KR970030297A - 세로형 확산 및 기상 성장로용의 웨이퍼 보트 - Google Patents
세로형 확산 및 기상 성장로용의 웨이퍼 보트 Download PDFInfo
- Publication number
- KR970030297A KR970030297A KR1019960053631A KR19960053631A KR970030297A KR 970030297 A KR970030297 A KR 970030297A KR 1019960053631 A KR1019960053631 A KR 1019960053631A KR 19960053631 A KR19960053631 A KR 19960053631A KR 970030297 A KR970030297 A KR 970030297A
- Authority
- KR
- South Korea
- Prior art keywords
- wafers
- wafer
- supporting
- support
- wafer boat
- Prior art date
Links
- 238000009792 diffusion process Methods 0.000 title 1
- 235000012431 wafers Nutrition 0.000 claims abstract 27
- 239000013078 crystal Substances 0.000 claims abstract 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Chemical & Material Sciences (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
Abstract
본 발명은 다수의 웨이퍼(8)를 상하로 간격을 두고 서로 지지하는 구조를 갖는 웨이퍼 보트(6)를 개시한다. 이 구조는 웨이퍼들의 둘레 위치들에서 웨이퍼들의 주면들에 대해 거의 수직하게 적합하여 배치된 다수의 지주(9)와, 각각의 지주로부터 각각 횡방향으로 연장하며, 웨이퍼의 이면(11)을 웨이퍼 반경의 2/3에 해당하는 거리만큼 웨이퍼의 중심으로부터 떨어진 그의 위치들에서 지지하는 다수의 지지봉(10)을 포함한다. 웨이퍼들은 (001)-웨이퍼들일 수 있으며, 지지봉들(10)은 웨이퍼 이면(11)을 <100> 또는 <110> 결정 방위에 대응하는 그의 위치들에서 지지할 수 있다. 이러한 구조는 웨이퍼의 자중으로 인해 발생된 응력의 감소를 가능케 한다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제8도는 본 발명의 실시예1을 설명하기 위한 웨이퍼 보느를 나타내는 평면도.
Claims (5)
- 다수의 웨이퍼(8)를 상하로 간격을 두고 서로 지지하는 구조를 갖는 세로형로용 웨이퍼 보트(6)로서, 상기 웨이퍼들의 둘레 위치들에서 상기 웨이퍼들이 주면들에 대해 거의 수직하게 직립하여 배치된 다수의 지주(9)와, 각각의 상기 지주로부터 각각 횡방향으로 연장하며, 각각의 상기 웨이퍼의 이면(11)을 웨이퍼 반경의 2/3에 해당하는 거리만큼 웨이퍼의 중심으로부터 떨어진 그의 위치들에서 지지하는 다수의 지지봉(10)을 구비하는 것을 특징으로 하는 세로형로용의 웨이퍼 보트
- 제1항에 있어서, 상기 웨이퍼들은 (001)-웨이퍼들이고, 상기 지지봉들은 상기 웨이퍼들의 상기 이면들을 <100> 및 <110> 결정 방위들중 하나에 대응하는 그의 위치들에서 지지하는 것을 특징으로 하는 웨이퍼 보트.
- 제2항에 있어서, 상기 지지봉들은 상기 웨이퍼들의 상기 이면들을 점접촉하여 지지하는 둥근 돌출부들(12)을 갖는 것을 특징으로 하는 웨이퍼 보트.
- 제2항에 있어서, 상기 지지봉들은 상기 웨이퍼들의 상기 이면들을 선접촉하여 지지하는 돌출 호선부들(13)을 갖는 것을 특징으로 하는 웨이퍼 보트.
- 제2항에 있어서, 상기 지지봉들은 상기 웨이퍼들의 상기 이면들을 면접촉하여 지지하는 링들(14)을 갖는 것을 특징으로 하는 웨이퍼 보트.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP95-297004 | 1995-11-15 | ||
JP29700495A JPH09139352A (ja) | 1995-11-15 | 1995-11-15 | 縦型炉用ウェーハボート |
Publications (2)
Publication Number | Publication Date |
---|---|
KR970030297A true KR970030297A (ko) | 1997-06-26 |
KR100235078B1 KR100235078B1 (ko) | 1999-12-15 |
Family
ID=17841008
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019960053631A KR100235078B1 (ko) | 1995-11-15 | 1996-11-13 | 세로형 확산 및 기상 성장로용의 웨이퍼 보트 |
Country Status (3)
Country | Link |
---|---|
US (1) | US5779797A (ko) |
JP (1) | JPH09139352A (ko) |
KR (1) | KR100235078B1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100424428B1 (ko) * | 1998-09-28 | 2004-03-24 | 가부시키가이샤 히타치세이사쿠쇼 | 종형로 및 종형로용 웨이퍼보트 |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0889510B1 (en) * | 1996-06-28 | 2007-08-15 | Sumco Corporation | Method and device for heat-treating single-crystal silicon wafer, single-crystal silicon wafer, and process for producing single-crystal silicon wafer |
JP3480280B2 (ja) * | 1997-10-28 | 2003-12-15 | 東京エレクトロン株式会社 | 縦型処理装置 |
DE19882823T1 (de) * | 1997-11-19 | 2001-03-22 | Super Silicon Crystal Res Inst | Einrichtung zum Halten von Halbleiter-Wafer |
DE19839092A1 (de) * | 1998-08-27 | 2000-03-09 | Wacker Siltronic Halbleitermat | Verfahren und Vorrichtung für die Wärmebehandlung von Halbleiterplatten |
US6608689B1 (en) | 1998-08-31 | 2003-08-19 | Therma-Wave, Inc. | Combination thin-film stress and thickness measurement device |
US6171400B1 (en) | 1998-10-02 | 2001-01-09 | Union Oil Company Of California | Vertical semiconductor wafer carrier |
US6225594B1 (en) | 1999-04-15 | 2001-05-01 | Integrated Materials, Inc. | Method and apparatus for securing components of wafer processing fixtures |
US6196211B1 (en) | 1999-04-15 | 2001-03-06 | Integrated Materials, Inc. | Support members for wafer processing fixtures |
US6205993B1 (en) | 1999-04-15 | 2001-03-27 | Integrated Materials, Inc. | Method and apparatus for fabricating elongate crystalline members |
US6455395B1 (en) | 2000-06-30 | 2002-09-24 | Integrated Materials, Inc. | Method of fabricating silicon structures including fixtures for supporting wafers |
US6450346B1 (en) | 2000-06-30 | 2002-09-17 | Integrated Materials, Inc. | Silicon fixtures for supporting wafers during thermal processing |
US6727191B2 (en) * | 2001-02-26 | 2004-04-27 | Integrated Materials, Inc. | High temperature hydrogen anneal of silicon wafers supported on a silicon fixture |
US6799940B2 (en) | 2002-12-05 | 2004-10-05 | Tokyo Electron Limited | Removable semiconductor wafer susceptor |
JP3781014B2 (ja) * | 2003-03-31 | 2006-05-31 | 株式会社Sumco | シリコンウェーハ熱処理治具およびシリコンウェーハ熱処理方法 |
US20050205502A1 (en) * | 2004-03-18 | 2005-09-22 | Brown Steven A | Rails for semiconductor wafer carriers |
US20060027171A1 (en) * | 2004-08-06 | 2006-02-09 | Taiwan Semiconductor Manufacturing Co., Ltd. | Wafer boat for reducing wafer warpage |
US7033168B1 (en) * | 2005-01-24 | 2006-04-25 | Memc Electronic Materials, Inc. | Semiconductor wafer boat for a vertical furnace |
JP4652177B2 (ja) * | 2005-09-02 | 2011-03-16 | 株式会社デンソー | 半導体装置の製造方法およびその製造方法の実施に用いられる製造装置 |
US8449238B2 (en) * | 2006-10-11 | 2013-05-28 | Sunpower Corporation | In-line furnace conveyors with integrated wafer retainers |
JP5205737B2 (ja) * | 2006-10-13 | 2013-06-05 | 株式会社Sumco | シリコンウェーハの保持方法および保持治具 |
JP5205738B2 (ja) * | 2006-10-16 | 2013-06-05 | 株式会社Sumco | シリコンウェーハの支持方法、熱処理治具および熱処理ウェーハ |
JP5071217B2 (ja) * | 2008-04-17 | 2012-11-14 | 信越半導体株式会社 | 縦型熱処理用ボートおよびそれを用いたシリコンウエーハの熱処理方法 |
JP2009088550A (ja) * | 2008-12-01 | 2009-04-23 | Hitachi Kokusai Electric Inc | 保治具、及び半導体装置の製造方法 |
US8865602B2 (en) * | 2012-09-28 | 2014-10-21 | Applied Materials, Inc. | Edge ring lip |
JP6054213B2 (ja) * | 2013-03-11 | 2016-12-27 | 東京エレクトロン株式会社 | 支持部材及び半導体製造装置 |
US20150128863A1 (en) * | 2013-11-14 | 2015-05-14 | Taiwan Semiconductor Manufacturing Co., Ltd. | Mechanisms for furnace apparatus and wafer boat |
JP6303592B2 (ja) * | 2014-02-25 | 2018-04-04 | 東京エレクトロン株式会社 | 基板処理装置 |
JP6469046B2 (ja) * | 2016-07-15 | 2019-02-13 | クアーズテック株式会社 | 縦型ウエハボート |
TW202201609A (zh) * | 2020-06-26 | 2022-01-01 | 環球晶圓股份有限公司 | 用於在爐內支撐半導體晶圓之晶圓舟 |
US12046495B2 (en) * | 2020-06-26 | 2024-07-23 | Globalwafers Co., Ltd. | Wafer boats for supporting semiconductor wafers in a furnace |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61191015A (ja) * | 1985-02-20 | 1986-08-25 | Hitachi Ltd | 半導体の気相成長方法及びその装置 |
JPH0217633A (ja) * | 1988-07-05 | 1990-01-22 | Nec Corp | 縦型ウェハーボート |
JPH02102523A (ja) * | 1988-10-11 | 1990-04-16 | Nec Corp | ウェハーボート |
US5169453A (en) * | 1989-03-20 | 1992-12-08 | Toyoko Kagaku Co., Ltd. | Wafer supporting jig and a decompressed gas phase growth method using such a jig |
US5169684A (en) * | 1989-03-20 | 1992-12-08 | Toyoko Kagaku Co., Ltd. | Wafer supporting jig and a decompressed gas phase growth method using such a jig |
US5310339A (en) * | 1990-09-26 | 1994-05-10 | Tokyo Electron Limited | Heat treatment apparatus having a wafer boat |
US5536918A (en) * | 1991-08-16 | 1996-07-16 | Tokyo Electron Sagami Kabushiki Kaisha | Heat treatment apparatus utilizing flat heating elements for treating semiconductor wafers |
US5393349A (en) * | 1991-08-16 | 1995-02-28 | Tokyo Electron Sagami Kabushiki Kaisha | Semiconductor wafer processing apparatus |
JP3332168B2 (ja) * | 1992-11-30 | 2002-10-07 | 東芝セラミックス株式会社 | 縦型ボート及びその製造方法 |
US5492229A (en) * | 1992-11-27 | 1996-02-20 | Toshiba Ceramics Co., Ltd. | Vertical boat and a method for making the same |
US5556275A (en) * | 1993-09-30 | 1996-09-17 | Tokyo Electron Limited | Heat treatment apparatus |
JPH07254591A (ja) * | 1994-03-16 | 1995-10-03 | Toshiba Corp | 熱処理装置 |
US5618351A (en) * | 1995-03-03 | 1997-04-08 | Silicon Valley Group, Inc. | Thermal processing apparatus and process |
-
1995
- 1995-11-15 JP JP29700495A patent/JPH09139352A/ja active Pending
-
1996
- 1996-11-13 US US08/747,086 patent/US5779797A/en not_active Expired - Fee Related
- 1996-11-13 KR KR1019960053631A patent/KR100235078B1/ko not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100424428B1 (ko) * | 1998-09-28 | 2004-03-24 | 가부시키가이샤 히타치세이사쿠쇼 | 종형로 및 종형로용 웨이퍼보트 |
Also Published As
Publication number | Publication date |
---|---|
KR100235078B1 (ko) | 1999-12-15 |
JPH09139352A (ja) | 1997-05-27 |
US5779797A (en) | 1998-07-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR970030297A (ko) | 세로형 확산 및 기상 성장로용의 웨이퍼 보트 | |
KR0129656B1 (ko) | 종형보트 및 그 제조방법 | |
US5931666A (en) | Slip free vertical rack design having rounded horizontal arms | |
CA2258080A1 (en) | Nitride semiconductor growth method, nitride semiconductor substrate, and nitride semiconductor device | |
WO2003007336A3 (en) | Wafer boat with arcuate wafer support arms | |
KR940016668A (ko) | 수직 보트 및 웨이퍼 지지체 | |
CA2347295A1 (en) | Holding device for semiconductor wafers | |
KR100424428B1 (ko) | 종형로 및 종형로용 웨이퍼보트 | |
NO974596D0 (no) | Transplantasjon av genetisk modifiserte celler som har lave nivåer av klasse I MCH proteiner på celleoverflaten | |
JPH04304652A (ja) | 熱処理装置用ボート | |
JPS6437072A (en) | Semiconductor laser array device | |
KR900015261A (ko) | 웨이퍼 지지용치구 및 이 치구를 사용하는 감압기상 성장방법 | |
KR0136549Y1 (ko) | 저압 화학 기상 증착 장치용 웨이퍼 보트 | |
SU1749110A1 (ru) | Судовой фундамент | |
JP2568209B2 (ja) | 半導体処理用カンチレバ− | |
ATE66714T1 (de) | Verankerungsblock. | |
KR200198450Y1 (ko) | 반도체 웨이퍼 검사장비의 척 | |
JPS6034881Y2 (ja) | 炉底支持装置 | |
SU1682506A2 (ru) | Опора линии электропередачи | |
JPH09298236A (ja) | 基板支持治具及び基板支持手段 | |
JPH02123736A (ja) | 縦型熱処理炉用ウェハボート | |
JPH0117244B2 (ko) | ||
JP2547959Y2 (ja) | ウェーハ支持装置 | |
JPH053244A (ja) | ウエハ治具 | |
SU1471163A1 (ru) | Устройство дл разгрузки зеркал |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20030915 Year of fee payment: 5 |
|
LAPS | Lapse due to unpaid annual fee |