具有延伸深度虛飾之雷射切割系統及方法 |
| FR2989294B1 (fr) | 2012-04-13 | 2022-10-14 | Centre Nat Rech Scient | Dispositif et methode de nano-usinage par laser |
| CN102672355B (zh) | 2012-05-18 | 2015-05-13 | 杭州士兰明芯科技有限公司 | Led衬底的划片方法 |
| US9938180B2 (en) * | 2012-06-05 | 2018-04-10 | Corning Incorporated | Methods of cutting glass using a laser |
| WO2014079478A1 (en) | 2012-11-20 | 2014-05-30 | Light In Light Srl | High speed laser processing of transparent materials |
| EP2754524B1 (de) | 2013-01-15 | 2015-11-25 | Corning Laser Technologies GmbH | Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie |
| US20150034613A1 (en) * | 2013-08-02 | 2015-02-05 | Rofin-Sinar Technologies Inc. | System for performing laser filamentation within transparent materials |
| US9517929B2 (en) * | 2013-11-19 | 2016-12-13 | Rofin-Sinar Technologies Inc. | Method of fabricating electromechanical microchips with a burst ultrafast laser pulses |
| US10005152B2 (en) * | 2013-11-19 | 2018-06-26 | Rofin-Sinar Technologies Llc | Method and apparatus for spiral cutting a glass tube using filamentation by burst ultrafast laser pulses |
| DE102013223637B4 (de) * | 2013-11-20 | 2018-02-01 | Trumpf Laser- Und Systemtechnik Gmbh | Verfahren zum Behandeln eines lasertransparenten Substrats zum anschließenden Trennen des Substrats |
-
2014
- 2014-10-31 US US14/529,801 patent/US9687936B2/en not_active Expired - Fee Related
- 2014-12-15 WO PCT/US2014/070275 patent/WO2015095014A1/en not_active Ceased
- 2014-12-15 RU RU2016128888A patent/RU2673258C1/ru not_active IP Right Cessation
- 2014-12-15 EP EP14822005.6A patent/EP3083126B1/en active Active
- 2014-12-15 JP JP2016539263A patent/JP6571085B2/ja not_active Expired - Fee Related
- 2014-12-15 CN CN201480075659.1A patent/CN106170367A/zh active Pending
- 2014-12-15 MX MX2016007974A patent/MX364462B/es active IP Right Grant
- 2014-12-17 TW TW103144125A patent/TWI645929B/zh not_active IP Right Cessation
-
2017
- 2017-06-08 US US15/617,622 patent/US20170266757A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| JP2017502844A (ja) | 2017-01-26 |
| EP3083126B1 (en) | 2020-02-26 |
| RU2016128888A (ru) | 2018-01-23 |
| MX2016007974A (es) | 2017-01-11 |
| RU2673258C1 (ru) | 2018-11-23 |
| US9687936B2 (en) | 2017-06-27 |
| US20170266757A1 (en) | 2017-09-21 |
| US20150166397A1 (en) | 2015-06-18 |
| TWI645929B (zh) | 2019-01-01 |
| CN106170367A (zh) | 2016-11-30 |
| EP3083126A1 (en) | 2016-10-26 |
| TW201524651A (zh) | 2015-07-01 |
| WO2015095014A1 (en) | 2015-06-25 |
| JP6571085B2 (ja) | 2019-09-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| MX364462B (es) | Corte de material transparente con láser ultrarrápido y óptica de haces. | |
| WO2016010954A3 (en) | System for and method of processing transparent materials using laser beam focal lines adjustable in length and diameter | |
| MX2016003664A (es) | Dispositivo y procedimiento de marcado laser de una lentilla oftalmica con un pulso laser de longitud de onda y energia por pulsos seleccionados. | |
| MX372902B (es) | Dispositivo de procesamiento y método de procesamiento. | |
| LT3747092T (lt) | Lazerių su plačiu generacijos dažnio derinimo diapazonu bangos ilgio nustatymas ir tam skirtos lazerinės sistemos | |
| WO2016010943A3 (en) | Method of and system for arresting crack propagation | |
| BR112017028312A2 (pt) | método para cortar uma camada de vidro fina | |
| IL261400B (en) | High-performance beam director for high-power laser systems or other systems | |
| MY178429A (en) | Method and device for providing through-openings in a substrate and a substrate produced in said manner | |
| WO2014106811A3 (en) | Cold atom gravity gradiometer | |
| WO2015080907A3 (en) | Laser systems and related methods | |
| LT2945770T (lt) | Būdas ir įrenginys lakšto formos substratų lazeriu grindžiamam mašininiam apdorojimui naudojant lazerio spindulių židinio liniją | |
| MY168398A (en) | Method and apparatus for non-ablative, photoacoustic compression machining in transparent materials using filamentation by burst ultrafast laser pulses | |
| BR112012019544A2 (pt) | metodo e sistema de corte com laser | |
| WO2014036995A3 (de) | Vorrichtung zum laserschneiden innerhalb transparenter materialien | |
| MX2011013286A (es) | Aparato para cirugia laser oftalmica. | |
| WO2014187860A3 (en) | Device and method for the decontamination of hollow objects such as container caps using uv radiations | |
| MX392157B (es) | Sistema para realizar una espectroscopia. | |
| SA518391656B1 (ar) | مجانس ضوء مضخة مدمج وحاقن إشارة لنظام ليزري عالي القدرة | |
| WO2014023828A3 (de) | Anordnung zum bearbeiten von werkstücken mit einem laserstrahl | |
| WO2016094609A8 (en) | Optical cross-coupling mitigation systems for wavelength beam combining laser systems | |
| WO2015138476A3 (en) | Collimated effect luminaire | |
| WO2013144692A3 (en) | Laser apparatus and extreme-ultraviolet light generation system using the same | |
| WO2017087283A3 (en) | Plasma based light source having a target material coated on a cylindrically-symmetric element | |
| WO2014089544A3 (en) | High power lasers, wavelength conversions, and matching wavelengths use environments |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FG | Grant or registration |