PH12015502793A1 - Composition for copper film formation and copper film production method using same - Google Patents

Composition for copper film formation and copper film production method using same

Info

Publication number
PH12015502793A1
PH12015502793A1 PH12015502793A PH12015502793A PH12015502793A1 PH 12015502793 A1 PH12015502793 A1 PH 12015502793A1 PH 12015502793 A PH12015502793 A PH 12015502793A PH 12015502793 A PH12015502793 A PH 12015502793A PH 12015502793 A1 PH12015502793 A1 PH 12015502793A1
Authority
PH
Philippines
Prior art keywords
copper film
composition
film formation
mol
same
Prior art date
Application number
PH12015502793A
Inventor
Abe Tetsuji
Saito Kazuya
Original Assignee
Adeka Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adeka Corp filed Critical Adeka Corp
Publication of PH12015502793A1 publication Critical patent/PH12015502793A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material

Abstract

Provided is a composition for copper film formation that: contains 0.1-3.0 mol/kg of a copper formate or a hydrate thereof, a diol compound that is represented by formula (1), and a piperidine compound that is represented by formula (2); and that has a diol compound content in the range of 0.1-6.0 mol/kg and a piperidine compound content in the range of 0.1-6.0 mol/kg when the content of the copper formate or the hydrate thereof is 1 mol/kg. The composition for copper film formation is in a solution state that does not contain any solid phases such as fine particles, and makes it possible to obtain a copper film having sufficient conductivity by applying said composition on a substrate and heating at a temperature of less than 200 oC.
PH12015502793A 2013-07-25 2015-12-16 Composition for copper film formation and copper film production method using same PH12015502793A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013154522A JP6156991B2 (en) 2013-07-25 2013-07-25 Composition for forming copper film and method for producing copper film using the same
PCT/JP2014/069150 WO2015012209A1 (en) 2013-07-25 2014-07-18 Composition for copper film formation and copper film production method using same

Publications (1)

Publication Number Publication Date
PH12015502793A1 true PH12015502793A1 (en) 2016-03-21

Family

ID=52393250

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12015502793A PH12015502793A1 (en) 2013-07-25 2015-12-16 Composition for copper film formation and copper film production method using same

Country Status (6)

Country Link
JP (1) JP6156991B2 (en)
KR (1) KR101734789B1 (en)
CN (1) CN105408517B (en)
PH (1) PH12015502793A1 (en)
TW (1) TWI602947B (en)
WO (1) WO2015012209A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6387280B2 (en) * 2014-10-03 2018-09-05 株式会社Adeka Composition for forming copper film and method for producing copper film using the same
WO2016197234A1 (en) * 2015-06-11 2016-12-15 National Research Council Of Canada Preparation of high conductivity copper films
JP6884470B2 (en) * 2017-06-26 2021-06-09 東ソー株式会社 Conductive copper ink composition
TW201920515A (en) * 2017-08-01 2019-06-01 加拿大國家研究委員會 Copper ink
KR20200101386A (en) * 2017-12-22 2020-08-27 내션얼 리서치 카운슬 오브 캐나다 Copper ink for highly conductive fine prints
KR20210131166A (en) 2020-04-23 2021-11-02 엘지전자 주식회사 Fan Motor
KR20210133008A (en) 2020-04-28 2021-11-05 엘지전자 주식회사 Fan Motor
KR20210133544A (en) 2020-04-29 2021-11-08 엘지전자 주식회사 Fan Motor

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01168866A (en) 1987-12-24 1989-07-04 Mitsubishi Gas Chem Co Inc Production of article coated with copper film
JPH01168868A (en) 1987-12-24 1989-07-04 Mitsubishi Gas Chem Co Inc Production of article coated with copper film
JPH01168867A (en) 1987-12-24 1989-07-04 Mitsubishi Gas Chem Co Inc Production of article coated with copper film
JPH01168865A (en) 1987-12-24 1989-07-04 Mitsubishi Gas Chem Co Inc Production of article coated with copper film
WO1998050601A1 (en) * 1997-04-30 1998-11-12 Takamatsu Research Laboratory Metal paste and method for production of metal film
JP4852272B2 (en) 2005-07-25 2012-01-11 ナミックス株式会社 Metal paste
JP2008205430A (en) 2007-01-26 2008-09-04 Konica Minolta Holdings Inc Method of forming metallic pattern and metal salt mixture
JP2009256218A (en) 2008-04-14 2009-11-05 Toray Ind Inc Copper precursor composition, and method of preparing copper film using the same
JP2010242118A (en) 2009-04-01 2010-10-28 Adeka Corp Composition for forming copper thin film, and method for manufacturing copper thin film using the composition
JP5620795B2 (en) * 2010-11-26 2014-11-05 株式会社Adeka Composition for forming copper film and method for producing copper film using the composition
US8454815B2 (en) * 2011-10-24 2013-06-04 Rohm And Haas Electronics Materials Llc Plating bath and method

Also Published As

Publication number Publication date
JP2015025157A (en) 2015-02-05
KR101734789B1 (en) 2017-05-11
CN105408517A (en) 2016-03-16
TW201510273A (en) 2015-03-16
JP6156991B2 (en) 2017-07-05
KR20160027174A (en) 2016-03-09
CN105408517B (en) 2017-08-25
WO2015012209A1 (en) 2015-01-29
TWI602947B (en) 2017-10-21

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