KR970705331A - 프린트배선판(printed wiring board) - Google Patents

프린트배선판(printed wiring board)

Info

Publication number
KR970705331A
KR970705331A KR1019970700629A KR19970700629A KR970705331A KR 970705331 A KR970705331 A KR 970705331A KR 1019970700629 A KR1019970700629 A KR 1019970700629A KR 19970700629 A KR19970700629 A KR 19970700629A KR 970705331 A KR970705331 A KR 970705331A
Authority
KR
South Korea
Prior art keywords
wiring board
printed wiring
printed
board
wiring
Prior art date
Application number
KR1019970700629A
Other languages
English (en)
Other versions
KR100307776B1 (ko
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP7139501A external-priority patent/JPH08335781A/ja
Priority claimed from JP14451695A external-priority patent/JPH08340173A/ja
Application filed filed Critical
Publication of KR970705331A publication Critical patent/KR970705331A/ko
Application granted granted Critical
Publication of KR100307776B1 publication Critical patent/KR100307776B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0588—Second resist used as pattern over first resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
KR1019970700629A 1995-06-06 1996-06-06 프린트배선판 KR100307776B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP7139501A JPH08335781A (ja) 1995-06-06 1995-06-06 多層プリント配線板
JP95-139501 1995-06-06
JP14451695A JPH08340173A (ja) 1995-06-12 1995-06-12 プリント配線板
JP95-144516 1995-06-12
PCT/JP1996/001539 WO1996039796A1 (fr) 1995-06-06 1996-06-06 Plaquette de circuit imprime

Publications (2)

Publication Number Publication Date
KR970705331A true KR970705331A (ko) 1997-09-06
KR100307776B1 KR100307776B1 (ko) 2001-11-22

Family

ID=26472294

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019970700629A KR100307776B1 (ko) 1995-06-06 1996-06-06 프린트배선판

Country Status (7)

Country Link
US (2) US6291778B1 (ko)
EP (1) EP0776150B1 (ko)
KR (1) KR100307776B1 (ko)
CN (1) CN1080981C (ko)
DE (1) DE69636212T2 (ko)
SG (2) SG65717A1 (ko)
WO (1) WO1996039796A1 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100546695B1 (ko) * 2000-08-24 2006-01-26 앰코 테크놀로지 코리아 주식회사 반도체 패키지 제조용 가요성 필름 구조
KR100906931B1 (ko) * 1998-02-26 2009-07-10 이비덴 가부시키가이샤 필드 바이어 구조를 갖는 다층프린트 배선판

Families Citing this family (30)

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JP3050807B2 (ja) 1996-06-19 2000-06-12 イビデン株式会社 多層プリント配線板
JP3050812B2 (ja) 1996-08-05 2000-06-12 イビデン株式会社 多層プリント配線板
WO1999003316A1 (fr) * 1997-07-08 1999-01-21 Ibiden Co., Ltd. Carte a circuits imprimes et procede de fabrication de ladite carte
US6141870A (en) 1997-08-04 2000-11-07 Peter K. Trzyna Method for making electrical device
CN1971899B (zh) 1997-10-17 2010-05-12 揖斐电株式会社 封装基板
WO1999034654A1 (fr) * 1997-12-29 1999-07-08 Ibiden Co., Ltd. Plaquette a circuits imprimes multicouche
JPH11297889A (ja) * 1998-04-16 1999-10-29 Sony Corp 半導体パッケージおよび実装基板、ならびにこれらを用いた実装方法
JP2001251040A (ja) * 2000-03-06 2001-09-14 Stanley Electric Co Ltd 高周波用回路基板及びその製造方法
JP2001274537A (ja) * 2000-03-28 2001-10-05 Ngk Spark Plug Co Ltd 配線基板及び配線基板の製造方法
US7759803B2 (en) * 2001-07-25 2010-07-20 Rohm Co., Ltd. Semiconductor device and method of manufacturing the same
EP1392089A1 (en) * 2002-08-21 2004-02-25 Ultratera Corporation Printed circuit board with self align bonding pads thereon
DE112005000522T5 (de) * 2004-03-03 2007-01-18 Shinko Electric Industries Co., Ltd. Platinen-Herstellungsverfahren und Platine
US7190157B2 (en) * 2004-10-25 2007-03-13 Agilent Technologies, Inc. Method and apparatus for layout independent test point placement on a printed circuit board
JP5050384B2 (ja) 2006-03-31 2012-10-17 富士通セミコンダクター株式会社 半導体装置およびその製造方法
US20080123335A1 (en) * 2006-11-08 2008-05-29 Jong Kun Yoo Printed circuit board assembly and display having the same
JP2008147458A (ja) * 2006-12-11 2008-06-26 Nec Electronics Corp プリント配線板およびその製造方法
CN100531527C (zh) * 2007-01-23 2009-08-19 李东明 印刷电路板掩膜露孔电镀成型工艺
JP2008205132A (ja) * 2007-02-19 2008-09-04 Nec Corp プリント配線板及びこれとフレキシブルプリント基板とのはんだ接続構造並びに方法
JP2009246166A (ja) * 2008-03-31 2009-10-22 Fujitsu Ltd 電子部品パッケージおよび基板ユニット並びにプリント配線板およびその製造方法
KR101022942B1 (ko) * 2008-11-12 2011-03-16 삼성전기주식회사 흐름 방지용 댐을 구비한 인쇄회로기판 및 그 제조방법
US8388824B2 (en) * 2008-11-26 2013-03-05 Enthone Inc. Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers
JP5269563B2 (ja) * 2008-11-28 2013-08-21 新光電気工業株式会社 配線基板とその製造方法
KR101038235B1 (ko) 2009-08-31 2011-06-01 삼성전기주식회사 인쇄회로기판
CN101754579B (zh) * 2009-11-16 2012-02-22 华为终端有限公司 城堡式模块及终端设备
TW201325338A (zh) * 2011-12-14 2013-06-16 Wistron Corp 避免金手指結構沾錫之電路板
KR20140086531A (ko) * 2012-12-28 2014-07-08 삼성전기주식회사 패키지 기판 및 그 제조방법, 그리고 패키지 온 패키지 기판
KR20160010960A (ko) * 2014-07-21 2016-01-29 삼성전기주식회사 인쇄회로기판 및 그 제조방법
US10515884B2 (en) * 2015-02-17 2019-12-24 Advanced Semiconductor Engineering, Inc. Substrate having a conductive structure within photo-sensitive resin
US10204889B2 (en) * 2016-11-28 2019-02-12 Taiwan Semiconductor Manufacturing Co., Ltd. Package structure and method of forming thereof
US20220046792A1 (en) * 2020-08-07 2022-02-10 Infineon Technologies Ag Pre-Plating of Solder Layer on Solderable Elements for Diffusion Soldering

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US4118595A (en) * 1977-06-06 1978-10-03 Bell Telephone Laboratories, Incorporated Crossovers and method of fabrication
FR2567709B1 (fr) * 1984-07-11 1990-11-09 Nec Corp Ensemble a paillette comprenant un substrat de cablage multi-couche
AT389793B (de) * 1986-03-25 1990-01-25 Philips Nv Leiterplatte fuer gedruckte schaltungen und verfahren zur herstellung solcher leiterplatten
US4866507A (en) * 1986-05-19 1989-09-12 International Business Machines Corporation Module for packaging semiconductor integrated circuit chips on a base substrate
JPH0311792A (ja) 1989-06-09 1991-01-21 Fujitsu Ltd はんだバンプの形成方法
JPH045844A (ja) * 1990-04-23 1992-01-09 Nippon Mektron Ltd Ｉｃ搭載用多層回路基板及びその製造法
FR2666173A1 (fr) * 1990-08-21 1992-02-28 Thomson Csf Structure hybride d'interconnexion de circuits integres et procede de fabrication.
JPH04337695A (ja) 1991-05-15 1992-11-25 Hitachi Cable Ltd 多層配線構造体
JPH04354398A (ja) 1991-05-31 1992-12-08 Internatl Business Mach Corp <Ibm> 配線基板及びその製造方法
JP2541063Y2 (ja) * 1991-09-04 1997-07-09 日本電気株式会社 プリント基板のパターン構造
JP2658661B2 (ja) * 1991-09-18 1997-09-30 日本電気株式会社 多層印刷配線板の製造方法
JPH0572177U (ja) * 1992-03-05 1993-09-28 ティーディーケイ株式会社 多層基板による回路モジュール
JPH05206622A (ja) * 1992-07-23 1993-08-13 Ibiden Co Ltd プリント配線板
JP2713037B2 (ja) * 1992-07-30 1998-02-16 凸版印刷株式会社 プリント配線板及びその製造方法
JPH0669615A (ja) 1992-08-21 1994-03-11 Ibiden Co Ltd プリント配線板
JPH07112107B2 (ja) 1992-12-21 1995-11-29 日本電気株式会社 プリント配線板及びその製造方法
JPH06204631A (ja) 1993-01-08 1994-07-22 Nec Toyama Ltd 印刷配線板
DE4310930A1 (de) * 1993-04-02 1994-10-06 Siemens Ag Leiterplattenanordnung und Verfahren zur Herstellung einer bestückten Leiterplatte
JPH06350230A (ja) 1993-06-08 1994-12-22 Fujitsu Ten Ltd プリント配線基板及びその製造方法
JPH0794885A (ja) 1993-09-20 1995-04-07 Fujitsu Ltd 並設プラグイン実装用プリント板の前面板
JP2550881B2 (ja) * 1993-09-27 1996-11-06 日本電気株式会社 プリント配線板及びその検査方法
KR0141952B1 (ko) * 1994-12-19 1998-06-01 문정환 반도체 패키지 및 그 제조방법

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100906931B1 (ko) * 1998-02-26 2009-07-10 이비덴 가부시키가이샤 필드 바이어 구조를 갖는 다층프린트 배선판
US7622183B2 (en) 1998-02-26 2009-11-24 Ibiden Co., Ltd. Multilayer printed wiring board with filled viahole structure
US7737366B2 (en) 1998-02-26 2010-06-15 Ibiden Co., Ltd. Multilayer printed wiring board with filled viahole structure
US8115111B2 (en) 1998-02-26 2012-02-14 Ibiden Co., Ltd. Multilayer printed wiring board with filled viahole structure
US8987603B2 (en) 1998-02-26 2015-03-24 Ibiden Co,. Ltd. Multilayer printed wiring board with filled viahole structure
KR100546695B1 (ko) * 2000-08-24 2006-01-26 앰코 테크놀로지 코리아 주식회사 반도체 패키지 제조용 가요성 필름 구조

Also Published As

Publication number Publication date
CN1080981C (zh) 2002-03-13
US6303880B1 (en) 2001-10-16
DE69636212T2 (de) 2007-04-05
DE69636212D1 (de) 2006-07-20
EP0776150A1 (en) 1997-05-28
SG71838A1 (en) 2000-04-18
EP0776150A4 (en) 1999-03-31
US6291778B1 (en) 2001-09-18
WO1996039796A1 (fr) 1996-12-12
SG65717A1 (en) 1999-06-22
EP0776150B1 (en) 2006-06-07
CN1155968A (zh) 1997-07-30
KR100307776B1 (ko) 2001-11-22

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