WO2012148218A3 - 수평열전 테이프 및 그 제조방법 - Google Patents
수평열전 테이프 및 그 제조방법 Download PDFInfo
- Publication number
- WO2012148218A3 WO2012148218A3 PCT/KR2012/003294 KR2012003294W WO2012148218A3 WO 2012148218 A3 WO2012148218 A3 WO 2012148218A3 KR 2012003294 W KR2012003294 W KR 2012003294W WO 2012148218 A3 WO2012148218 A3 WO 2012148218A3
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- WIPO (PCT)
- Prior art keywords
- thermoelectric tape
- horizontal thermoelectric
- heat dissipation
- manufacturing same
- horizontal
- Prior art date
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
- H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/255—Polyesters
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- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/28—Metal sheet
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/38—Cooling arrangements using the Peltier effect
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2217—Oxides; Hydroxides of metals of magnesium
- C08K2003/2224—Magnesium hydroxide
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/32—Phosphorus-containing compounds
- C08K2003/321—Phosphates
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/016—Flame-proofing or flame-retarding additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/163—Metal in the substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/266—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension of base or substrate
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
- Y10T428/2891—Adhesive compositions including addition polymer from unsaturated monomer including addition polymer from alpha-beta unsaturated carboxylic acid [e.g., acrylic acid, methacrylic acid, etc.] Or derivative thereof
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Organic Chemistry (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Thermal Sciences (AREA)
- Electromagnetism (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
본 발명은 수평열전 테이프 및 그 제조방법에 관한 것으로서, 보다 구체적으로는 전자기파를 효과적으로 차단하고 방열효과가 우수한 수평열전 테이프 및 그 제조방법에 관한 것이다. 본 발명에 따른 수평열전 테이프는 점착층과 방열층의 이층구조를 단일화하여 보다 효과적으로 방열 효과를 달성하며 그 제조 공정을 단순화 시켰으며, 또한 증착하지 않은 메탈포일을 전도성 기재부로 사용함에 따르 열전도도가 우수하고 불순물이 첨가되지 않은 전도성 기재부를 사용한 수평열전 테이프의 제공이 가능하다.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201280020564.0A CN103563505B (zh) | 2011-04-28 | 2012-04-27 | 水平热电胶带及其制备方法 |
US14/065,198 US8968867B2 (en) | 2011-04-28 | 2013-10-28 | Horizontal thermoelectric tape and method for manufacturing same |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2011-0040327 | 2011-04-28 | ||
KR20110040327 | 2011-04-28 | ||
KR10-2012-0044489 | 2012-04-27 | ||
KR1020120044489A KR101314169B1 (ko) | 2011-04-28 | 2012-04-27 | 수평열전 테이프 및 그 제조방법 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US14/065,198 Continuation US8968867B2 (en) | 2011-04-28 | 2013-10-28 | Horizontal thermoelectric tape and method for manufacturing same |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2012148218A2 WO2012148218A2 (ko) | 2012-11-01 |
WO2012148218A3 true WO2012148218A3 (ko) | 2013-01-17 |
Family
ID=47072941
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2012/003294 WO2012148218A2 (ko) | 2011-04-28 | 2012-04-27 | 수평열전 테이프 및 그 제조방법 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8968867B2 (ko) |
KR (1) | KR101314169B1 (ko) |
CN (1) | CN103563505B (ko) |
WO (1) | WO2012148218A2 (ko) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103694920A (zh) * | 2012-12-18 | 2014-04-02 | 斯迪克新型材料(江苏)有限公司 | 用于制备石墨导热胶粘带的制造方法 |
CN103694918A (zh) * | 2012-12-18 | 2014-04-02 | 斯迪克新型材料(江苏)有限公司 | 石墨导热胶粘带 |
CN103865414A (zh) * | 2012-12-18 | 2014-06-18 | 斯迪克新型材料(江苏)有限公司 | 散热型压敏胶带的制备工艺 |
CN103865413A (zh) * | 2012-12-18 | 2014-06-18 | 斯迪克新型材料(江苏)有限公司 | 电子器件用丙烯酸酯胶带 |
CN104152071B (zh) * | 2012-12-18 | 2016-04-27 | 苏州斯迪克新材料科技股份有限公司 | 用于高粘性胶带的制备方法 |
CN103059757B (zh) * | 2012-12-18 | 2014-06-04 | 苏州斯迪克新材料科技股份有限公司 | 用于散热的压敏胶带及其制备方法 |
CN103694919A (zh) * | 2012-12-18 | 2014-04-02 | 斯迪克新型材料(江苏)有限公司 | 电子产品用石墨散热胶带 |
CN103059760B (zh) * | 2012-12-18 | 2014-10-15 | 斯迪克新型材料(江苏)有限公司 | 具有散热功能的导热贴膜及其制造方法 |
KR101457914B1 (ko) * | 2014-03-05 | 2014-11-05 | 실리콘밸리(주) | 전자파 흡수층을 구비한 열 확산시트 및 그 제조방법 |
WO2017018999A1 (en) * | 2015-07-24 | 2017-02-02 | Hewlett-Packard Development Company, L.P. | Thermal radiation heat dissipation structure |
KR101870644B1 (ko) * | 2016-03-22 | 2018-06-25 | 주식회사 솔루에타 | 방열특성이 우수한 방열시트 및 이의 제조방법 |
JP6722488B2 (ja) * | 2016-03-30 | 2020-07-15 | 星和電機株式会社 | 難燃性放熱シートの製造方法 |
US11271348B1 (en) * | 2018-10-24 | 2022-03-08 | Amphenol Corporation | High performance electrical connector |
JP7080920B2 (ja) * | 2020-04-28 | 2022-06-06 | 星和電機株式会社 | 難燃性放熱シート |
CN114058288B (zh) * | 2021-12-10 | 2024-05-28 | 东莞澳中新材料科技股份有限公司 | 一种具有强粘接性能的散热胶带及其制备方法 |
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JP2001345593A (ja) * | 2000-05-31 | 2001-12-14 | Kitagawa Ind Co Ltd | Emiテープ,emiブロック,emi電線,及びemi筐体 |
KR20050019696A (ko) * | 2003-08-21 | 2005-03-03 | 주식회사 애드텍 | Pvc 지지체를 포함하는 감압형 다이싱용 점착제테이프의 제조방법 및 점착제 테이프 |
KR20090043633A (ko) * | 2007-10-30 | 2009-05-07 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 열전도성 점착제 및 이를 이용하는 점착테이프 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100700346B1 (ko) * | 2005-08-05 | 2007-03-29 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 기능성을 갖는 방열 점착테이프 |
US8653176B2 (en) * | 2006-12-26 | 2014-02-18 | Asahi Kasei E-Materials Corporation | Thermally conductive material and thermally conductive sheet molded from the thermally conductive material |
KR100774440B1 (ko) * | 2007-01-17 | 2007-11-08 | 조인셋 주식회사 | 전도성 점착테이프 |
TWI418603B (zh) * | 2007-03-16 | 2013-12-11 | Mitsubishi Gas Chemical Co | 光穿透型電磁波屏蔽積層體及其製造方法、光穿透型電波吸收體,以及接著劑組成物 |
WO2008116033A2 (en) * | 2007-03-21 | 2008-09-25 | Avery Dennison Corporation | Pressure sensitive adhesives |
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2012
- 2012-04-27 CN CN201280020564.0A patent/CN103563505B/zh active Active
- 2012-04-27 WO PCT/KR2012/003294 patent/WO2012148218A2/ko active Application Filing
- 2012-04-27 KR KR1020120044489A patent/KR101314169B1/ko active IP Right Grant
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2013
- 2013-10-28 US US14/065,198 patent/US8968867B2/en active Active
Patent Citations (3)
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JP2001345593A (ja) * | 2000-05-31 | 2001-12-14 | Kitagawa Ind Co Ltd | Emiテープ,emiブロック,emi電線,及びemi筐体 |
KR20050019696A (ko) * | 2003-08-21 | 2005-03-03 | 주식회사 애드텍 | Pvc 지지체를 포함하는 감압형 다이싱용 점착제테이프의 제조방법 및 점착제 테이프 |
KR20090043633A (ko) * | 2007-10-30 | 2009-05-07 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 열전도성 점착제 및 이를 이용하는 점착테이프 |
Also Published As
Publication number | Publication date |
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US8968867B2 (en) | 2015-03-03 |
US20140050916A1 (en) | 2014-02-20 |
KR101314169B1 (ko) | 2013-10-04 |
CN103563505A (zh) | 2014-02-05 |
CN103563505B (zh) | 2017-03-08 |
WO2012148218A2 (ko) | 2012-11-01 |
KR20120123645A (ko) | 2012-11-09 |
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