BRPI0822649A2 - Um aparelho, um método para estabelecer um padrão condutor sobre um substrato isolante plano, o substrato isolante plano e um chipset do mesmo - Google Patents
Um aparelho, um método para estabelecer um padrão condutor sobre um substrato isolante plano, o substrato isolante plano e um chipset do mesmoInfo
- Publication number
- BRPI0822649A2 BRPI0822649A2 BRPI0822649-0A BRPI0822649A BRPI0822649A2 BR PI0822649 A2 BRPI0822649 A2 BR PI0822649A2 BR PI0822649 A BRPI0822649 A BR PI0822649A BR PI0822649 A2 BRPI0822649 A2 BR PI0822649A2
- Authority
- BR
- Brazil
- Prior art keywords
- insulating substrate
- flat insulating
- chipset
- establishing
- conductive pattern
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
- C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
- C23C24/10—Coating starting from inorganic powder by application of heat or pressure and heat with intermediate formation of a liquid phase in the layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1266—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by electrographic or magnetographic printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0517—Electrographic patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0522—Using an adhesive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
- Y10T428/24322—Composite web or sheet
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
- Y10T428/24521—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness with component conforming to contour of nonplanar surface
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/256—Heavy metal or aluminum or compound thereof
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Conductive Materials (AREA)
- Powder Metallurgy (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/FI2008/050256 WO2009135985A1 (en) | 2008-05-09 | 2008-05-09 | An apparatus, a method for establishing a conductive pattern on a planar insulating substrate, the planar insulating substrate and a chipset thereof |
Publications (3)
Publication Number | Publication Date |
---|---|
BRPI0822649A2 true BRPI0822649A2 (pt) | 2015-06-23 |
BRPI0822649B1 BRPI0822649B1 (pt) | 2019-09-03 |
BRPI0822649B8 BRPI0822649B8 (pt) | 2022-07-12 |
Family
ID=41264470
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BRPI0822649A BRPI0822649B8 (pt) | 2008-05-09 | 2008-05-09 | Aparelho, método para estabelecer um padrão condutor sobre um substrato isolante plano, o substrato isolante plano e chipset do mesmo |
Country Status (12)
Country | Link |
---|---|
US (1) | US8654502B2 (pt) |
EP (1) | EP2298045B1 (pt) |
JP (1) | JP2011520279A (pt) |
KR (2) | KR20110006720A (pt) |
CN (1) | CN102017818B (pt) |
AU (1) | AU2008356134B2 (pt) |
BR (1) | BRPI0822649B8 (pt) |
CA (1) | CA2723886C (pt) |
ES (1) | ES2768251T3 (pt) |
MX (1) | MX2010012006A (pt) |
RU (1) | RU2478264C2 (pt) |
WO (1) | WO2009135985A1 (pt) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BR112012032936B1 (pt) | 2010-06-22 | 2020-11-17 | Stora Enso Oyj | sistema compreendendo embalagem à base de fibra ou de plástico, e método e memória para comunicação de dados sem fio |
US9629255B2 (en) | 2010-10-14 | 2017-04-18 | Stora Enso Oyj | Method and arrangement for attaching a chip to a printed conductive surface |
US9227220B1 (en) * | 2011-11-23 | 2016-01-05 | I-Blades, Inc. | Method for patterning materials on a substrate |
FI126151B (en) * | 2012-01-30 | 2016-07-15 | Stora Enso Oyj | Method and apparatus for producing an electrically conductive figure on a surface |
KR102045113B1 (ko) * | 2013-11-01 | 2019-11-14 | 피피지 인더스트리즈 오하이오 인코포레이티드 | 전기전도성 물질의 전달 방법 |
WO2015111542A1 (ja) * | 2014-01-27 | 2015-07-30 | 富士フイルム株式会社 | 微細構造体、多層配線基板、半導体パッケージおよび微細構造体の製造方法 |
WO2016161434A1 (en) * | 2015-04-02 | 2016-10-06 | Nanopac Technologies, Inc. | Method for creating through-connected vias and conductors on a substrate |
US10593562B2 (en) | 2015-04-02 | 2020-03-17 | Samtec, Inc. | Method for creating through-connected vias and conductors on a substrate |
CN107710891B (zh) * | 2015-04-02 | 2021-07-09 | 申泰公司 | 在基板上形成贯通连接的过孔和导体的方法 |
SE539800C2 (en) * | 2015-05-26 | 2017-12-05 | Stora Enso Oyj | Method and arrangement for producing electrically conductive patterns on substrates |
CN106028635B (zh) * | 2016-06-07 | 2018-11-13 | 复旦大学 | 一种纤维素纸基柔性高导电性图形的制备方法 |
WO2018094177A1 (en) | 2016-11-18 | 2018-05-24 | Samtec Inc. | Filling materials and methods of filling through holes of a substrate |
SE542007C2 (en) | 2017-10-13 | 2020-02-11 | Stora Enso Oyj | A method and an apparatus for producing a radio-frequency identification transponder |
SE541026C2 (en) | 2017-10-13 | 2019-03-12 | Stora Enso Oyj | Method and arrangement for producing a label with integrated electrically conductive pattern |
SE541540C2 (en) | 2017-12-21 | 2019-10-29 | Stora Enso Oyj | Method for manufacturing a collar piece comprising an RFID tag |
TWI769376B (zh) | 2018-03-30 | 2022-07-01 | 美商山姆科技公司 | 導電性通孔及其製造方法 |
SE544313C2 (en) | 2020-07-02 | 2022-04-05 | Digital Tags Finland Oy | Liquid detection rfid tag arrangement |
SE544901C2 (en) | 2021-03-26 | 2022-12-27 | Digital Tags Finland Oy | Baggage tag |
Family Cites Families (54)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB678717A (en) | 1949-05-10 | 1952-09-10 | Plessey Co Ltd | An improved method for forming printed circuits and printed circuit elements |
GB959425A (en) | 1962-05-11 | 1964-06-03 | Gerald Pollock | Improvements in or relating to printed circuits for electronic and other electrical equipment |
US3941596A (en) * | 1962-10-24 | 1976-03-02 | E. I. Du Pont De Nemours And Company | Thermographic processes using polymer layer capable of existing in metastable state |
GB1191909A (en) | 1967-10-16 | 1970-05-13 | Westinghouse Electric Corp | Flexible Flame-Retardant Foil-Clad Laminates and Method of Manufacture |
SU657862A1 (ru) | 1976-11-09 | 1979-04-25 | Предприятие П/Я Г-4128 | Устройство дл нанесени покрыти на гибкую подложку |
JPS5746360A (en) * | 1980-09-05 | 1982-03-16 | Fuji Photo Film Co Ltd | Friction sheet |
AU572615B2 (en) * | 1983-12-27 | 1988-05-12 | Sony Corporation | Electrically conductive adhesive sheet circuit board and electrical connection structure |
GB8414178D0 (en) * | 1984-06-04 | 1984-07-11 | Soszek P | Circuitry |
GB8504481D0 (en) | 1985-02-21 | 1985-03-27 | Soszek P | Circuitry |
WO1986006107A1 (en) * | 1985-04-10 | 1986-10-23 | Asahi Glass Company Ltd. | Highly durable low-hydrogen overvoltage cathode and a method of producing the same |
US4877508A (en) * | 1985-04-10 | 1989-10-31 | Asahi Glass Company, Ltd. | Highly durable cathode of low hydrogen overvoltage and method for manufacturing the same |
US4740657A (en) * | 1986-02-14 | 1988-04-26 | Hitachi, Chemical Company, Ltd | Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained |
JPS6413793A (en) | 1987-07-07 | 1989-01-18 | Ricoh Kk | Forming method for conductive film or conductive pattern |
DE3806515C1 (pt) * | 1988-03-01 | 1989-07-20 | Du Pont De Nemours (Deutschland) Gmbh, 4000 Duesseldorf, De | |
US4851320A (en) | 1988-05-23 | 1989-07-25 | Tektronix, Inc. | Method of forming a pattern of conductor runs on a dielectric sheet |
NL8801450A (nl) | 1988-06-06 | 1990-01-02 | Docdata Bv | Werkwijze en inrichting voor het op een dragermateriaal aanbrengen van een patroon van elektrisch geleidende en isolerende materialen. |
JPH02208995A (ja) | 1989-02-08 | 1990-08-20 | Matsushita Electric Works Ltd | 回路形成方法 |
DE3913115A1 (de) | 1989-04-21 | 1990-10-25 | Du Pont Deutschland | Verfahren zur herstellung von elektrisch leitfaehigen mustern |
CA2014793A1 (en) | 1989-08-21 | 1991-02-21 | Frank L. Cloutier | Method for applying a conductive trace pattern to a substrate |
US5114744A (en) | 1989-08-21 | 1992-05-19 | Hewlett-Packard Company | Method for applying a conductive trace pattern to a substrate |
US5136365A (en) * | 1990-09-27 | 1992-08-04 | Motorola, Inc. | Anisotropic conductive adhesive and encapsulant material |
GB9112408D0 (en) * | 1991-06-10 | 1991-07-31 | De Beers Ind Diamond | Tool insert |
JP3071894B2 (ja) | 1991-09-17 | 2000-07-31 | 昭和電工株式会社 | 回路形成法 |
JPH0653634A (ja) | 1992-04-22 | 1994-02-25 | Nec Corp | 配線用基板の回路形成方法 |
US5340617A (en) | 1992-08-18 | 1994-08-23 | International Business Machines Corporation | Electrostatic patterning of multi-layer module lamina |
JP3697271B2 (ja) * | 1994-03-15 | 2005-09-21 | 株式会社東芝 | 回路基板の製造方法 |
US5576074A (en) * | 1995-08-23 | 1996-11-19 | Minnesota Mining And Manufacturing Company | Laser write process for making a conductive metal circuit |
AUPN846496A0 (en) * | 1996-03-05 | 1996-03-28 | Research Laboratories Of Australia Pty Ltd | Electronic printing for display technology |
KR19990044351A (ko) * | 1996-07-02 | 1999-06-25 | 야마자끼 료이찌 | 시트상 발열체 및 그의 제조 방법 |
US6769969B1 (en) * | 1997-03-06 | 2004-08-03 | Keltech Engineering, Inc. | Raised island abrasive, method of use and lapping apparatus |
KR20050084536A (ko) * | 1997-04-17 | 2005-08-26 | 세키스이가가쿠 고교가부시키가이샤 | 도전성 미립자의 제조장치, 그 제조장치를 이용한 도전성미립자의 제조방법, 그 제조장치를 이용하여 이루어지는전자회로부품 |
US6059952A (en) * | 1997-07-10 | 2000-05-09 | International Business Machines Corporation | Method of fabricating coated powder materials and their use for high conductivity paste applications |
US5932055A (en) * | 1997-11-11 | 1999-08-03 | Rockwell Science Center Llc | Direct metal fabrication (DMF) using a carbon precursor to bind the "green form" part and catalyze a eutectic reducing element in a supersolidus liquid phase sintering (SLPS) process |
US6322685B1 (en) * | 1998-05-13 | 2001-11-27 | International Business Machines Corporation | Apparatus and method for plating coatings on to fine powder materials and use of the powder therefrom |
JP4109364B2 (ja) * | 1998-11-30 | 2008-07-02 | 富士通株式会社 | 半導体装置の製造方法 |
JP3016769B1 (ja) * | 1998-12-02 | 2000-03-06 | 片山特殊工業株式会社 | 電池用電極板の製造方法、該方法により製造された電極板および該電極板を備えた電池 |
RU2149525C1 (ru) * | 1999-02-10 | 2000-05-20 | Раков Дмитрий Леонидович | Способ изготовления печатной платы |
GB2365816B (en) * | 2000-08-09 | 2002-11-13 | Murata Manufacturing Co | Method of bonding conductive adhesive and electrode,and bonded structure |
US7632434B2 (en) * | 2000-11-17 | 2009-12-15 | Wayne O. Duescher | Abrasive agglomerate coated raised island articles |
JPWO2003003798A1 (ja) * | 2001-06-29 | 2004-10-21 | 東レエンジニアリング株式会社 | 異方導電性接着剤を用いた接合方法 |
WO2003058677A2 (de) | 2002-01-14 | 2003-07-17 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | System zur fertigung von elektrischen und integrierten schaltkreisen |
EP1553212B1 (en) * | 2002-07-12 | 2017-08-23 | Fujimori Kogyo Co., Ltd. | Electromagnetic wave shield material and process for producing the same |
TWI265762B (en) * | 2003-01-14 | 2006-11-01 | Sharp Kk | Wiring material, wiring substrate and manufacturing method thereof, display panel, fine particle thin film material, substrate including thin film layer and manufacturing method thereof |
US20050002818A1 (en) * | 2003-07-04 | 2005-01-06 | Hitachi Powdered Metals Co., Ltd. | Production method for sintered metal-ceramic layered compact and production method for thermal stress relief pad |
JP4042646B2 (ja) * | 2003-07-22 | 2008-02-06 | コニカミノルタビジネステクノロジーズ株式会社 | 電子写真感光体、プロセスカートリッジ、画像形成装置及び画像形成方法 |
DE20320761U1 (de) | 2003-10-08 | 2005-02-24 | Ruwel Ag | Basislaminat für flexible oder semi-flexible ein- oder mehrlagige gedruckte Schaltungen |
JP2005203396A (ja) | 2004-01-13 | 2005-07-28 | Toshiba Corp | 電子部品の製造装置、電子部品の製造方法および電子部品 |
DE102004013477A1 (de) * | 2004-03-18 | 2005-10-06 | Epcos Ag | Trägerplattform für Leistungselektronik-Bauelemente und Modul mit der Trägerplattform |
US20060182944A1 (en) * | 2005-02-11 | 2006-08-17 | Fluid Treatment Systems, Inc. | Flexible reticulated foam fluid treatment media and method of preparation |
US20070178228A1 (en) | 2006-01-27 | 2007-08-02 | Shiu Hei M | Method for fabricating a PCB |
US20070218258A1 (en) | 2006-03-20 | 2007-09-20 | 3M Innovative Properties Company | Articles and methods including patterned substrates formed from densified, adhered metal powders |
US20070234918A1 (en) * | 2006-03-31 | 2007-10-11 | Edward Hirahara | System and method for making printed electronic circuits using electrophotography |
FI20060673A0 (fi) * | 2006-07-11 | 2006-07-11 | Keskuslaboratorio | Painomenetelmä ja -laitteet ja painettu tuote |
JP2008153470A (ja) * | 2006-12-18 | 2008-07-03 | Renesas Technology Corp | 半導体装置および半導体装置の製造方法 |
-
2008
- 2008-05-09 JP JP2011507952A patent/JP2011520279A/ja active Pending
- 2008-05-09 EP EP08761652.0A patent/EP2298045B1/en active Active
- 2008-05-09 KR KR1020107027710A patent/KR20110006720A/ko active Search and Examination
- 2008-05-09 BR BRPI0822649A patent/BRPI0822649B8/pt active IP Right Grant
- 2008-05-09 US US12/991,598 patent/US8654502B2/en active Active
- 2008-05-09 WO PCT/FI2008/050256 patent/WO2009135985A1/en active Application Filing
- 2008-05-09 RU RU2010148407/07A patent/RU2478264C2/ru active
- 2008-05-09 MX MX2010012006A patent/MX2010012006A/es active IP Right Grant
- 2008-05-09 CN CN200880129072.9A patent/CN102017818B/zh active Active
- 2008-05-09 AU AU2008356134A patent/AU2008356134B2/en active Active
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Also Published As
Publication number | Publication date |
---|---|
CN102017818B (zh) | 2014-07-02 |
WO2009135985A1 (en) | 2009-11-12 |
KR20110006720A (ko) | 2011-01-20 |
RU2478264C2 (ru) | 2013-03-27 |
ES2768251T3 (es) | 2020-06-22 |
AU2008356134B2 (en) | 2015-02-12 |
US20110147071A1 (en) | 2011-06-23 |
EP2298045B1 (en) | 2019-12-25 |
JP2011520279A (ja) | 2011-07-14 |
AU2008356134A1 (en) | 2009-11-12 |
KR20150063596A (ko) | 2015-06-09 |
MX2010012006A (es) | 2011-03-29 |
CN102017818A (zh) | 2011-04-13 |
BRPI0822649B8 (pt) | 2022-07-12 |
RU2010148407A (ru) | 2012-06-20 |
US8654502B2 (en) | 2014-02-18 |
BRPI0822649B1 (pt) | 2019-09-03 |
CA2723886C (en) | 2017-01-17 |
EP2298045A4 (en) | 2012-01-04 |
EP2298045A1 (en) | 2011-03-23 |
CA2723886A1 (en) | 2009-11-12 |
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