MX2015014908A - Material de sustrato para cinta adhesiva aislante resistente a la alta temperatura. - Google Patents

Material de sustrato para cinta adhesiva aislante resistente a la alta temperatura.

Info

Publication number
MX2015014908A
MX2015014908A MX2015014908A MX2015014908A MX2015014908A MX 2015014908 A MX2015014908 A MX 2015014908A MX 2015014908 A MX2015014908 A MX 2015014908A MX 2015014908 A MX2015014908 A MX 2015014908A MX 2015014908 A MX2015014908 A MX 2015014908A
Authority
MX
Mexico
Prior art keywords
substrate material
high temperature
adhesive tape
insulating adhesive
temperature resistant
Prior art date
Application number
MX2015014908A
Other languages
English (en)
Inventor
Vanessa Corre Arantes
Manuela Lima Queiroz De Andrade Kaneko
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of MX2015014908A publication Critical patent/MX2015014908A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J127/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers
    • C09J127/02—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J127/04—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers not modified by chemical after-treatment containing chlorine atoms
    • C09J127/06—Homopolymers or copolymers of vinyl chloride
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C08K3/26—Carbonates; Bicarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K3/2279—Oxides; Hydroxides of metals of antimony
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C08K5/098—Metal salts of carboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/12—Esters; Ether-esters of cyclic polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C08K5/134—Phenols containing ester groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1515—Three-membered rings
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/245—Vinyl resins, e.g. polyvinyl chloride [PVC]
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C08K3/26—Carbonates; Bicarbonates
    • C08K2003/265—Calcium, strontium or barium carbonate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
    • C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L27/04—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing chlorine atoms
    • C08L27/06—Homopolymers or copolymers of vinyl chloride
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/41—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the carrier layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2427/00—Presence of halogenated polymer
    • C09J2427/006—Presence of halogenated polymer in the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesive Tapes (AREA)
  • Organic Insulating Materials (AREA)
  • Insulating Bodies (AREA)

Abstract

Un material de sustrato para cintas adhesivas aislantes que es resistente a temperaturas de hasta aproximadamente 105 °C durante al menos 20,000 horas y está destinado, más específicamente, a preparar cintas aislantes que pueden usarse en varios tipos de aplicaciones, que incluyen aislar cables eléctricos. La invención se relaciona, además, a una composición de sustrato del material adhesivo aislante y al método para fabricarla.
MX2015014908A 2013-05-03 2014-04-29 Material de sustrato para cinta adhesiva aislante resistente a la alta temperatura. MX2015014908A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
BR102013011036-1A BR102013011036B1 (pt) 2013-05-03 2013-05-03 Material adesivo isolante resistente à alta temperatura; composição do substrato do dito material adesivo isolante resistente à alta temperatura
PCT/US2014/035791 WO2014179264A1 (en) 2013-05-03 2014-04-29 High temperature resistant insulating adhesive tape substrate material

Publications (1)

Publication Number Publication Date
MX2015014908A true MX2015014908A (es) 2016-03-07

Family

ID=50896520

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2015014908A MX2015014908A (es) 2013-05-03 2014-04-29 Material de sustrato para cinta adhesiva aislante resistente a la alta temperatura.

Country Status (9)

Country Link
US (1) US20160053139A1 (es)
EP (1) EP2992060B1 (es)
JP (1) JP6359085B2 (es)
CN (1) CN105209565B (es)
BR (1) BR102013011036B1 (es)
MX (1) MX2015014908A (es)
RU (1) RU2635622C2 (es)
TW (1) TW201500511A (es)
WO (1) WO2014179264A1 (es)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160289506A1 (en) * 2015-04-01 2016-10-06 Nitto Denko Corporation Pressure-sensitive adhesive tape
CN112500805A (zh) * 2016-02-03 2021-03-16 河北永乐胶带有限公司 一种新型耐高温聚氯乙烯胶带的制作方法
CN106398026A (zh) * 2016-08-30 2017-02-15 安徽盛装电子科技有限公司 一种防晒的pvc电气胶带基料及其压延成型方法
CA3062401A1 (en) 2017-05-12 2018-11-15 3M Innovative Properties Company Adhesive tapes
MX2019014700A (es) * 2017-06-09 2020-08-03 Denka Company Ltd Cinta adhesiva sensible a la presion.
CN107384232A (zh) * 2017-06-29 2017-11-24 万事达胶带（湖北）股份有限公司 环保型软质聚氯乙烯热熔压敏胶胶带及其制作方法
WO2019230067A1 (ja) * 2018-05-30 2019-12-05 デンカ株式会社 粘着テープ
CN108822756A (zh) * 2018-07-26 2018-11-16 赣州研顺飞科技有限公司 一种高韧性的绝缘胶带及其制备方法
CN111518302A (zh) * 2020-05-12 2020-08-11 浙江万叶绝缘材料有限公司 一种耐腐蚀老化的绝缘带生产配方及工艺
CN112430438A (zh) * 2020-11-17 2021-03-02 昆山东士隆电子材料有限公司 一种耐高温胶带及其使用耐高温胶粘剂
JPWO2022190808A1 (es) * 2021-03-08 2022-09-15
WO2023048053A1 (ja) * 2021-09-24 2023-03-30 デンカ株式会社 耐熱性に優れる粘着テープ
CN115572554A (zh) * 2022-10-09 2023-01-06 泰兴市川达塑业有限公司 一种抗拉性能好的耐高温胶带

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JPH10140118A (ja) * 1996-11-06 1998-05-26 Yazaki Corp 塩化ビニル樹脂テープ用粘着剤及び粘着剤用組成物
JPH11263952A (ja) * 1998-03-18 1999-09-28 Toyo Chem Co Ltd 粘着テープ
JP2000276953A (ja) * 1999-03-23 2000-10-06 Sumitomo Wiring Syst Ltd 被覆電線
JP3664429B2 (ja) * 1999-06-04 2005-06-29 矢崎総業株式会社 Ｐｖｃ粘着テープ
JP2001288319A (ja) * 2000-04-03 2001-10-16 Sumitomo Wiring Syst Ltd 塩化ビニル樹脂組成物およびその用途
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Also Published As

Publication number Publication date
RU2015145838A (ru) 2017-06-08
WO2014179264A1 (en) 2014-11-06
EP2992060B1 (en) 2020-07-01
BR102013011036B1 (pt) 2021-09-08
RU2635622C2 (ru) 2017-11-14
CN105209565B (zh) 2018-09-14
JP6359085B2 (ja) 2018-07-18
CN105209565A (zh) 2015-12-30
JP2016524632A (ja) 2016-08-18
TW201500511A (zh) 2015-01-01
BR102013011036A2 (pt) 2014-12-23
US20160053139A1 (en) 2016-02-25
EP2992060A1 (en) 2016-03-09

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