KR970059802A - 액정표시장치의 제조방법 - Google Patents
액정표시장치의 제조방법 Download PDFInfo
- Publication number
- KR970059802A KR970059802A KR1019970000955A KR19970000955A KR970059802A KR 970059802 A KR970059802 A KR 970059802A KR 1019970000955 A KR1019970000955 A KR 1019970000955A KR 19970000955 A KR19970000955 A KR 19970000955A KR 970059802 A KR970059802 A KR 970059802A
- Authority
- KR
- South Korea
- Prior art keywords
- energy beam
- linear energy
- liquid crystal
- linear
- scanning
- Prior art date
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- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract 8
- 238000004519 manufacturing process Methods 0.000 title claims abstract 7
- 238000000034 method Methods 0.000 claims abstract 7
- 229910021417 amorphous silicon Inorganic materials 0.000 claims abstract 4
- 239000000758 substrate Substances 0.000 claims 7
- 230000003287 optical effect Effects 0.000 claims 4
- 230000001678 irradiating effect Effects 0.000 claims 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims 2
- 229920005591 polysilicon Polymers 0.000 claims 2
- 238000002834 transmittance Methods 0.000 claims 2
- 241000021559 Dicerandra Species 0.000 claims 1
- 235000010654 Melissa officinalis Nutrition 0.000 claims 1
- 239000000865 liniment Substances 0.000 claims 1
- 230000000737 periodic effect Effects 0.000 claims 1
- 239000010409 thin film Substances 0.000 abstract 1
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/1368—Active matrix addressed cells in which the switching element is a three-electrode device
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13454—Drivers integrated on the active matrix substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02422—Non-crystalline insulating materials, e.g. glass, polymers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02491—Conductive materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02494—Structure
- H01L21/02496—Layer structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02494—Structure
- H01L21/02496—Layer structure
- H01L21/02502—Layer structure consisting of two layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H01L21/02675—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
- H01L21/02678—Beam shaping, e.g. using a mask
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H01L21/02675—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
- H01L21/02686—Pulsed laser beam
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H01L21/02691—Scanning of a beam
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
- H01L29/6675—Amorphous silicon or polysilicon transistors
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/091—Laser beam processing of fets
Abstract
Description
Claims (10)
- 기판상에 비정질실리콘층을 형성하는 공정과, 상기 비정질실리콘층에 선 형상 빔을 조사 및 주사하여 비정질실리콘을 다결정실리콘층으로 변환하고 상기 선 형상 에너지 빔의 조사 및 주사는 다결정실리콘층에 변환된 영역전체를 덮도록 그 위치를 이동하여 여러번 실행하는 공정을 구비한 어레이기판을 형성하는 공정; 및 상기 어레이기판과 대향기판을 접착라여 그 간격에 액정을 봉입하는 공정을 구비한 액정표시장치의 제조방법에 있어서, 인접한 각 회수의 단부조사영역이 중복되게 여러번 선 형상 에너지 빔의 주사를 조사하여 중복영역과 비중복영역의 경계가 비직선 형상이 되도록 상기 에너지 빔이 주사되는 것을 특징으로 하는 액정표시장치의 제조방법.
- 제2항에 있어서, 상기 선 형상 에너지 밤의 주사는 주사방향에 대해 수직으로 진동시피면서 실행되는 것을 특징으로 하는 액정표시장치의 제조방법.
- 제1항에 있어서, 상기 여러번의 주사 가운데, n회째와 n+1회째중 적어도 한쪽이 주사방향에 대해 수직으로 진동하면서 주사, 조사하는 것을 특징으로 하는 액정표시장치의 제조방법.
- 제1항에 있어서, 상기 선 형상 에너지 빔은 일정한 방향으로 주사되고, 상기 기판은 주사방향에 대해 수직인 방향으로 진동되는 것을 특징으로 하는 액정표시 장치의 제조방법.
- 제1항에 있어서, 선 형상 에너지 빔이 조사된 상기 기판은 기판의주변부에 장축방향으로 대강 평행한 X구동회로부 및 단축방향으로 대강 평행한 Y구동회로부를 갖고, 선 형상 에너지 빔의 주사방향은 적이도 한쪽의 구동회로부에 대강 평행한 것을 특징으로 하는 액정표시장치의 제조방법.
- 제5항에 있어서, 적어도 한쪽의 구동회로부에는 선 형상 에너지 빔이 한 번의 주사만으로 조사된 것을 특징으로 하는 액정표시장치의 제조방법.
- 제5항에 있어서, 선 형상 에너지 빔의 주사방향은 X구동회로부에 대강 평행한 것을 특징으로 하는 액정표시장치의 제조방법.
- 제1항에 있어서, 상기 중복영역과 비중복영역의 경계의 형상은 주기함수곡선에 근사한 것을 특징으로 하는 액정표시장치의 제조방법.
- 제1항에 있어서, 상기 선 형상 에너지 빔은 엑시머레이저빔인 것을 특징으로 하는 액정표시장치의 제조방법.
- 제1항에 있어서, 상기 선 형상 에너지 빔의 경로에 굴절률 또는 투과율이 변화가능한 복수개의 광변조소자로 이루어진 광변조소자어레이를 배치하고, 선 형상 에너지 빔의 단부에 대응되는 위치에 있는 광변조소자의 굴절률 또는 투과율을 변화시키는 것에 의해 상기 중복영역과 비중복영역의 경계를 비직선적으로 하는 것을 특징으로 하는 액정표시장치의 제조방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP533596 | 1996-01-17 | ||
JP8-005335 | 1996-01-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR970059802A true KR970059802A (ko) | 1997-08-12 |
KR100356424B1 KR100356424B1 (ko) | 2002-11-18 |
Family
ID=11608372
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019970000955A KR100356424B1 (ko) | 1996-01-17 | 1997-01-15 | 액정표시장치의제조방법 |
Country Status (3)
Country | Link |
---|---|
US (1) | US5858807A (ko) |
KR (1) | KR100356424B1 (ko) |
TW (1) | TW375691B (ko) |
Families Citing this family (39)
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US6555449B1 (en) * | 1996-05-28 | 2003-04-29 | Trustees Of Columbia University In The City Of New York | Methods for producing uniform large-grained and grain boundary location manipulated polycrystalline thin film semiconductors using sequential lateral solidfication |
US6081308A (en) * | 1996-11-21 | 2000-06-27 | Samsung Electronics Co., Ltd. | Method for manufacturing liquid crystal display |
JP2842426B2 (ja) * | 1997-01-28 | 1999-01-06 | 日本電気株式会社 | アクティブマトリクス型液晶表示装置およびその製造方法 |
US6326286B1 (en) * | 1998-06-09 | 2001-12-04 | Lg. Philips Lcd Co., Ltd. | Method for crystallizing amorphous silicon layer |
KR100296109B1 (ko) | 1998-06-09 | 2001-10-26 | 구본준, 론 위라하디락사 | 박막트랜지스터제조방법 |
KR100292048B1 (ko) | 1998-06-09 | 2001-07-12 | 구본준, 론 위라하디락사 | 박막트랜지스터액정표시장치의제조방법 |
KR100296110B1 (ko) | 1998-06-09 | 2001-08-07 | 구본준, 론 위라하디락사 | 박막트랜지스터 제조방법 |
TW441112B (en) * | 1999-03-16 | 2001-06-16 | Sanyo Electric Co | Method for making a thin film transistor |
KR100303142B1 (ko) | 1999-10-29 | 2001-11-02 | 구본준, 론 위라하디락사 | 액정표시패널의 제조방법 |
CN1757093A (zh) * | 2002-08-19 | 2006-04-05 | 纽约市哥伦比亚大学托管会 | 具有多种照射图形的单步半导体处理系统和方法 |
JP4873858B2 (ja) * | 2002-08-19 | 2012-02-08 | ザ トラスティーズ オブ コロンビア ユニヴァーシティ イン ザ シティ オブ ニューヨーク | エッジ領域を最小にするために基板のフィルム領域のレーザ結晶化処理方法及び装置並びにそのようなフィルム領域の構造 |
WO2004075263A2 (en) * | 2003-02-19 | 2004-09-02 | The Trustees Of Columbia University In The City Of New York | System and process for processing a plurality of semiconductor thin films which are crystallized using sequential lateral solidification techniques |
JP4583004B2 (ja) * | 2003-05-21 | 2010-11-17 | 株式会社 日立ディスプレイズ | アクティブ・マトリクス基板の製造方法 |
US7164152B2 (en) | 2003-09-16 | 2007-01-16 | The Trustees Of Columbia University In The City Of New York | Laser-irradiated thin films having variable thickness |
WO2005029546A2 (en) | 2003-09-16 | 2005-03-31 | The Trustees Of Columbia University In The City Of New York | Method and system for providing a continuous motion sequential lateral solidification for reducing or eliminating artifacts, and a mask for facilitating such artifact reduction/elimination |
US7318866B2 (en) * | 2003-09-16 | 2008-01-15 | The Trustees Of Columbia University In The City Of New York | Systems and methods for inducing crystallization of thin films using multiple optical paths |
TWI359441B (en) | 2003-09-16 | 2012-03-01 | Univ Columbia | Processes and systems for laser crystallization pr |
US7364952B2 (en) * | 2003-09-16 | 2008-04-29 | The Trustees Of Columbia University In The City Of New York | Systems and methods for processing thin films |
TWI351713B (en) * | 2003-09-16 | 2011-11-01 | Univ Columbia | Method and system for providing a single-scan, con |
WO2005034193A2 (en) * | 2003-09-19 | 2005-04-14 | The Trustees Of Columbia University In The City Ofnew York | Single scan irradiation for crystallization of thin films |
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JP2009518864A (ja) * | 2005-12-05 | 2009-05-07 | ザ トラスティーズ オブ コロンビア ユニヴァーシティ イン ザ シティ オブ ニューヨーク | 膜を加工するためのシステム及び方法並びに薄膜 |
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JP5385289B2 (ja) | 2007-09-25 | 2014-01-08 | ザ トラスティーズ オブ コロンビア ユニヴァーシティ イン ザ シティ オブ ニューヨーク | 横方向に結晶化した薄膜上に作製される薄膜トランジスタデバイスにおいて高い均一性を生成する方法 |
WO2009067688A1 (en) | 2007-11-21 | 2009-05-28 | The Trustees Of Columbia University In The City Of New York | Systems and methods for preparing epitaxially textured polycrystalline films |
US8012861B2 (en) | 2007-11-21 | 2011-09-06 | The Trustees Of Columbia University In The City Of New York | Systems and methods for preparing epitaxially textured polycrystalline films |
CN101919058B (zh) | 2007-11-21 | 2014-01-01 | 纽约市哥伦比亚大学理事会 | 用于制备外延纹理厚膜的系统和方法 |
US20110175099A1 (en) * | 2008-02-29 | 2011-07-21 | The Trustees Of Columbia University In The City Of New York | Lithographic method of making uniform crystalline si films |
US8569155B2 (en) * | 2008-02-29 | 2013-10-29 | The Trustees Of Columbia University In The City Of New York | Flash lamp annealing crystallization for large area thin films |
KR101413370B1 (ko) * | 2008-02-29 | 2014-06-30 | 더 트러스티이스 오브 콜롬비아 유니버시티 인 더 시티 오브 뉴욕 | 결정질 막 제조 방법, 태양전지 형성 방법 및 이 방법에 의해 제조된 결정질 막 및 태양 전지 |
CN102232239A (zh) | 2008-11-14 | 2011-11-02 | 纽约市哥伦比亚大学理事会 | 用于薄膜结晶的系统和方法 |
US9646831B2 (en) | 2009-11-03 | 2017-05-09 | The Trustees Of Columbia University In The City Of New York | Advanced excimer laser annealing for thin films |
US8440581B2 (en) | 2009-11-24 | 2013-05-14 | The Trustees Of Columbia University In The City Of New York | Systems and methods for non-periodic pulse sequential lateral solidification |
US9087696B2 (en) | 2009-11-03 | 2015-07-21 | The Trustees Of Columbia University In The City Of New York | Systems and methods for non-periodic pulse partial melt film processing |
KR20210057248A (ko) | 2019-11-11 | 2021-05-21 | 삼성디스플레이 주식회사 | 레이저 조사 장치 및 레이저 조사 방법 |
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US4963503A (en) * | 1984-04-09 | 1990-10-16 | Hosiden Electronics Co., Ltd. | Method of manufacturing liquid crystal display device |
JPH0278217A (ja) * | 1988-09-14 | 1990-03-19 | Hitachi Ltd | 薄膜半導体装置の製造方法 |
JP2667275B2 (ja) * | 1990-02-14 | 1997-10-27 | 松下電子工業株式会社 | 半導体装置の解析用試料製作方法および解析用試料の記号付け装置 |
DE69127395T2 (de) * | 1990-05-11 | 1998-01-02 | Asahi Glass Co Ltd | Verfahren zum Herstellen eines Dünnfilm-Transistors mit polykristallinem Halbleiter |
JP3149450B2 (ja) * | 1991-04-04 | 2001-03-26 | セイコーエプソン株式会社 | 薄膜トランジスタの製造方法及び製造装置 |
USH1637H (en) * | 1991-09-18 | 1997-03-04 | Offord; Bruce W. | Laser-assisted fabrication of bipolar transistors in silicon-on-sapphire (SOS) |
US5403762A (en) * | 1993-06-30 | 1995-04-04 | Semiconductor Energy Laboratory Co., Ltd. | Method of fabricating a TFT |
-
1996
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- 1996-12-28 TW TW085116204A patent/TW375691B/zh not_active IP Right Cessation
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1997
- 1997-01-15 KR KR1019970000955A patent/KR100356424B1/ko active IP Right Grant
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KR100356424B1 (ko) | 2002-11-18 |
US5858807A (en) | 1999-01-12 |
TW375691B (en) | 1999-12-01 |
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