KR970703202A - 구멍 설치원판을 제조하는 방법(Method for the making holeplate) - Google Patents

구멍 설치원판을 제조하는 방법(Method for the making holeplate) Download PDF

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KR970703202A
KR970703202A KR1019960706876A KR19960706876A KR970703202A KR 970703202 A KR970703202 A KR 970703202A KR 1019960706876 A KR1019960706876 A KR 1019960706876A KR 19960706876 A KR19960706876 A KR 19960706876A KR 970703202 A KR970703202 A KR 970703202A
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South Korea
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photoresist
layer
hole mounting
mounting disc
disc
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KR1019960706876A
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KR100478540B1 (ko
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안트 스테판
한 디트마
푹스 하인쯔
플릭 고트프리트
단테스 귄터
뫼르쉬 길버트
노박 테트레프
헤쎄 외르그
발츠 베아테
사쯔 프랑크
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랄프 홀거 베렌스; 게오르그 뮐러
로베르트 보쉬 게엠베하
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Priority claimed from PCT/DE1996/000512 external-priority patent/WO1996030645A1/de
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/164Manufacturing processes thin film formation
    • B41J2/1643Manufacturing processes thin film formation thin film formation by plating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/34Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to influence the nature of flow of the liquid or other fluent material, e.g. to produce swirl
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F02COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
    • F02MSUPPLYING COMBUSTION ENGINES IN GENERAL WITH COMBUSTIBLE MIXTURES OR CONSTITUENTS THEREOF
    • F02M61/00Fuel-injectors not provided for in groups F02M39/00 - F02M57/00 or F02M67/00
    • F02M61/16Details not provided for in, or of interest apart from, the apparatus of groups F02M61/02 - F02M61/14
    • F02M61/18Injection nozzles, e.g. having valve seats; Details of valve member seated ends, not otherwise provided for
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/162Manufacturing of the nozzle plates
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1626Manufacturing processes etching
    • B41J2/1628Manufacturing processes etching dry etching
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1626Manufacturing processes etching
    • B41J2/1629Manufacturing processes etching wet etching
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1631Manufacturing processes photolithography
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1632Manufacturing processes machining
    • B41J2/1634Manufacturing processes machining laser machining
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/164Manufacturing processes thin film formation
    • B41J2/1646Manufacturing processes thin film formation thin film formation by sputtering
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00Electroforming
    • C25D1/10Moulds; Masks; Masterforms
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F02COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
    • F02MSUPPLYING COMBUSTION ENGINES IN GENERAL WITH COMBUSTIBLE MIXTURES OR CONSTITUENTS THEREOF
    • F02M51/00Fuel-injection apparatus characterised by being operated electrically
    • F02M51/06Injectors peculiar thereto with means directly operating the valve needle
    • F02M51/061Injectors peculiar thereto with means directly operating the valve needle using electromagnetic operating means
    • F02M51/0625Injectors peculiar thereto with means directly operating the valve needle using electromagnetic operating means characterised by arrangement of mobile armatures
    • F02M51/0664Injectors peculiar thereto with means directly operating the valve needle using electromagnetic operating means characterised by arrangement of mobile armatures having a cylindrically or partly cylindrically shaped armature, e.g. entering the winding; having a plate-shaped or undulated armature entering the winding
    • F02M51/0671Injectors peculiar thereto with means directly operating the valve needle using electromagnetic operating means characterised by arrangement of mobile armatures having a cylindrically or partly cylindrically shaped armature, e.g. entering the winding; having a plate-shaped or undulated armature entering the winding the armature having an elongated valve body attached thereto
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F02COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
    • F02MSUPPLYING COMBUSTION ENGINES IN GENERAL WITH COMBUSTIBLE MIXTURES OR CONSTITUENTS THEREOF
    • F02M61/00Fuel-injectors not provided for in groups F02M39/00 - F02M57/00 or F02M67/00
    • F02M61/16Details not provided for in, or of interest apart from, the apparatus of groups F02M61/02 - F02M61/14
    • F02M61/162Means to impart a whirling motion to fuel upstream or near discharging orifices
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F02COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
    • F02MSUPPLYING COMBUSTION ENGINES IN GENERAL WITH COMBUSTIBLE MIXTURES OR CONSTITUENTS THEREOF
    • F02M61/00Fuel-injectors not provided for in groups F02M39/00 - F02M57/00 or F02M67/00
    • F02M61/16Details not provided for in, or of interest apart from, the apparatus of groups F02M61/02 - F02M61/14
    • F02M61/168Assembling; Disassembling; Manufacturing; Adjusting
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F02COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
    • F02MSUPPLYING COMBUSTION ENGINES IN GENERAL WITH COMBUSTIBLE MIXTURES OR CONSTITUENTS THEREOF
    • F02M61/00Fuel-injectors not provided for in groups F02M39/00 - F02M57/00 or F02M67/00
    • F02M61/16Details not provided for in, or of interest apart from, the apparatus of groups F02M61/02 - F02M61/14
    • F02M61/18Injection nozzles, e.g. having valve seats; Details of valve member seated ends, not otherwise provided for
    • F02M61/1853Orifice plates
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0015Production of aperture devices, microporous systems or stamps
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/12Production of screen printing forms or similar printing forms, e.g. stencils
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23HWORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H9/00Machining specially adapted for treating particular metal objects or for obtaining special effects or results on metal objects

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  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Fuel-Injection Apparatus (AREA)
  • Nozzles (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

발명에 의한 구멍설치판은 유입개구(36)와 유출개구(38)와 양 개구 사이에 설치된 적어도 하나의 통로(42)로서 형성된 유체를 위한 완전한 축방향 관유로가 제공됨으로써 우수하다. 각각 특징적인 개구구조(36,38,42)를 구비한 구멍설치판(23)의 적어도 3개의 기능평면(35,37,40)은 전기도금에 의한 금속석출에 의해서 연속적으로 형성된다(다층 전기도금), 구멍설치판(23)의 전기도금 석출된 층은 1개 또는 다수의 기능평면(35,37,40)을 가지고 있어서 좋다. 구멍설치판(23)은 연료분사 장치에서의 분사밸브, 래커도포노즐, 흡입기, 잉크제트 프린터 또는 동결 건조법에 있어서, 액체, 예를 들면 음료의 분사 또는 약품의 분무를 위해 사용하기에는 매우 적합하다.

Description

구멍 설치원판을 제조하는 방법(Method for the making holeplate)
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제3도는 제2도의 III-III선을 따른 구멍설치판의 단면도를 나타내고 있다.

Claims (11)

  1. 하나 이상의 유입개구와, 적어도 하나 이상의 유출개구가 설치되어 있고, 각각의 유입개구가 구멍설치판 상측의 층 또는 상측의 기능면에 설치되어 있고 각 유출개구가 구멍설치판 하측의 층 또는 하측의 기능면에 설치되어 있고 각 유출개구가 구멍설치판 하측의 층 또는 하측의 기능면에 설치되어 있는 유체를 완전히 통과시키는 원판을 제조하는 방법에 있어서, 구멍설치판(23)에 설치된 각 층 또는 각 기능평면(35,35',37,40,40')이 전기도금 금속 석출(다층 전기도금)에 의해서 연속적으로 형성되어 있는 것을 특징으로 하는 구멍 설치원판을 제조하는 방법.
  2. 제1항에 있어서, 지지 플레이트(60)의 재료가 비전도성인 경우, 제1제조단계에서 지지 플레이트(60)상에, 별개의 방법 단계를 실시한 한개 이상 필요한 보조층(61,61',61")을 도포하는 단계와, 이후에 포토레지스트층(63)을 도포하는 단계와, 이후에 포토레지스트(63)를 소망하는 구조로 형성하는 단계와, 그에 의해서, 포토레지스트(63)에 구멍설치원판(23)의 후층(37)을 위한 네가티브 구조(66)를 형성하는 단계와, 마이크로 갈바니전지에 의해 포토레지스트(63)의 네가티브 구조(66)를 생성시키는 레지스트홈(68)을 금속 도금에 의해 금속(70)으로 채우는 단계와 구멍설치원판(23)의 층과 기능면(35,35',37,40,40')을 소망하는 갯수만큼 상기 방법을 반복하는 단계와, 최후에 구멍설치원판(23)을 개별화하는 단계와, 포트레지스트(63)를 금속구조체로부터 뽑아내는 단계를 포함하는 것을 특징으로 하는 구멍 설치원판을 제조하는 방법.
  3. 제2항에 있어서, 보조층(6I)은 전기도금한 개시층(61')을 도포하는 것을 특징으로 하는 구멍 설치원판을 제조하는 방법.
  4. 제2항에 있어서, 고체 레지스트를 표층처리한 포토레지스트(63)를 도포하는 것을 특징으로 하는 구멍 설치원판을 제조하는 방법.
  5. 제2항에 있어서, 액체 레지스트를 원심분리하는 포토레지스트(63)를 도포하는 것을 특징으로 하는 구멍 설치원판을 제조하는 방법.
  6. 제2항에 있어서, 액상 상태인 폴리이미드를 원심분리하는 포토레지스트(63)를 도포하는 것을 특징으로 하는 구멍 설치원판을 제조하는 방법.
  7. 제2항에 있어서, UV 조사광(65)이 마스크(64)를 통과하게 하고(UV-깊이 리소그래프), 차후에 현상시켜 포토레지스트(63) 구조를 형성하는 것을 특징으로 하는 구멍 설치원판을 제조하는 방법.
  8. 제2항에 있어서, 포토리소그래프로 구조형성된 포토레지스트(63)의 드라이엣칭 공정에서 마스크로서 사용되는 산화물 또는 질화물을 석출하여 포트레지스트(63)의 구조를 형성하는 것을 특징으로 하는 구멍 설치원판을 제조하는 방법.
  9. 제2항에 있어서, 포토레지스트(63)의 구조형성은 레저를 이용하여 박리시키는 것을 특징으로 하는 구멍 설치원판을 제조하는 방법.
  10. 제1항 또는 제2항에 있어서, 구멍설치원판(23)의 층은 포토레지스트(23)의 층은 포토레지스트(63')를 통과하는 금속(70)을 수평방향 및 연직방향으로 성장시키는(측방향 과성장) 전기도금단계에서, 다수의 기능면(35,35',40,40')으로 제조되는 것을 특징으로 하는 구멍 설치원판을 제조하는 방법.
  11. 제10항에 있어서, 빠른 측방향 과성장도 구멍설치원판(23)의 개별층(35,37)의 입력 개구(36)와 출력개구(38)가 과성장된 기능평면(35')의 재료에 의해 완전히 덮히면 중단되는 것을 특징으로 하는 구멍 설치원판을 제조하는 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960706876A 1995-03-29 1996-03-23 천공원판제조방법 KR100478540B1 (ko)

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DE19607288A DE19607288A1 (de) 1995-03-29 1996-02-27 Verfahren zur Herstellung einer Lochscheibe
DE19607288.3 1996-02-27
PCT/DE1996/000512 WO1996030645A1 (de) 1995-03-29 1996-03-23 Verfahren zur herstellung einer lochscheibe

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DE19607288A1 (de) 1996-10-02
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EP1184565A3 (de) 2003-10-15
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KR100442897B1 (ko) 2004-12-03
DE19607266A1 (de) 1996-10-02

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