MX2021006462A - Aleacion de soldadura sin plomo, material de junta de soldadura, sustrato de montura de circuito electronico y dispositivo de control electronico. - Google Patents
Aleacion de soldadura sin plomo, material de junta de soldadura, sustrato de montura de circuito electronico y dispositivo de control electronico.Info
- Publication number
- MX2021006462A MX2021006462A MX2021006462A MX2021006462A MX2021006462A MX 2021006462 A MX2021006462 A MX 2021006462A MX 2021006462 A MX2021006462 A MX 2021006462A MX 2021006462 A MX2021006462 A MX 2021006462A MX 2021006462 A MX2021006462 A MX 2021006462A
- Authority
- MX
- Mexico
- Prior art keywords
- mass
- lead
- control device
- mounting board
- joining material
- Prior art date
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3512—Cracking
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Se proporciona una aleación de soldadura sin plomo que comprende el 2,0% en masa o más y el 4,0% en masa o menos de Ag, el 0,3% en masa o más y el 0,7% en masa o menos de Cu, el 1,2% en masa o más y el 2,0% en masa o menos de Bi, el 0,5% en masa o más y el 2,1% en masa o menos de In, el 3,0% en masa o más y el 4,0% en masa o menos de Sb, el 0,001% en masa o más y el 0,05% en masa o menos de Ni, el 0,001% en masa o más y el 0,01% en masa o menos de Co y el resto es Sn, de manera tal que se puedan presentar propiedades de resistencia a la fatiga térmica incluso en un ambiente con variaciones de temperatura muy severas, por ejemplo, desde -40°C hasta 175°C y que se pueda suprimir el avance de una grieta que aparece en la junta de soldadura incluso en un ambiente severo donde se cargan dichas variaciones de temperatura muy severas y vibraciones.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018240674A JP6731034B2 (ja) | 2018-12-25 | 2018-12-25 | 鉛フリーはんだ合金、はんだ接合用材料、電子回路実装基板及び電子制御装置 |
PCT/JP2019/048406 WO2020137535A1 (ja) | 2018-12-25 | 2019-12-11 | 鉛フリーはんだ合金、はんだ接合用材料、電子回路実装基板及び電子制御装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
MX2021006462A true MX2021006462A (es) | 2021-06-23 |
Family
ID=71127208
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2021006462A MX2021006462A (es) | 2018-12-25 | 2019-12-11 | Aleacion de soldadura sin plomo, material de junta de soldadura, sustrato de montura de circuito electronico y dispositivo de control electronico. |
Country Status (7)
Country | Link |
---|---|
US (1) | US11724341B2 (es) |
EP (1) | EP3903993A4 (es) |
JP (1) | JP6731034B2 (es) |
KR (1) | KR20210103389A (es) |
CN (1) | CN111801193A (es) |
MX (1) | MX2021006462A (es) |
WO (1) | WO2020137535A1 (es) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6912742B1 (ja) * | 2020-02-14 | 2021-08-04 | 千住金属工業株式会社 | 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、およびはんだ継手 |
CN113084393B (zh) * | 2021-04-21 | 2022-06-17 | 兰州理工大学 | 一种用于金属材料焊接的抗氧化助焊剂 |
CN113458650B (zh) * | 2021-07-05 | 2022-10-14 | 云南锡业锡材有限公司 | 一种Sn-Ag-Cu-Ce高可靠性无铅焊料 |
JP7161134B1 (ja) * | 2021-09-30 | 2022-10-26 | 千住金属工業株式会社 | はんだ合金、はんだボール、はんだプリフォーム、はんだペースト及びはんだ継手 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
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JP3027441B2 (ja) | 1991-07-08 | 2000-04-04 | 千住金属工業株式会社 | 高温はんだ |
JP3027441U (ja) | 1996-01-31 | 1996-08-09 | 正博 林 | 自動開き傘 |
JP3353662B2 (ja) | 1997-08-07 | 2002-12-03 | 富士電機株式会社 | はんだ合金 |
TW592872B (en) * | 2001-06-28 | 2004-06-21 | Senju Metal Industry Co | Lead-free solder alloy |
KR101265449B1 (ko) * | 2007-07-13 | 2013-05-16 | 센주긴조쿠고교 가부시키가이샤 | 차재 실장용 무납 땜납과 차재 전자 회로 |
JP4787384B1 (ja) * | 2010-10-29 | 2011-10-05 | ハリマ化成株式会社 | 低銀はんだ合金およびはんだペースト組成物 |
WO2014013632A1 (ja) * | 2012-07-19 | 2014-01-23 | ハリマ化成株式会社 | はんだ合金、ソルダペーストおよび電子回路基板 |
JP2015077601A (ja) * | 2013-04-02 | 2015-04-23 | 千住金属工業株式会社 | 鉛フリーはんだ合金 |
JP5816947B1 (ja) * | 2015-02-05 | 2015-11-18 | 株式会社弘輝 | フラックス用活性剤、フラックス及びはんだ |
CN106001978B (zh) * | 2015-03-24 | 2020-02-07 | 株式会社田村制作所 | 无铅软钎料合金、电子电路基板和电子控制装置 |
WO2016179358A1 (en) | 2015-05-05 | 2016-11-10 | Indium Corporation | High reliability lead-free solder alloys for harsh environment electronics applications |
JP6374424B2 (ja) * | 2016-03-08 | 2018-08-15 | 千住金属工業株式会社 | はんだ合金、はんだボール、チップソルダ、はんだペースト及びはんだ継手 |
EP3321025B1 (en) * | 2016-03-22 | 2020-11-25 | Tamura Corporation | Lead-free solder alloy, flux composition, solder paste composition, electronic circuit board and electronic control device |
US20180102464A1 (en) * | 2016-10-06 | 2018-04-12 | Alpha Assembly Solutions Inc. | Advanced Solder Alloys For Electronic Interconnects |
JP6230737B1 (ja) * | 2017-03-10 | 2017-11-15 | 株式会社タムラ製作所 | 鉛フリーはんだ合金、ソルダペースト及び電子回路基板 |
JP6275305B2 (ja) * | 2017-04-03 | 2018-02-07 | 株式会社タムラ製作所 | はんだ接合体の形成方法、並びに当該形成方法により形成されたはんだ接合体を有する電子回路基板および電子制御装置 |
CN112638574A (zh) * | 2018-08-31 | 2021-04-09 | 铟泰公司 | SnBi和SnIn焊锡合金 |
CN108994480A (zh) * | 2018-10-10 | 2018-12-14 | 云南锡业锡材有限公司 | 一种SnBiAgCu高可靠性无铅焊料合金 |
-
2018
- 2018-12-25 JP JP2018240674A patent/JP6731034B2/ja active Active
-
2019
- 2019-12-11 CN CN201980015760.0A patent/CN111801193A/zh active Pending
- 2019-12-11 KR KR1020207025190A patent/KR20210103389A/ko not_active Application Discontinuation
- 2019-12-11 WO PCT/JP2019/048406 patent/WO2020137535A1/ja unknown
- 2019-12-11 MX MX2021006462A patent/MX2021006462A/es unknown
- 2019-12-11 EP EP19905925.4A patent/EP3903993A4/en active Pending
-
2020
- 2020-09-16 US US17/022,090 patent/US11724341B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
EP3903993A1 (en) | 2021-11-03 |
KR20210103389A (ko) | 2021-08-23 |
EP3903993A4 (en) | 2022-09-07 |
US20210001433A1 (en) | 2021-01-07 |
WO2020137535A1 (ja) | 2020-07-02 |
JP6731034B2 (ja) | 2020-07-29 |
JP2020099933A (ja) | 2020-07-02 |
CN111801193A (zh) | 2020-10-20 |
US11724341B2 (en) | 2023-08-15 |
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