MX2010012006A - Aparato y metodo para establecer un patron conductor en un sustrato aislante plano, sustrato aislante plano y un conjunto de chips del mismo. - Google Patents
Aparato y metodo para establecer un patron conductor en un sustrato aislante plano, sustrato aislante plano y un conjunto de chips del mismo.Info
- Publication number
- MX2010012006A MX2010012006A MX2010012006A MX2010012006A MX2010012006A MX 2010012006 A MX2010012006 A MX 2010012006A MX 2010012006 A MX2010012006 A MX 2010012006A MX 2010012006 A MX2010012006 A MX 2010012006A MX 2010012006 A MX2010012006 A MX 2010012006A
- Authority
- MX
- Mexico
- Prior art keywords
- insulating substrate
- planar insulating
- conductive particles
- chipset
- establishing
- Prior art date
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
- C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
- C23C24/10—Coating starting from inorganic powder by application of heat or pressure and heat with intermediate formation of a liquid phase in the layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1266—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by electrographic or magnetographic printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0517—Electrographic patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0522—Using an adhesive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
- Y10T428/24322—Composite web or sheet
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
- Y10T428/24521—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness with component conforming to contour of nonplanar surface
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/256—Heavy metal or aluminum or compound thereof
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Conductive Materials (AREA)
- Powder Metallurgy (AREA)
Abstract
Se han presentado un aparato, un método, un sustrato aislante plano y un conjunto de chips, que comprenden al menos un módulo configurado para establecer un patrón predefinido en un sustrato aislante, plano de modo que las partículas conductoras puedan congregarse de acuerdo al patrón predefinido. Al menos otro módulo se configura para transferir las partículas conductoras al sustrato aislante, plano, en donde las partículas conductoras se arreglan para congregarse de acuerdo al patrón predefinido. Se configura un módulo de sinterización para fusionar las partículas conductoras en el sustrato aislante, plano, en donde las partículas conductoras se arreglan para fusionarse de acuerdo al patrón predefinido para establecer un plano conductor en el sustrato aislante, plano. La modalidad de la invención se refiere a componentes electrónicos imprimibles o de impresión en una trama fibrosa.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/FI2008/050256 WO2009135985A1 (en) | 2008-05-09 | 2008-05-09 | An apparatus, a method for establishing a conductive pattern on a planar insulating substrate, the planar insulating substrate and a chipset thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
MX2010012006A true MX2010012006A (es) | 2011-03-29 |
Family
ID=41264470
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2010012006A MX2010012006A (es) | 2008-05-09 | 2008-05-09 | Aparato y metodo para establecer un patron conductor en un sustrato aislante plano, sustrato aislante plano y un conjunto de chips del mismo. |
Country Status (12)
Country | Link |
---|---|
US (1) | US8654502B2 (es) |
EP (1) | EP2298045B1 (es) |
JP (1) | JP2011520279A (es) |
KR (2) | KR20150063596A (es) |
CN (1) | CN102017818B (es) |
AU (1) | AU2008356134B2 (es) |
BR (1) | BRPI0822649B8 (es) |
CA (1) | CA2723886C (es) |
ES (1) | ES2768251T3 (es) |
MX (1) | MX2010012006A (es) |
RU (1) | RU2478264C2 (es) |
WO (1) | WO2009135985A1 (es) |
Families Citing this family (18)
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EP2585378B1 (en) * | 2010-06-22 | 2019-08-07 | Stora Enso Oyj | Fiber or plastic based packing, apparatus, method, program and system for wireless data communication by fiber or plastic based packing |
AU2010362421B2 (en) | 2010-10-14 | 2015-06-25 | Digital Tags Finland Oy | Method and arrangement for attaching a chip to a printed conductive surface |
US9227220B1 (en) * | 2011-11-23 | 2016-01-05 | I-Blades, Inc. | Method for patterning materials on a substrate |
FI126151B (en) * | 2012-01-30 | 2016-07-15 | Stora Enso Oyj | Method and apparatus for producing an electrically conductive figure on a surface |
TWI611741B (zh) * | 2013-11-01 | 2018-01-11 | 片片堅俄亥俄州工業公司 | 轉移導電材料的方法 |
CN106063041B (zh) * | 2014-01-27 | 2019-01-08 | 富士胶片株式会社 | 微细结构体、多层配线基板、半导体封装及微细结构体的制造方法 |
US10593562B2 (en) | 2015-04-02 | 2020-03-17 | Samtec, Inc. | Method for creating through-connected vias and conductors on a substrate |
US9691634B2 (en) | 2015-04-02 | 2017-06-27 | Abexl Inc. | Method for creating through-connected vias and conductors on a substrate |
CN107710891B (zh) * | 2015-04-02 | 2021-07-09 | 申泰公司 | 在基板上形成贯通连接的过孔和导体的方法 |
SE539800C2 (en) | 2015-05-26 | 2017-12-05 | Stora Enso Oyj | Method and arrangement for producing electrically conductive patterns on substrates |
CN106028635B (zh) * | 2016-06-07 | 2018-11-13 | 复旦大学 | 一种纤维素纸基柔性高导电性图形的制备方法 |
EP3542395A4 (en) | 2016-11-18 | 2020-06-17 | Samtec, Inc. | FILLING MATERIALS AND METHODS FOR FILLING THROUGH HOLES OF A SUBSTRATE |
SE541026C2 (en) | 2017-10-13 | 2019-03-12 | Stora Enso Oyj | Method and arrangement for producing a label with integrated electrically conductive pattern |
SE542007C2 (en) | 2017-10-13 | 2020-02-11 | Stora Enso Oyj | A method and an apparatus for producing a radio-frequency identification transponder |
SE541540C2 (en) * | 2017-12-21 | 2019-10-29 | Stora Enso Oyj | Method for manufacturing a collar piece comprising an RFID tag |
WO2019191621A1 (en) | 2018-03-30 | 2019-10-03 | Samtec, Inc. | Electrically conductive vias and methods for producing same |
SE544313C2 (en) | 2020-07-02 | 2022-04-05 | Digital Tags Finland Oy | Liquid detection rfid tag arrangement |
SE544901C2 (en) | 2021-03-26 | 2022-12-27 | Digital Tags Finland Oy | Baggage tag |
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2008
- 2008-05-09 BR BRPI0822649A patent/BRPI0822649B8/pt active IP Right Grant
- 2008-05-09 US US12/991,598 patent/US8654502B2/en active Active
- 2008-05-09 WO PCT/FI2008/050256 patent/WO2009135985A1/en active Application Filing
- 2008-05-09 CA CA2723886A patent/CA2723886C/en active Active
- 2008-05-09 JP JP2011507952A patent/JP2011520279A/ja active Pending
- 2008-05-09 RU RU2010148407/07A patent/RU2478264C2/ru active
- 2008-05-09 KR KR1020157013187A patent/KR20150063596A/ko active Search and Examination
- 2008-05-09 MX MX2010012006A patent/MX2010012006A/es active IP Right Grant
- 2008-05-09 AU AU2008356134A patent/AU2008356134B2/en active Active
- 2008-05-09 CN CN200880129072.9A patent/CN102017818B/zh active Active
- 2008-05-09 EP EP08761652.0A patent/EP2298045B1/en active Active
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Also Published As
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CN102017818B (zh) | 2014-07-02 |
US8654502B2 (en) | 2014-02-18 |
EP2298045A4 (en) | 2012-01-04 |
WO2009135985A1 (en) | 2009-11-12 |
BRPI0822649B1 (pt) | 2019-09-03 |
AU2008356134A1 (en) | 2009-11-12 |
CN102017818A (zh) | 2011-04-13 |
CA2723886A1 (en) | 2009-11-12 |
KR20110006720A (ko) | 2011-01-20 |
US20110147071A1 (en) | 2011-06-23 |
JP2011520279A (ja) | 2011-07-14 |
CA2723886C (en) | 2017-01-17 |
EP2298045A1 (en) | 2011-03-23 |
AU2008356134B2 (en) | 2015-02-12 |
ES2768251T3 (es) | 2020-06-22 |
EP2298045B1 (en) | 2019-12-25 |
KR20150063596A (ko) | 2015-06-09 |
BRPI0822649A2 (pt) | 2015-06-23 |
RU2478264C2 (ru) | 2013-03-27 |
RU2010148407A (ru) | 2012-06-20 |
BRPI0822649B8 (pt) | 2022-07-12 |
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