KR970015307U - Semiconductor wafer etching equipment - Google Patents

Semiconductor wafer etching equipment

Info

Publication number
KR970015307U
KR970015307U KR2019950024635U KR19950024635U KR970015307U KR 970015307 U KR970015307 U KR 970015307U KR 2019950024635 U KR2019950024635 U KR 2019950024635U KR 19950024635 U KR19950024635 U KR 19950024635U KR 970015307 U KR970015307 U KR 970015307U
Authority
KR
South Korea
Prior art keywords
semiconductor wafer
etching equipment
wafer etching
equipment
semiconductor
Prior art date
Application number
KR2019950024635U
Other languages
Korean (ko)
Other versions
KR0125881Y1 (en
Inventor
이상중
Original Assignee
엘지반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지반도체주식회사 filed Critical 엘지반도체주식회사
Priority to KR2019950024635U priority Critical patent/KR0125881Y1/en
Publication of KR970015307U publication Critical patent/KR970015307U/en
Application granted granted Critical
Publication of KR0125881Y1 publication Critical patent/KR0125881Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
KR2019950024635U 1995-09-13 1995-09-13 Semiconductor wafer etching device KR0125881Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950024635U KR0125881Y1 (en) 1995-09-13 1995-09-13 Semiconductor wafer etching device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950024635U KR0125881Y1 (en) 1995-09-13 1995-09-13 Semiconductor wafer etching device

Publications (2)

Publication Number Publication Date
KR970015307U true KR970015307U (en) 1997-04-28
KR0125881Y1 KR0125881Y1 (en) 1998-11-02

Family

ID=19423220

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950024635U KR0125881Y1 (en) 1995-09-13 1995-09-13 Semiconductor wafer etching device

Country Status (1)

Country Link
KR (1) KR0125881Y1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100770047B1 (en) * 2006-05-30 2007-10-26 세종대학교산학협력단 Etching device and method for electroless plating
US11087999B2 (en) 2016-12-30 2021-08-10 Snw Company Limited Buffer chamber unit for wafer processing equipment

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100770047B1 (en) * 2006-05-30 2007-10-26 세종대학교산학협력단 Etching device and method for electroless plating
US11087999B2 (en) 2016-12-30 2021-08-10 Snw Company Limited Buffer chamber unit for wafer processing equipment

Also Published As

Publication number Publication date
KR0125881Y1 (en) 1998-11-02

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Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20090526

Year of fee payment: 12

LAPS Lapse due to unpaid annual fee