KR970053294A - 반도체 웨이퍼 고정장치 - Google Patents
반도체 웨이퍼 고정장치 Download PDFInfo
- Publication number
- KR970053294A KR970053294A KR1019950049710A KR19950049710A KR970053294A KR 970053294 A KR970053294 A KR 970053294A KR 1019950049710 A KR1019950049710 A KR 1019950049710A KR 19950049710 A KR19950049710 A KR 19950049710A KR 970053294 A KR970053294 A KR 970053294A
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor wafer
- clamp
- ring
- semiconductor
- chip pattern
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B5/00—Clamps
- B25B5/16—Details, e.g. jaws, jaw attachments
- B25B5/163—Jaws or jaw attachments
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
본 발명은 반도체 에이퍼 에지(edge) 부분의 수율을 향상시키기 위해 클램프의 형성을 개선시킨 반도체 웨이퍼 고정장치에 관한 것이다. 상기 목적을 달성하기 위하여 본 발명은, 평평한 상면을 갖고 반도체 웨이퍼가 놓여지는 플레튼(Platen)과, 상기 플레튼과 반도체 웨이퍼의 사이에 위치하며 탄성력을 갖는 오링과, 상기 오링에 대향되도록 위치하여 반도체 웨이퍼의 상면을 눌러서 고정시키는 클램프(
Clamp)를 구비하는 반도체 웨이퍼 고정장치에 있어서, 상기 클램프는 상기 반도체 웨이퍼의 직경보다 더 큰 내경을 갖는 링형의 판으로서, 상기 반도체 웨이퍼 상의 칩패턴에 따라 상기 칩패턴과 반도체 웨이퍼 외주면 사이의 간격이 일정치 이상이 되는 위치에 대응되도록 다수의 돌기가 내주면에서 중심을 향하여 형성된 것을 특징으로 하는 반도체 웨이퍼 고정장치를 제공한다.
본 발명은 반도체 웨이퍼 표면의 칩패턴에 따라 반도체 칩을 손상시키지 않도록 웨이퍼의 에지부분 만을 고정시킴으로서 수율을 향상시키는 동시에 고정력을 향상시킬 수 있는 효과가 있다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제4도는 본 발명에 의한 클램프의 형상과 웨이퍼를 고정하는 위치를 나타내는 평면도이다.
Claims (3)
- 평평한 상면을 갖고 반도체 웨이퍼가 놓여지는 플레튼(Platen)과, 상기 플레튼과 반도체 웨이퍼의 사이에 위치하며 탄성력을 갖는 오링과, 상기 오링에 대향되도록 위치하여 반도체 웨이퍼의 상면을 눌러서 고정시키는 클램프(Clamp)를 구비하는 반도체 웨이퍼 고정장치에 있어서, 상기 클램프는 상기 반도체 웨이퍼의 직경보다 더 큰 내경을 갖는 링형의 판으로서, 상기 반도체 웨이퍼 상의 칩패턴에 따라 상기 칩패턴과 반도체 웨이퍼 외주면 사이의 간격이 일정치 이상이 되는 위치에 대응되도록 다수의 돌기가 내주면에서 중심을 향하여 형성된 것을 특징으로 하는 반도체 웨이퍼 고정장치.
- 제1항에 있어서, 상기 클램프의 다수의 돌기는 서로 다른 길이를 갖도록 형성된 것을 특징으로 하는 반도체 웨이퍼 고정장치.
- 제1항에 있어서, 상기 클램프의 다수의 돌기는 끝단으로 갈수록 폭이 좁아지게 형성된 것을 특징으로 하는 반도체 웨이퍼 고정장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950049710A KR100207451B1 (ko) | 1995-12-14 | 1995-12-14 | 반도체 웨이퍼 고정장치 |
JP13499496A JPH09181153A (ja) | 1995-12-14 | 1996-05-29 | 半導体ウェーハ固定装置 |
TW085106919A TW315505B (ko) | 1995-12-14 | 1996-06-08 | |
US08/764,586 US5842690A (en) | 1995-12-14 | 1996-12-13 | Semiconductor wafer anchoring device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950049710A KR100207451B1 (ko) | 1995-12-14 | 1995-12-14 | 반도체 웨이퍼 고정장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR970053294A true KR970053294A (ko) | 1997-07-31 |
KR100207451B1 KR100207451B1 (ko) | 1999-07-15 |
Family
ID=19439964
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950049710A KR100207451B1 (ko) | 1995-12-14 | 1995-12-14 | 반도체 웨이퍼 고정장치 |
Country Status (4)
Country | Link |
---|---|
US (1) | US5842690A (ko) |
JP (1) | JPH09181153A (ko) |
KR (1) | KR100207451B1 (ko) |
TW (1) | TW315505B (ko) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100308209B1 (ko) * | 1998-06-20 | 2001-11-30 | 윤종용 | 리플로우공정을 위한 히터 어셈블리의 클램프 |
FR2783970B1 (fr) * | 1998-09-25 | 2000-11-03 | Commissariat Energie Atomique | Dispositif autorisant le traitement d'un substrat dans une machine prevue pour traiter de plus grands substrats et systeme de montage d'un substrat dans ce dispositif |
EP1028176A1 (de) * | 1999-02-12 | 2000-08-16 | Balzers Hochvakuum AG | Werkstückhaltevorrichtung sowie Verfahren zu ihrem Betrieb |
IT1313173B1 (it) * | 1999-08-09 | 2002-06-17 | Essetre Di Sella Giovanni | Macchina utensile per la lavorazione del legno atta a lavorare pezzidi dimensioni variabili e forme complesse e relativo metodo |
IT1313128B1 (it) * | 1999-08-09 | 2002-06-17 | Essetre Di Sella Giovanni | Gruppo di fissaggio per il bloccaggio dei pezzi da lavorare sul pianodi lavoro di una macchina utensile per la lavorazione del legno e |
US6299151B1 (en) * | 1999-12-23 | 2001-10-09 | General Electric Company | Fluid distribution system |
GB0002837D0 (en) * | 2000-02-08 | 2000-03-29 | British Aerospace | Assembling composite structures |
JP2001338878A (ja) * | 2000-03-21 | 2001-12-07 | Sharp Corp | サセプタおよび表面処理方法 |
US20040099375A1 (en) * | 2002-11-21 | 2004-05-27 | Yanghua He | Edge-contact ring for a wafer pedestal |
JP4332409B2 (ja) * | 2003-10-31 | 2009-09-16 | キヤノン株式会社 | 基板保持機構およびそれを用いた露光装置並びにデバイス製造方法 |
US20050176252A1 (en) * | 2004-02-10 | 2005-08-11 | Goodman Matthew G. | Two-stage load for processing both sides of a wafer |
DE102004050822A1 (de) * | 2004-10-19 | 2006-04-20 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Vorrichtung und Verfahren zum Kühlen plattenförmiger Substrate |
WO2007028404A1 (de) * | 2005-09-06 | 2007-03-15 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Vorrichtung zur aufnahme von plattenförmigen materialien für zumindest einen trennvorgang |
US20080002923A1 (en) * | 2006-06-30 | 2008-01-03 | Seagate Technology Llc | Fluid bearing workholder for precision centering |
KR100856019B1 (ko) * | 2008-02-22 | 2008-09-02 | (주)타이닉스 | 플라즈마 처리장치의 기판 홀더 |
TWI381480B (zh) * | 2008-03-20 | 2013-01-01 | Mjc Probe Inc | 晶圓固著裝置及其方法 |
US8276898B2 (en) * | 2008-06-11 | 2012-10-02 | Lam Research Corporation | Electrode transporter and fixture sets incorporating the same |
CN102319680B (zh) * | 2011-08-23 | 2014-05-14 | 广东志成华科光电设备有限公司 | 一种smd led贴片分光机的芯片定位装置 |
US9136155B2 (en) * | 2011-11-17 | 2015-09-15 | Lam Research Ag | Method and device for processing wafer shaped articles |
JP5977038B2 (ja) | 2012-02-15 | 2016-08-24 | 株式会社Screenホールディングス | 熱処理装置 |
US9502278B2 (en) * | 2013-04-22 | 2016-11-22 | International Business Machines Corporation | Substrate holder assembly for controlled layer transfer |
US9227261B2 (en) * | 2013-08-06 | 2016-01-05 | Globalfoundries Inc. | Vacuum carriers for substrate bonding |
JP5538613B1 (ja) * | 2013-11-13 | 2014-07-02 | 東京エレクトロン株式会社 | 接合装置及び接合システム |
CN104851832B (zh) * | 2014-02-18 | 2018-01-19 | 北京北方华创微电子装备有限公司 | 一种固定装置、反应腔室及等离子体加工设备 |
JP6284996B1 (ja) * | 2016-11-04 | 2018-02-28 | Towa株式会社 | 検査方法、樹脂封止装置、樹脂封止方法及び樹脂封止品の製造方法 |
NL2021006B1 (en) | 2018-05-29 | 2019-12-04 | Suss Microtec Lithography Gmbh | Holding apparatus and method for holding a substrate |
CN109624109A (zh) * | 2019-02-20 | 2019-04-16 | 广州安特激光技术有限公司 | 一种晶圆片切割装置的承载台 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4075302A (en) * | 1977-06-13 | 1978-02-21 | University Of Illinois Foundation | Apparatus for gripping and holding small workpieces |
DE2802791A1 (de) * | 1978-01-23 | 1979-07-26 | Niedecker Herbert | Vorrichtung zum bestimmen und spannen von werkstuecken |
US4473455A (en) * | 1981-12-21 | 1984-09-25 | At&T Bell Laboratories | Wafer holding apparatus and method |
US4928936A (en) * | 1986-12-02 | 1990-05-29 | Nikon Corporation | Loading apparatus |
US5228501A (en) * | 1986-12-19 | 1993-07-20 | Applied Materials, Inc. | Physical vapor deposition clamping mechanism and heater/cooler |
DE3803411A1 (de) * | 1988-02-05 | 1989-08-17 | Leybold Ag | Vorrichtung zur halterung von werkstuecken |
US5262029A (en) * | 1988-05-23 | 1993-11-16 | Lam Research | Method and system for clamping semiconductor wafers |
US4952299A (en) * | 1988-10-31 | 1990-08-28 | Eaton Corporation | Wafer handling apparatus |
US5152707A (en) * | 1990-11-13 | 1992-10-06 | Zenith Electronics Corporation | Conformable anvil for supporting in-process face panels of tension mask color cathode ray tubes |
US5451261A (en) * | 1992-09-11 | 1995-09-19 | Matsushita Electric Industrial Co., Ltd. | Metal film deposition apparatus and metal film deposition method |
DE4305750C2 (de) * | 1993-02-25 | 2002-03-21 | Unaxis Deutschland Holding | Vorrichtung zum Halten von flachen, kreisscheibenförmigen Substraten in der Vakuumkammer einer Beschichtungs- oder Ätzanlage |
US5513594A (en) * | 1993-10-20 | 1996-05-07 | Mcclanahan; Adolphus E. | Clamp with wafer release for semiconductor wafer processing equipment |
-
1995
- 1995-12-14 KR KR1019950049710A patent/KR100207451B1/ko not_active IP Right Cessation
-
1996
- 1996-05-29 JP JP13499496A patent/JPH09181153A/ja active Pending
- 1996-06-08 TW TW085106919A patent/TW315505B/zh not_active IP Right Cessation
- 1996-12-13 US US08/764,586 patent/US5842690A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
TW315505B (ko) | 1997-09-11 |
KR100207451B1 (ko) | 1999-07-15 |
US5842690A (en) | 1998-12-01 |
JPH09181153A (ja) | 1997-07-11 |
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