CN103563505A - 水平热电胶带及其制备方法 - Google Patents
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Abstract
本发明涉及水平热电胶带及其制备方法,具体地,涉及有效切断电磁波且散热效果优秀的水平热电胶带及其制备方法。本发明的水平热电胶带将粘结层和散热层的双层结构单一化,从而更有效地实现散热效果,简化了制备工序,并且,由于将未蒸镀的金属箔用作传导性基材部,能够提供热导率优秀且使用未添加杂质的传导性基材部的水平热电胶带。
Description
技术领域
本发明涉及一种水平热电胶带及其制备方法,具体地,涉及有效切断电磁波且散热效果优秀的水平热电胶带及其制备方法。
背景技术
一般,驱动电子产品的情况下,电子产品中包括的电子元件内部会产生热。如果不将所产生的上述热尽快迅速地向外部放出,热会对电子元件造成不良影响,从而产生电子元件不能执行本身功能的结果。具体地,因在电子元件产生的热量,而在电子元件周边的部件或者机器产生噪音和故障,因此可缩短电子产品的寿命。
尤其,随着电子产品趋于高性能化、高功能化及轻薄短小化,必然会带来电子元件的大容量化和高集成化,可以说,如何有效地将从这些电子产品的部件产生的热释放出去,是左右产品的性能和质量的核心要素。
以往,作为用于解决如上所述的问题的方案,采用散热扇(Fin fan)冷却方式、珀耳贴元件(Peltier)冷却方式、液体喷射(Water-jet)冷却方式、浸渍(Immersion)冷却方式、热管(Heat pipe)冷却方式等来除去从电子元件产生的热量,但是,需要符合超薄化且小型化的电子产品的当前趋势的电子元件的冷却装置和散热装置。
尤其,最近由于电子通信产业的发展,笔记本电脑、移动电话等的利用范围逐渐扩大,随着这些产品的超轻量化、超轻薄化趋势,偏好在这些产品附着散热胶带来除热的方式。
但是,作为现有技术的现有的散热胶带产品由于存在粘结层与散热层分离的问题,而存在散热效率降低且制备工序复杂的问题。并且,在制备作为现有技术的现有的散热胶带时,对传导性基材部进行蒸镀,因而存在热导率不优秀的问题。
发明内容
技术问题
本发明是为了解决上述问题而提出的,本发明的目的在于,提供屏蔽在特定设备和特定部位的电子元件产生的电磁波,并有效除去由此产生的热的散热效果和热导率优秀的水平热电胶带及其制备方法。
解决问题的手段
用于解决如上所述的问题的本发明的一特征的水平热电胶带,用于屏蔽从电子元件产生的电磁波,并向外部传递从上述电磁波产生的热量,上述水平热电胶带具有热导性,并包含:传导性基材部,厚度为70μm~120μm,并包含金属箔,上述金属由选自包含铝、铜箔或镍的组中的某一种以上形成;聚对苯二甲酸乙二醇酯(PET)层,其形成在上述传导性基材部的上表面;以及散热粘结层,其形成在上述传导性基材部的下表面。并且,特征在于,散热粘结层包含粘结剂和石墨填充剂来形成。并且,特征在于,上述石墨填充剂的直径为5μm~15μm。并且,其特征在于,相对于100重量份的粘结剂,包含10重量份~15重量份的上述石墨填充剂。并且,特征在于,上述散热粘结层还包含阻燃剂和固化剂。并且,特征在于,上述阻燃剂选自包含氢氧化铝(Al(OH)3)、氢氧化镁(Mg(OH)2)或磷系阻燃剂的组中的某一种以上。并且,特征在于,上述固化剂选自包含异氰、胺或环氧固化剂的组中的某一种以上。
本发明的再一特征的水平热电胶带的制备方法包括以下步骤:在上表面附着有聚对苯二甲酸乙二醇酯的传导性基材部的下表面涂敷散热粘结剂的步骤,其中,上述传导性基材部的厚度为70μm~120μm,并包含由选自包含铝、铜箔或镍的组中的某一种以上的金属形成的金属箔;以及在所涂敷的上述散热粘结剂的另一面结合离型膜的步骤。并且,特征在于,添加粘结剂和石墨填充剂之后进行搅拌来制备出上述散热粘结剂。并且,上述石墨填充剂的直径为5μm~15μm。并且,相对于100重量份的粘结剂,包含10μm~15重量份的上述石墨填充剂。并且,其特征在于,上述散热粘结剂还包含阻燃剂和固化剂。并且,特征在于,上述阻燃剂是选自包含氢氧化铝、氢氧化镁或磷系阻燃剂的组中的某一种以上。并且,特征在于,上述固化剂是选自包含异氰、胺或环氧固化剂的组中的某一种以上。
发明的效果
本发明的水平热电胶带及其制备方法,其特征在于,有效传递在电子元件产生的热并除去,并具有电磁波屏蔽效能。具体地,简化现有水平热电胶带的粘结层和散热层的双层结构,将散热粘结剂直接涂敷于传导性基材,能够提高散热效率,并简化制备工序。并且,由于使用未蒸镀的传导性基材部来制备水平热电胶带,从而能够制备出热导率更加优秀的水平热电胶带。
附图说明
图1是表示本发明的水平热电胶带的剖面的图。
图2是反映出测定本发明的水平热电胶带的电磁波屏蔽效能的实验结果的曲线图。
具体实施方式
由此,本发明的发明人为了克服上述现有技术的问题而努力的结果确认到,可以制备出将水平热电胶带的粘结剂和散热层的双层结构简化成单层来提高散热效率且具有电磁波屏蔽功能的水平热电胶带,并且可以制备出由于未对传导性基材部进行蒸镀因而热导率更加优秀的水平热电胶带,由此完成了本发明。
具体地,本发明的水平热电胶带,用于屏蔽从电子元件产生的电磁波,并向外部传递从上述电磁波产生的热量,上述水平热电胶带具有热导性,上述水平热电胶带可以包含:传导性基材部,厚度为70μm~120μm,并包含金属箔,上述金属由选自包含铝、铜箔或镍的组中的某一种以上形成;聚对苯二甲酸乙二醇酯层,形成于上述传导性基材部的上表面;以及散热粘结层,其形成于上述传导性基材部的下表面。
上述传导性基材部的厚度优选为70μm~120μm,在上述传导性基材部的厚度为70μm以下的情况下,热导率会降低,在上述传导性基材部的厚度为120μm以上的情况下,由于过厚而难以期待最终产品的薄型化。并且,优选地,上述传导性基材部包含金属箔,上述金属优选为选自包含铝、铜箔或镍的组中的某一种以上的金属。包含上述铝、铜箔或镍的组中的某一种以上的金属可以不另行蒸镀来形成传导性基材部,从而能够更加提高热导率,与进行蒸镀的情况相比,具有可以形成没有受到损伤且未添加杂质的传导性基材部的效果。
并且,优选地,上述散热粘结层包含粘结剂和散热粉末。优选地,上述粘结剂可以由丙烯酸类粘结剂或硅酮类粘结剂形成。上述散热粘结层中散热粉末只要是赋予散热效果的物质并不受特别的限制,但是优选地包含氧化铝、上述石墨填充剂,更优选地使用石墨填充剂。在使用上述石墨作为散热粉末的情况下,因散热胶带的表面平滑,而外观好,并且因平滑的表面而能够防止散热胶带本身的损伤。并且,包含石墨作为散热粉末的情况下,由于防止散热粘结层与传导性基材部之间的剥离,从而能够提供粘结性能更加提高的水平热电胶带。并且,能够提供即使有外力作用也能够保持优秀的粘结性能的水平热电胶带。并且,上述石墨填充剂的大小并没有特别的限制,但其直径优选为5μm~15μm。在上述直径为5μm以下的情况下,可能会降低散热效果,而如果其大小为15μm以上,表面可能会变得粗糙(参照下述实施例4)。并且,相对于100重量份的粘结剂,上述石墨填充剂优选为10重量份~15重量份。如果添加10重量份以下的上述石墨填充剂,则热导率会降低,而如果添加15重量份以上,则粘结力会降低(参照实施例4)。
并且,优选地,上述散热粘结层还可以包含阻燃剂和固化剂。上述阻燃剂也称为难燃剂,用于防止散热粘结层的燃烧且在燃烧时防止有害气体的产生,优选地可以选自包含氢氧化铝、氢氧化镁或磷系阻燃剂的组中的某一种以上。并且,上述固化剂用于提高散热粘结层的硬度,优选地可以选自包含异氰、胺或环氧固化剂的组中的某一种以上。
本发明的再一特征的水平热电胶带的制备方法包括以下步骤:在上表面附着有聚对苯二甲酸乙二醇酯的传导性基材部的下表面涂敷散热粘结剂的步骤,其中,上述传导性基材部的厚度为70μm~120μm,并包含由选自包含铝、铜箔或镍的组中的某一种以上的金属形成的金属箔;以及在所涂敷的上述散热粘结剂的另一面结合离型膜的步骤。
上述传导性基材部中包含的金属箔的厚度优选为70μm~120μm,在上述厚度为70μm以下的情况下,热导率会降低,而厚度为120μm以上的情况下,由于过厚而难以期待最终产品的薄型化。并且,优选地,上述传导性基材部包含金属箔,上述金属优选为选自包含铝、铜箔或镍的组中的某一种以上的金属。包含上述铝、铜箔或镍的组中的某一种以上的金属由于可以不另行蒸镀来形成传导性基材部,从而能够更加提高热导率,与进行蒸镀的情况相比,具有可以形成没有受到损伤且未添加杂质的传导性基材部的效果。并且,可以通过添加粘结剂和散热粉末之后进行搅拌来制备上述散热粘结剂。优选地,上述粘结剂可以由丙烯酸类粘结剂或硅酮类粘结剂形成。并且,优选地,上述散热粉末可以是选自包含石墨填充剂、氧化铝、陶瓷或碳纳米管的组中的某一种以上,更优选地,可以由石墨填充剂形成。并且,上述石墨填充剂的大小不受特别的限制,但其直径优选为5μm~15μm。上述直径为5μm以下的情况下,可能会降低散热效果,而如果其大小为15μm以上,表面可能会变得粗糙(参照下述实施例4)。并且,相对于100重量份的粘结剂,上述石墨填充剂优选为10重量份~15重量份。如果添加10重量份以下的石墨填充剂,则降低热导率,而如果添加15重量份以上,则粘结力会降低(参照实施例4)。
并且,优选地,上述散热粘结层还可以包含阻燃剂和固化剂。上述阻燃剂也称为难燃剂,用于防止散热粘结层的燃烧且在燃烧时防止有害气体的产生,优选地可以是选自包含氢氧化铝、氢氧化镁或磷系阻燃剂的组中的某一种以上。并且,上述固化剂用于提高散热粘结层的硬度而包含,优选地可以是选自包含异氰、胺或环氧固化剂的组中的某一种以上。
以下,参照本发明优选的实施例进行详细说明,以使本发明所属技术领域的普通技术人员能够容易实施。但是本发明可以由各种不同的方式实施,不局限于在这说明的实施例。
用于实施发明的方式
实施例
实施例1:将金属箔用作传导性基材部
混合固体成分为45%的丙烯酸类粘结剂与作为散热粉末的直径为5μm~15μm的石墨填充剂,混合量为,相对于100重量份的丙烯酸类粘结剂,石墨填充剂为11.1重量份,之后通过高速搅拌机均匀地分散30分钟~60分钟程度。搅拌时添加了阻燃剂和固化剂,作为阻燃剂添加了氢氧化铝,作为固化剂添加了胺类固化剂。接着,为了进行脱泡,在约20℃~30℃程度的常温下进行约30分钟~60分钟的稳定化,由此制备出散热粘结剂。
传导性基材部未进行蒸镀,且作为厚度为100μm的金属箔使用了铝产品(Metal foil三和,韩华铝产品)。然后,在上述传导性基材部的上层附着了聚对苯二甲酸乙二醇酯。
接着,利用逗号式涂布机(comma coater)在上述传导性基材部涂敷了上述散热粘结剂。此时,由于干燥后溶剂部分的蒸发,涂敷厚度会减少,因此在所需厚度的基础上加厚40%以上涂敷。接着,在40℃~60℃的温度下,在稳定化腔室(Chamber)放置熟化24小时进行时效处理,来使散热粘结部的高分子稳定化。接着,为了可以将这样的水平热电胶带粘贴于粘附物来使用,而结合了离型膜。因而,有关水平热电胶带的最终产品的厚度,散热粘结剂的厚度为35μm、传导性基材部的厚度为100μm、聚对苯二甲酸乙二醇酯涂敷层包含结合层为15μm,总厚度为150μm。下图1是表示根据本实施例1来制备的传导性基材部的上表面形成有聚对苯二甲酸乙二醇酯层且传导性基材部的下表面形成有散热粘结层的水平热电胶带的图。在下图1中,附图标记100表示聚对苯二甲酸乙二醇酯层,附图标记200表示包含金属箔的传导性基材部,附图标记300表示散热粘结层。
实施例2:作为散热粉末使用氧化铝
除了使用氧化铝作为散热粉末以外,以与上述实施例1相同的方法制备出水平热电胶带。
实施例3:相对于100重量份的丙烯酸粘结剂,混合8.8重量份的石墨填充剂
除了相对于100重量份的丙烯酸类粘结剂,混合8.8重量份的上述石墨填充剂以外,以与上述实施例1相同的方法制备出水平热电胶带。
实施例4:相对于100重量份的丙烯酸粘结剂,混合16.6重量份的石墨填充剂
除了相对于100重量份的丙烯酸类粘结剂,混合16.6重量份的上述石墨填充剂以外,以与上述实施例1相同的方法制备出水平热电胶带。
比较例
比较例1:使用蒸镀的传导性基材部
对厚度为100μm的铝产品,在真空状态下以70℃的温度供给蒸气,蒸镀速度为1.6m/min,作为传导性基材部,蒸镀后厚度为1μm~1.5μm,除此之外以与上述实施例1相同的方法制备出水平热电胶带。
比较例2:金属箔的厚度为50μm的情况
作为金属箔,上述铝的厚度为50μm,除此之外以与上述实施例1相同的方法制备了水平热电胶带。
实验例
实验例1:实施例1和比较例1的热导率测定
未蒸镀传导性基材部且使用铝作为金属箔的实施例1和使用蒸镀的传导性基材部的比较例1的情况下,委托外部机关(韩国科学技术院)进行了测定热导率的实验。作为测定方法采用的是激光闪光法。并且,作为测定设备采用了耐驰公司(NETZSCH)的激光导热仪(LFA)。测定结果表示在以下表1。
表1
区分 | 热导率(W/mK) |
实施例1 | 100 |
比较例1 | 0.7 |
可由上表1确认,使用经蒸镀过程的传导性基材部来制备水平热电胶带的比较例1的情况,与未蒸镀的本发明的实施例1的情况相比,热导率显著降低。这表示如实施例1一样使用未蒸镀的传导性基材部的情况相比如比较例1一样使用蒸镀的传导性基材部的情况,热导率更加优秀。
实验例2:基于散热粉末的种类的热导率测定
基于使用石墨填充剂作为散热粉末的实施例1和使用氧化铝作为散热粉末的实施例2,进行了测定热导率的实验。实验方法委托亚洲大学共同设备中心来进行,其余以与实验例1相同的方法执行。该结果表示在以下表2。
表2
区分 | 热导率(W/mK) | 粘结力(gf/25mm) |
实施例1 | 100 | 1600~1700 |
实施例2 | 79 | 1400~1500 |
可由上表2确认,使用石墨填充剂作为散热粉末的实施例1的情况相比使用氧化铝作为散热粉末的实施例2的情况,热导率更加优秀。并且,可确认到,使用石墨填充剂的实施例1的情况相比使用氧化铝的实施例2的情况,粘结力也更加优秀。
实验例3:基于石墨填充剂含量的热导率和粘结力的测定
基于实施例1、实施例3及实施例4,测定了基于石墨填充剂含量变化的热导率的变化。实验方法以与上述实验例1相同的方法执行。其结果表示在以下表3。
表3
区分 | 热导率(W/mK) | 粘结力(gf/25mm) |
实施例1 | 100 | 1600~1700 |
实施例3 | 88 | 1700~1800 |
实施例4 | 111 | 800~900 |
可由上表3确认,实施例3的情况相比实施例1的情况,虽然提高了粘结力,但是降低了热导率,实施例4的情况虽然提高了热导率但是降低了粘结力。因此,上述实施例1的情况作为可以同时达到优秀的热导率和粘结力的情况,是最为优选的情况。
实验例4:基于金属箔的厚度变化的热导率测定
基于作为金属箔的铝的厚度为100μm的实施例1和厚度为50μm的比较例2,以与实验例1相同的方法测定了热导率。其结果表示在以下表4。
表4
区分 | 热导率(W/mK) |
实施例1 | 100 |
实施例2 | 58.836 |
可由上表4确认,在热导率方面,厚度为50μm的比较例2的情况相比实施例1,其热导率明显低。
实验例5:电磁波屏蔽实验
基于将作为未蒸镀的金属箔的铝作为传导性基材部,使用石墨填充剂作为散热粉末,相对于丙烯酸粘结剂,包含11.1重量份的石墨填充剂的上述实施例1,进行了测定电磁波屏蔽效能的实验。本实验是委托韩国电磁波研究院进行的,且利用电磁波屏蔽标准[KSC0304]方式进行了测定。作为测定设备采用的是网络频谱阻抗分析仪(NetworkSpectrum Impedance Anavlzer,模型名称:4396B,制造商:安捷伦公司(Agilent),测定范围:0.1kHz~1.8GHz)和屏蔽效能测试治具(Shielding Effectiveness test Fixture,模型名称:EM-2107A,制造商:电光度量公司(Electo-MetricsCo.Ltd),测定范围:30MHz~1500MHz)。其结果表示在以下图2。
如图2所示,本发明的实施例1的情况下电磁波屏蔽功能接近70dB。
以上,说明了本发明优选的实施例,但本发明不局限于此,在本发明技术思想范围内,能够变形成各种方式来实施,这也当然属于本发明要求保护的技术范围内。
Claims (14)
1.一种水平热电胶带,用于屏蔽从电子元件产生的电磁波,并向外部传递从上述电磁波产生的热量,上述水平热电胶带具有热导性,其特征在于,包含:
(a)传导性基材部,厚度为70μm~120μm,并包含金属箔,上述金属由选自包含铝、铜箔或镍的组中的一种以上形成;
(b)聚对苯二甲酸乙二醇酯层,形成在上述传导性基材部的上表面;以及
(c)散热粘结层,形成在上述传导性基材部的下表面。
2.根据权利要求1所述的水平热电胶带,其特征在于,上述散热粘结层包含粘结剂和石墨填充剂。
3.根据权利要求2所述的水平热电胶带,其特征在于,上述石墨填充剂的直径为5μm~15μm。
4.根据权利要求2所述的水平热电胶带,其特征在于,相对于100重量份的粘结剂,上述石墨填充剂为10重量份~15重量份。
5.根据权利要求2所述的水平热电胶带,其特征在于,上述散热粘结层还包含阻燃剂和固化剂。
6.根据权利要求5所述的水平热电胶带,其特征在于,上述阻燃剂选自包含氢氧化铝、氢氧化镁或磷系阻燃剂的组中的一种以上。
7.根据权利要求5所述的水平热电胶带,其特征在于,上述固化剂选自包含异氰、胺或环氧固化剂的组中的一种以上。
8.一种水平热电胶带的制备方法,其特征在于,包括以下步骤:
在上表面附着有聚对苯二甲酸乙二醇酯的传导性基材部的下表面涂敷散热粘结剂的步骤,其中,上述传导性基材部的厚度为70μm~120μm,并包含由选自包含铝、铜箔、或镍的组中的一种以上的金属形成的金属箔;以及
在所涂敷的上述散热粘结剂的另一面结合离型膜的步骤。
9.根据权利要求8所述的水平热电胶带的制备方法,其特征在于,添加粘结剂和石墨填充剂之后进行搅拌,来制备出上述散热粘结剂。
10.根据权利要求9所述的水平热电胶带的制备方法,其特征在于,上述石墨填充剂的直径为5μm~15μm。
11.根据权利要求9所述的水平热电胶带的制备方法,其特征在于,相对于100重量份的粘结剂,上述石墨填充剂为10重量份~15重量份。
12.根据权利要求9所述的水平热电胶带的制备方法,其特征在于,上述散热粘结剂还包含阻燃剂和固化剂。
13.根据权利要求12所述的水平热电胶带的制备方法,其特征在于,上述阻燃剂选自包含氢氧化铝、氢氧化镁或磷系阻燃剂的组中的一种以上。
14.根据权利要求12所述的水平热电胶带的制备方法,其特征在于,上述固化剂选自包含异氰、胺或环氧固化剂的组中的一种以上。
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---|---|---|---|---|
CN114058288A (zh) * | 2021-12-10 | 2022-02-18 | 东莞澳中新材料科技股份有限公司 | 一种具有强粘接性能的散热胶带及其制备方法 |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
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CN103059760B (zh) * | 2012-12-18 | 2014-10-15 | 斯迪克新型材料(江苏)有限公司 | 具有散热功能的导热贴膜及其制造方法 |
CN103694918A (zh) * | 2012-12-18 | 2014-04-02 | 斯迪克新型材料(江苏)有限公司 | 石墨导热胶粘带 |
CN103865414A (zh) * | 2012-12-18 | 2014-06-18 | 斯迪克新型材料(江苏)有限公司 | 散热型压敏胶带的制备工艺 |
CN103865413A (zh) * | 2012-12-18 | 2014-06-18 | 斯迪克新型材料(江苏)有限公司 | 电子器件用丙烯酸酯胶带 |
CN103694920A (zh) * | 2012-12-18 | 2014-04-02 | 斯迪克新型材料(江苏)有限公司 | 用于制备石墨导热胶粘带的制造方法 |
CN103694919A (zh) * | 2012-12-18 | 2014-04-02 | 斯迪克新型材料(江苏)有限公司 | 电子产品用石墨散热胶带 |
CN103911084B (zh) * | 2012-12-18 | 2016-03-02 | 苏州斯迪克新材料科技股份有限公司 | 丙烯酸酯胶带 |
CN103059757B (zh) * | 2012-12-18 | 2014-06-04 | 苏州斯迪克新材料科技股份有限公司 | 用于散热的压敏胶带及其制备方法 |
KR101457914B1 (ko) * | 2014-03-05 | 2014-11-05 | 실리콘밸리(주) | 전자파 흡수층을 구비한 열 확산시트 및 그 제조방법 |
WO2017018999A1 (en) * | 2015-07-24 | 2017-02-02 | Hewlett-Packard Development Company, L.P. | Thermal radiation heat dissipation structure |
KR101870644B1 (ko) * | 2016-03-22 | 2018-06-25 | 주식회사 솔루에타 | 방열특성이 우수한 방열시트 및 이의 제조방법 |
JP6722488B2 (ja) * | 2016-03-30 | 2020-07-15 | 星和電機株式会社 | 難燃性放熱シートの製造方法 |
US11271348B1 (en) * | 2018-10-24 | 2022-03-08 | Amphenol Corporation | High performance electrical connector |
JP7080920B2 (ja) * | 2020-04-28 | 2022-06-06 | 星和電機株式会社 | 難燃性放熱シート |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001345593A (ja) * | 2000-05-31 | 2001-12-14 | Kitagawa Ind Co Ltd | Emiテープ,emiブロック,emi電線,及びemi筐体 |
KR20050019696A (ko) * | 2003-08-21 | 2005-03-03 | 주식회사 애드텍 | Pvc 지지체를 포함하는 감압형 다이싱용 점착제테이프의 제조방법 및 점착제 테이프 |
CN101225284A (zh) * | 2007-01-17 | 2008-07-23 | 卓英社有限公司 | 传导压敏胶带 |
CN101243151A (zh) * | 2005-08-05 | 2008-08-13 | 3M创新有限公司 | 具有改善功能的传热粘合带 |
KR20090043633A (ko) * | 2007-10-30 | 2009-05-07 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 열전도성 점착제 및 이를 이용하는 점착테이프 |
US20100120931A1 (en) * | 2007-03-21 | 2010-05-13 | Avery Dennison Corporation | Pressure sensitive adhesives |
US20100147578A1 (en) * | 2007-03-16 | 2010-06-17 | Takatoshi Matsumura | Light-transmitting electromagnetic-shielding laminate and method for producing the same, light-transmitting radio wave absorber, and adhesive composition |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008084512A1 (ja) * | 2006-12-26 | 2008-07-17 | Asahi Kasei E-Materials Corporation | 放熱材料及び放熱材料で成形した放熱シート |
-
2012
- 2012-04-27 CN CN201280020564.0A patent/CN103563505B/zh active Active
- 2012-04-27 KR KR1020120044489A patent/KR101314169B1/ko active IP Right Grant
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2013
- 2013-10-28 US US14/065,198 patent/US8968867B2/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001345593A (ja) * | 2000-05-31 | 2001-12-14 | Kitagawa Ind Co Ltd | Emiテープ,emiブロック,emi電線,及びemi筐体 |
KR20050019696A (ko) * | 2003-08-21 | 2005-03-03 | 주식회사 애드텍 | Pvc 지지체를 포함하는 감압형 다이싱용 점착제테이프의 제조방법 및 점착제 테이프 |
CN101243151A (zh) * | 2005-08-05 | 2008-08-13 | 3M创新有限公司 | 具有改善功能的传热粘合带 |
CN101225284A (zh) * | 2007-01-17 | 2008-07-23 | 卓英社有限公司 | 传导压敏胶带 |
US20100147578A1 (en) * | 2007-03-16 | 2010-06-17 | Takatoshi Matsumura | Light-transmitting electromagnetic-shielding laminate and method for producing the same, light-transmitting radio wave absorber, and adhesive composition |
US20100120931A1 (en) * | 2007-03-21 | 2010-05-13 | Avery Dennison Corporation | Pressure sensitive adhesives |
KR20090043633A (ko) * | 2007-10-30 | 2009-05-07 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 열전도성 점착제 및 이를 이용하는 점착테이프 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114058288A (zh) * | 2021-12-10 | 2022-02-18 | 东莞澳中新材料科技股份有限公司 | 一种具有强粘接性能的散热胶带及其制备方法 |
CN114058288B (zh) * | 2021-12-10 | 2024-05-28 | 东莞澳中新材料科技股份有限公司 | 一种具有强粘接性能的散热胶带及其制备方法 |
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KR101314169B1 (ko) | 2013-10-04 |
WO2012148218A2 (ko) | 2012-11-01 |
US8968867B2 (en) | 2015-03-03 |
WO2012148218A3 (ko) | 2013-01-17 |
US20140050916A1 (en) | 2014-02-20 |
KR20120123645A (ko) | 2012-11-09 |
CN103563505B (zh) | 2017-03-08 |
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