KR980005300U - Vacuum pad structure for wafer transfer of wafer alignment equipment - Google Patents
Vacuum pad structure for wafer transfer of wafer alignment equipmentInfo
- Publication number
- KR980005300U KR980005300U KR2019960016439U KR19960016439U KR980005300U KR 980005300 U KR980005300 U KR 980005300U KR 2019960016439 U KR2019960016439 U KR 2019960016439U KR 19960016439 U KR19960016439 U KR 19960016439U KR 980005300 U KR980005300 U KR 980005300U
- Authority
- KR
- South Korea
- Prior art keywords
- wafer
- pad structure
- vacuum pad
- alignment equipment
- wafer transfer
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
- G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7007—Alignment other than original with workpiece
- G03F9/7011—Pre-exposure scan; original with original holder alignment; Prealignment, i.e. workpiece with workpiece holder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019960016439U KR200143983Y1 (en) | 1996-06-19 | 1996-06-19 | Vacuum pad structure used in transporting wafer of alignment apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019960016439U KR200143983Y1 (en) | 1996-06-19 | 1996-06-19 | Vacuum pad structure used in transporting wafer of alignment apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
KR980005300U true KR980005300U (en) | 1998-03-30 |
KR200143983Y1 KR200143983Y1 (en) | 1999-06-15 |
Family
ID=19458904
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019960016439U KR200143983Y1 (en) | 1996-06-19 | 1996-06-19 | Vacuum pad structure used in transporting wafer of alignment apparatus |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR200143983Y1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8318512B2 (en) * | 2009-04-29 | 2012-11-27 | Applied Materials, Inc. | Automated substrate handling and film quality inspection in solar cell processing |
-
1996
- 1996-06-19 KR KR2019960016439U patent/KR200143983Y1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR200143983Y1 (en) | 1999-06-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
REGI | Registration of establishment | ||
FPAY | Annual fee payment |
Payment date: 20041230 Year of fee payment: 7 |
|
LAPS | Lapse due to unpaid annual fee |