MX166809B - Composiciones fotorresistentes - Google Patents
Composiciones fotorresistentesInfo
- Publication number
- MX166809B MX166809B MX010960A MX1096088A MX166809B MX 166809 B MX166809 B MX 166809B MX 010960 A MX010960 A MX 010960A MX 1096088 A MX1096088 A MX 1096088A MX 166809 B MX166809 B MX 166809B
- Authority
- MX
- Mexico
- Prior art keywords
- organic polymer
- weight
- parts
- acid
- arilonium
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title abstract 2
- 229920000620 organic polymer Polymers 0.000 abstract 4
- 239000002253 acid Substances 0.000 abstract 2
- 230000005855 radiation Effects 0.000 abstract 2
- 150000003839 salts Chemical class 0.000 abstract 2
- 241000490025 Schefflera digitata Species 0.000 abstract 1
- 238000003776 cleavage reaction Methods 0.000 abstract 1
- 235000015250 liver sausages Nutrition 0.000 abstract 1
- 229920003986 novolac Polymers 0.000 abstract 1
- 239000003960 organic solvent Substances 0.000 abstract 1
- 230000007017 scission Effects 0.000 abstract 1
- 239000007787 solid Substances 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials For Photolithography (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Phenolic Resins Or Amino Resins (AREA)
Abstract
La presente invención se refiere a una composición sensible a la radiación, caracterizada porque comprende, en peso; A) 100 partes de un solvente orgánico; B) de 5 a 85 partes de sólidos, que comprenden en peso: 1) 100 partes de una resina de fenol-novolac que tiene un peso molecular en la escala de 200 a 20,000; 2) de 5 a 100 pates de un polímero orgánico que tiene un peso molecular de más de 1000 y que tiene grupos lábiles con ácido, químicamente combinados, a lo largo de o dentro de la estructura fundamental de polímero orgánico, polímero orgánico que es inicialmente insoluble en base y que se hace soluble en base cuando se expone a radiación electromagnética o de partículas, en preencia de una cantidad en peso, de una sal de arilonio suficiente para proveer el desbloqueo de los grupos lábiles con ácido combinados químicamente a lo largo de o dentro de la estructura fundamental de polímero orgánico, como resultado de la escisión ácido y termolítica; y 3) una cantidad efectiva de sal de arilonio.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US3182687A | 1987-03-30 | 1987-03-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MX166809B true MX166809B (es) | 1993-02-08 |
Family
ID=21861620
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MX010960A MX166809B (es) | 1987-03-30 | 1988-03-30 | Composiciones fotorresistentes |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP0284868B1 (es) |
| JP (1) | JP2554118B2 (es) |
| KR (1) | KR960010326B1 (es) |
| CA (1) | CA1333536C (es) |
| DE (1) | DE3853694T2 (es) |
| MX (1) | MX166809B (es) |
| MY (1) | MY103006A (es) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0299953A (ja) * | 1988-10-06 | 1990-04-11 | Matsushita Electric Ind Co Ltd | パターン形成材料 |
| DE68926019T2 (de) * | 1988-10-28 | 1996-10-02 | Ibm | Positiv arbeitende hochempfindliche Photolack-Zusammensetzung |
| US5023164A (en) * | 1989-10-23 | 1991-06-11 | International Business Machines Corporation | Highly sensitive dry developable deep UV photoresist |
| JPH03142918A (ja) * | 1989-10-30 | 1991-06-18 | Matsushita Electron Corp | レジストパターン形成方法 |
| US5164278A (en) * | 1990-03-01 | 1992-11-17 | International Business Machines Corporation | Speed enhancers for acid sensitized resists |
| JP2632066B2 (ja) * | 1990-04-06 | 1997-07-16 | 富士写真フイルム株式会社 | ポジ画像の形成方法 |
| JP2557748B2 (ja) * | 1990-09-07 | 1996-11-27 | 日本電信電話株式会社 | ポジ型レジスト材料 |
| JPH04149441A (ja) * | 1990-10-12 | 1992-05-22 | Mitsubishi Electric Corp | パターン形成方法 |
| JPH04149445A (ja) * | 1990-10-12 | 1992-05-22 | Mitsubishi Electric Corp | ポジ型感光性組成物 |
| JP3031421B2 (ja) * | 1990-11-28 | 2000-04-10 | 信越化学工業株式会社 | 化学増幅ポジ型レジスト材 |
| US5342734A (en) * | 1992-02-25 | 1994-08-30 | Morton International, Inc. | Deep UV sensitive photoresist resistant to latent image decay |
| US5496678A (en) * | 1993-04-16 | 1996-03-05 | Kansai Paint Co., Ltd. | Photosensitive compositions containing a polymer with carboxyl and hydroxyphenyl groups, a compound with multiple ethylenic unsaturation and a photo-acid generator |
| US5527656A (en) * | 1993-04-27 | 1996-06-18 | Kansai Paint Co., Ltd. | Positive type electrodeposition photoresist compositions |
| JP3116751B2 (ja) * | 1993-12-03 | 2000-12-11 | ジェイエスアール株式会社 | 感放射線性樹脂組成物 |
| JP3203995B2 (ja) * | 1993-12-24 | 2001-09-04 | ジェイエスアール株式会社 | 感放射線性樹脂組成物 |
| JP3591672B2 (ja) | 1996-02-05 | 2004-11-24 | 富士写真フイルム株式会社 | ポジ型感光性組成物 |
| JP3969909B2 (ja) | 1999-09-27 | 2007-09-05 | 富士フイルム株式会社 | ポジ型フォトレジスト組成物 |
| CN1273869C (zh) * | 2000-08-29 | 2006-09-06 | 捷时雅株式会社 | 有放射线敏感性的折射率变化性组合物，及其光学制品 |
| JP2003043682A (ja) | 2001-08-01 | 2003-02-13 | Jsr Corp | 感放射線性誘電率変化性組成物、誘電率変化法 |
| JP3894001B2 (ja) | 2001-09-06 | 2007-03-14 | 住友化学株式会社 | 化学増幅型ポジ型レジスト組成物 |
| US6911293B2 (en) * | 2002-04-11 | 2005-06-28 | Clariant Finance (Bvi) Limited | Photoresist compositions comprising acetals and ketals as solvents |
| EP1835342A3 (en) | 2006-03-14 | 2008-06-04 | FUJIFILM Corporation | Positive resist composition and pattern forming method using the same |
| JP6100500B2 (ja) | 2012-10-26 | 2017-03-22 | 富士フイルム株式会社 | 感光性転写材料、パターン形成方法およびエッチング方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3779778A (en) * | 1972-02-09 | 1973-12-18 | Minnesota Mining & Mfg | Photosolubilizable compositions and elements |
| DE3023201A1 (de) * | 1980-06-21 | 1982-01-07 | Hoechst Ag, 6000 Frankfurt | Positiv arbeitendes strahlungsempfindliches gemisch |
| DE3039926A1 (de) * | 1980-10-23 | 1982-05-27 | Hoechst Ag, 6000 Frankfurt | Lichtempfindliches gemisch, daraus hergestelltes lichtempfindliches kopiermaterial und verfahren zur herstellung einer druckform aus dem kopiermaterial |
| DE3151078A1 (de) * | 1981-12-23 | 1983-07-28 | Hoechst Ag, 6230 Frankfurt | Verfahren zur herstellung von reliefbildern |
| GB8333901D0 (en) * | 1983-12-20 | 1984-02-01 | Minnesota Mining & Mfg | Radiationsensitive compositions |
| US4708925A (en) * | 1984-12-11 | 1987-11-24 | Minnesota Mining And Manufacturing Company | Photosolubilizable compositions containing novolac phenolic resin |
| JPS61252546A (ja) * | 1985-05-01 | 1986-11-10 | Ueno Kagaku Kogyo Kk | 感光性レジストインク，それを用いたｐｓ板の製造方法およびそのｐｓ板の蝕刻方法 |
| US4837124A (en) * | 1986-02-24 | 1989-06-06 | Hoechst Celanese Corporation | High resolution photoresist of imide containing polymers |
| EP0249139B2 (en) * | 1986-06-13 | 1998-03-11 | MicroSi, Inc. (a Delaware corporation) | Resist compositions and use |
-
1987
- 1987-12-10 MY MYPI87003177A patent/MY103006A/en unknown
-
1988
- 1988-02-26 JP JP63042410A patent/JP2554118B2/ja not_active Expired - Fee Related
- 1988-03-10 CA CA000561109A patent/CA1333536C/en not_active Expired - Fee Related
- 1988-03-14 EP EP88104019A patent/EP0284868B1/en not_active Expired - Lifetime
- 1988-03-14 DE DE3853694T patent/DE3853694T2/de not_active Expired - Fee Related
- 1988-03-30 MX MX010960A patent/MX166809B/es unknown
- 1988-03-30 KR KR1019880003489A patent/KR960010326B1/ko not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| KR880011622A (ko) | 1988-10-29 |
| EP0284868B1 (en) | 1995-05-03 |
| EP0284868A2 (en) | 1988-10-05 |
| CA1333536C (en) | 1994-12-20 |
| KR960010326B1 (ko) | 1996-07-30 |
| DE3853694T2 (de) | 1996-01-11 |
| DE3853694D1 (de) | 1995-06-08 |
| EP0284868A3 (en) | 1989-10-25 |
| JPS63250642A (ja) | 1988-10-18 |
| MY103006A (en) | 1993-03-31 |
| JP2554118B2 (ja) | 1996-11-13 |
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