MX2007015046A - Superficie de trasferencia de calor para el enfriamiento de componentes electronicos. - Google Patents

Superficie de trasferencia de calor para el enfriamiento de componentes electronicos.

Info

Publication number
MX2007015046A
MX2007015046A MX2007015046A MX2007015046A MX2007015046A MX 2007015046 A MX2007015046 A MX 2007015046A MX 2007015046 A MX2007015046 A MX 2007015046A MX 2007015046 A MX2007015046 A MX 2007015046A MX 2007015046 A MX2007015046 A MX 2007015046A
Authority
MX
Mexico
Prior art keywords
fins
channels
cooling
fin
cooling surface
Prior art date
Application number
MX2007015046A
Other languages
English (en)
Spanish (es)
Inventor
Petur Thors
Original Assignee
Wolverine Tube Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wolverine Tube Inc filed Critical Wolverine Tube Inc
Publication of MX2007015046A publication Critical patent/MX2007015046A/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21J—FORGING; HAMMERING; PRESSING METAL; RIVETING; FORGE FURNACES
    • B21J5/00—Methods for forging, hammering, or pressing; Special equipment or accessories therefor
    • B21J5/06—Methods for forging, hammering, or pressing; Special equipment or accessories therefor for performing particular operations
    • B21J5/068—Shaving, skiving or scarifying for forming lifted portions, e.g. slices or barbs, on the surface of the material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
MX2007015046A 2005-06-07 2006-06-06 Superficie de trasferencia de calor para el enfriamiento de componentes electronicos. MX2007015046A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US68825405P 2005-06-07 2005-06-07
PCT/US2006/021959 WO2006133211A2 (en) 2005-06-07 2006-06-06 Heat transfer surface for electronic cooling

Publications (1)

Publication Number Publication Date
MX2007015046A true MX2007015046A (es) 2008-01-18

Family

ID=37499051

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2007015046A MX2007015046A (es) 2005-06-07 2006-06-06 Superficie de trasferencia de calor para el enfriamiento de componentes electronicos.

Country Status (9)

Country Link
US (2) US7861408B2 (cg-RX-API-DMAC7.html)
EP (1) EP1889528B1 (cg-RX-API-DMAC7.html)
JP (1) JP5331475B2 (cg-RX-API-DMAC7.html)
KR (1) KR20080012344A (cg-RX-API-DMAC7.html)
CN (1) CN101287955B (cg-RX-API-DMAC7.html)
CA (1) CA2605966A1 (cg-RX-API-DMAC7.html)
IL (2) IL186705A0 (cg-RX-API-DMAC7.html)
MX (1) MX2007015046A (cg-RX-API-DMAC7.html)
WO (1) WO2006133211A2 (cg-RX-API-DMAC7.html)

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CN101287955B (zh) * 2005-06-07 2010-09-29 沃尔弗林管子公司 用于电子冷却的热传界面
CN102252557A (zh) * 2011-05-19 2011-11-23 山东北辰压力容器有限公司 矩形纵翅片换热元件
US8963321B2 (en) 2011-09-12 2015-02-24 Infineon Technologies Ag Semiconductor device including cladded base plate
US8519532B2 (en) 2011-09-12 2013-08-27 Infineon Technologies Ag Semiconductor device including cladded base plate
US9238284B2 (en) * 2011-12-20 2016-01-19 Unison Industries, Llc Methods for forming a heat exchanger and portions thereof
WO2015112771A2 (en) * 2014-01-22 2015-07-30 Wolverine Tube, Inc. Double-sided micro fin plate for plate heat exchanger
US10201119B2 (en) * 2015-06-02 2019-02-05 Hamilton Sundstrand Corporation System and method of alternate cooling of a liquid cooled motor controller
PL3507418T3 (pl) * 2016-09-01 2025-11-12 Hs Manufacturing Group Llc Sposoby biopochodnej derywatyzacji powierzchni celulozowych
DE102017200422A1 (de) 2017-01-12 2018-07-12 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Herstellung eines Wärmeübertragers und Wärmeübertrager
US20200158446A1 (en) * 2017-05-12 2020-05-21 Carrier Corporation Internally enhanced heat exchanger tube
US10520263B2 (en) 2017-09-20 2019-12-31 Toyota Motor Engineering & Manufacturing North America, Inc. Apparatus, system, and method for interior fluid flow with optimized fin structures
KR102195183B1 (ko) 2019-09-06 2020-12-24 엘아이지넥스원 주식회사 스텔스 기능을 갖는 함정용 통합마스트장치 및 그 제어방법
JP7343166B2 (ja) * 2019-11-13 2023-09-12 ナカムラマジック株式会社 ヒートシンクの製造方法及びヒートシンク
KR102264088B1 (ko) 2020-06-12 2021-06-11 엘아이지넥스원 주식회사 Ir 스텔스 기능을 갖는 함정용 통합마스트장치 및 그 제어방법
CN114121849B (zh) * 2020-08-27 2025-10-31 讯凯国际股份有限公司 水冷散热装置及其制造方法

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JPS5870919A (ja) * 1981-10-23 1983-04-27 Hitachi Cable Ltd 伝熱管の製造方法
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JPH03209859A (ja) * 1990-01-12 1991-09-12 Hitachi Ltd 半導体冷却装置
JP2550770B2 (ja) * 1990-10-11 1996-11-06 日本電気株式会社 電子部品冷却機構
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RU2044606C1 (ru) * 1993-04-30 1995-09-27 Николай Николаевич Зубков Способ получения поверхностей с чередующимися выступами и впадинами (варианты) и инструмент для его осуществления
US5412535A (en) * 1993-08-24 1995-05-02 Convex Computer Corporation Apparatus and method for cooling electronic devices
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CN101287955B (zh) * 2005-06-07 2010-09-29 沃尔弗林管子公司 用于电子冷却的热传界面

Also Published As

Publication number Publication date
US20060283573A1 (en) 2006-12-21
KR20080012344A (ko) 2008-02-11
EP1889528A4 (en) 2011-09-07
WO2006133211A2 (en) 2006-12-14
US20110139411A1 (en) 2011-06-16
JP5331475B2 (ja) 2013-10-30
EP1889528A2 (en) 2008-02-20
EP1889528B1 (en) 2012-09-26
JP2008543112A (ja) 2008-11-27
CA2605966A1 (en) 2006-12-14
US7861408B2 (en) 2011-01-04
IL217721A0 (en) 2012-03-29
IL186705A0 (en) 2008-02-09
CN101287955B (zh) 2010-09-29
CN101287955A (zh) 2008-10-15
WO2006133211A3 (en) 2008-01-17

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