JPS6413793A - Forming method for conductive film or conductive pattern - Google Patents

Forming method for conductive film or conductive pattern

Info

Publication number
JPS6413793A
JPS6413793A JP17036387A JP17036387A JPS6413793A JP S6413793 A JPS6413793 A JP S6413793A JP 17036387 A JP17036387 A JP 17036387A JP 17036387 A JP17036387 A JP 17036387A JP S6413793 A JPS6413793 A JP S6413793A
Authority
JP
Japan
Prior art keywords
composite particles
conductive
base material
particles
charged
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17036387A
Other languages
Japanese (ja)
Inventor
Yoshihiro Nomura
Kimitoshi Yamaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ricoh Co Ltd
Original Assignee
Ricoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ricoh Co Ltd filed Critical Ricoh Co Ltd
Priority to JP17036387A priority Critical patent/JPS6413793A/en
Publication of JPS6413793A publication Critical patent/JPS6413793A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder

Abstract

PURPOSE:To form a film easily even onto an irregular surface, to eliminate the danger of a fire and trouble on environmental pollution and preservation and to shape the homogeneous film by forming the conductive film or a conductive pattern by using composite particles in which the surfaces of conductive heat-fusing parent body particles are welding-coated with insulating small particles. CONSTITUTION:With an insulating base material 1, a desired section is charged previously by discharge from a corona discharger 2 or friction with an insulating substance 3. Composite particles consisting of conductive parent body particles and insulating small particles are charged by mixed friction, etc., with magnetic carriers 6 or the composite particles 5 are positioned onto a conductive base material 4, and the composite particles 5 are charged previously by corona discharge from the upper section of the composite particles. The charged composite particles 5 are brought near to or brought into contact with static charge surfaces shaped onto the insulating base material 1, and the charged composite particles 5 are attracted and attached electrostatically to a static charge section for the base material 1. Lastly, the composite particles 5 annexed to the insulating base material 1 are heated and melted by a heat source 11, thus forming a conductive pattern or a conductive film 12 onto the insulating base material 1.
JP17036387A 1987-07-07 1987-07-07 Forming method for conductive film or conductive pattern Pending JPS6413793A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17036387A JPS6413793A (en) 1987-07-07 1987-07-07 Forming method for conductive film or conductive pattern

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17036387A JPS6413793A (en) 1987-07-07 1987-07-07 Forming method for conductive film or conductive pattern

Publications (1)

Publication Number Publication Date
JPS6413793A true JPS6413793A (en) 1989-01-18

Family

ID=15903547

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17036387A Pending JPS6413793A (en) 1987-07-07 1987-07-07 Forming method for conductive film or conductive pattern

Country Status (1)

Country Link
JP (1) JPS6413793A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5571455A (en) * 1989-08-31 1996-11-05 Dai Nippon Insatsu Kabushiki Kaisha Composition for forming electroconductive pattern and process for producing the same
WO2009135985A1 (en) * 2008-05-09 2009-11-12 Stora Enso Oyj An apparatus, a method for establishing a conductive pattern on a planar insulating substrate, the planar insulating substrate and a chipset thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5571455A (en) * 1989-08-31 1996-11-05 Dai Nippon Insatsu Kabushiki Kaisha Composition for forming electroconductive pattern and process for producing the same
WO2009135985A1 (en) * 2008-05-09 2009-11-12 Stora Enso Oyj An apparatus, a method for establishing a conductive pattern on a planar insulating substrate, the planar insulating substrate and a chipset thereof
US8654502B2 (en) 2008-05-09 2014-02-18 Stora Enso Oyj Apparatus, a method for establishing a conductive pattern on a planar insulating substrate, the planar insulating substrate and a chipset thereof

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