KR970015297U - Semiconductor wafer etching equipment - Google Patents

Semiconductor wafer etching equipment

Info

Publication number
KR970015297U
KR970015297U KR2019950025794U KR19950025794U KR970015297U KR 970015297 U KR970015297 U KR 970015297U KR 2019950025794 U KR2019950025794 U KR 2019950025794U KR 19950025794 U KR19950025794 U KR 19950025794U KR 970015297 U KR970015297 U KR 970015297U
Authority
KR
South Korea
Prior art keywords
semiconductor wafer
etching equipment
wafer etching
equipment
semiconductor
Prior art date
Application number
KR2019950025794U
Other languages
Korean (ko)
Other versions
KR200198422Y1 (en
Inventor
윤철수
Original Assignee
현대반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 현대반도체주식회사 filed Critical 현대반도체주식회사
Priority to KR2019950025794U priority Critical patent/KR200198422Y1/en
Publication of KR970015297U publication Critical patent/KR970015297U/en
Application granted granted Critical
Publication of KR200198422Y1 publication Critical patent/KR200198422Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)
KR2019950025794U 1995-09-22 1995-09-22 Semiconductor wafer etching apparatus KR200198422Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950025794U KR200198422Y1 (en) 1995-09-22 1995-09-22 Semiconductor wafer etching apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950025794U KR200198422Y1 (en) 1995-09-22 1995-09-22 Semiconductor wafer etching apparatus

Publications (2)

Publication Number Publication Date
KR970015297U true KR970015297U (en) 1997-04-28
KR200198422Y1 KR200198422Y1 (en) 2000-12-01

Family

ID=19423976

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950025794U KR200198422Y1 (en) 1995-09-22 1995-09-22 Semiconductor wafer etching apparatus

Country Status (1)

Country Link
KR (1) KR200198422Y1 (en)

Also Published As

Publication number Publication date
KR200198422Y1 (en) 2000-12-01

Similar Documents

Publication Publication Date Title
KR970015307U (en) Semiconductor wafer etching equipment
KR970015296U (en) Semiconductor wafer etching equipment
KR970015297U (en) Semiconductor wafer etching equipment
KR970015295U (en) Semiconductor Wafer Etching Equipment
KR970046761U (en) Wafer Boat of Semiconductor Manufacturing Equipment
KR950028650U (en) Semiconductor wafer etching equipment
KR960032741U (en) Plasma etching device of semiconductor device
KR970064182U (en) Semiconductor Wafer Etching Equipment
KR970046659U (en) Semiconductor etching equipment
KR970046742U (en) Semiconductor etching equipment
KR970059843U (en) Wafer Etching Equipment
KR970052818U (en) Etching equipment used for manufacturing semiconductor devices
KR950015661U (en) Semiconductor Wafer Measuring Equipment
KR960019150U (en) Wafer mounting device of semiconductor manufacturing equipment
KR950023953U (en) Semiconductor plasma etching device
KR950031473U (en) Semiconductor wafer drying equipment
KR960029726U (en) Semiconductor Wafer Cleaning Equipment
KR960032725U (en) Semiconductor wafer exposure equipment
KR970003213U (en) Plasma Etching Device for Semiconductor Device Manufacturing
KR970056059U (en) Etching device for semiconductor manufacturing equipment
KR970025802U (en) Wafer etching device
KR970046877U (en) Wafer holding mechanism of semiconductor manufacturing equipment
KR970046703U (en) Clamping of semiconductor etching equipment
KR970019746U (en) Etching device for semiconductor device manufacturing
KR970019745U (en) Etching Device for Semiconductor Manufacturing

Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20050620

Year of fee payment: 6

LAPS Lapse due to unpaid annual fee