KR970024042A - 관통슬롯 둘레에 에폭시 배리어가 형성된 기판 및 이를 이용한 향상된 습기 방출특성을 갖는 볼 그리드 어레이 - Google Patents

관통슬롯 둘레에 에폭시 배리어가 형성된 기판 및 이를 이용한 향상된 습기 방출특성을 갖는 볼 그리드 어레이 Download PDF

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KR970024042A
KR970024042A KR1019950037513A KR19950037513A KR970024042A KR 970024042 A KR970024042 A KR 970024042A KR 1019950037513 A KR1019950037513 A KR 1019950037513A KR 19950037513 A KR19950037513 A KR 19950037513A KR 970024042 A KR970024042 A KR 970024042A
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pcb substrate
package structure
attached
semiconductor package
epoxy
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KR1019950037513A
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KR0170024B1 (ko
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하선호
허영욱
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황인길
아남산업 주식회사
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Priority to KR1019950037513A priority Critical patent/KR0170024B1/ko
Priority to US08/736,107 priority patent/US5767446A/en
Priority to JP8302542A priority patent/JP2899958B2/ja
Publication of KR970024042A publication Critical patent/KR970024042A/ko
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Publication of KR0170024B1 publication Critical patent/KR0170024B1/ko

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Abstract

본 발명은 BGA 반도체 패키지 구조에 관한 것으로, 반도체 칩이 부착되는 부분의 PCB기판에 형성된 열방출용 구멍 주변에 홈 또는 댐을 형성하여 에폭시를 도포시 상기 구멍으로 에폭시가 누출되는 것을 방지하고, 고온의 제조 공정중 반도체 칩과 PCB기판과의 계면에서 발생되는 박리 및 패키지의 크랙을 방지하여 패키지의 신뢰성을 향상시킨 BGA 반도체 패키지 구조이다.

Description

관통슬롯 둘레에 에폭시 배리어가 형성된 기판 및 이를 이용한 향상된 습기 방출특성을 갖는 볼 그리드 어레이
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 3A 도 내지 제 3B 도는 본 발명에 따른 제 1 실시예를 도시한 BGA 반도체 패키지의 단면도,
제 4 도는 본 발명에 따른 제 2 실시예를 도시한 BGA 반도체 패키지의 단면도.

Claims (4)

  1. 구리층과 솔더레지스트층이 도포된 PCB기판의 저면에는 다수의 솔더볼이 부착되고, 상부에는 반도체 칩이 에폭시에 의해 부착되며, 상기 반도체 칩이 부착된 부위의 PCB기판에는 구멍이 형성되고, 상기 반도체 칩과 PCB기판 상에는 와이어로 본딩되며, 그 외부는 컴파운드 몰딩된 BGA 반도체 패키지 구조에 있어서, 상기 PCB 기판에 형성된 구멍의 주변에 홈을 형성하여서 된 것을 특징으로 하는 BGA 반도체 패키지 구조.
  2. 제 1 항에 있어서, 상기 홈은 솔더레지스트층과 구리층을 파내서 형성한 것을 특징으로 하는 BGA 반도체 패키지 구조.
  3. 제 1 항에 있어서, 상기 홈은 솔더레지스트층을 파내서 형성한 것을 특징으로 하는 BGA 반도체 패키지 구조.
  4. 구리층과 솔더레지스트층이 도포된 PCB기판의 저면에는 다수의 솔더볼이 부착되고, 상부에는 반도체 칩이 에폭시에 의해 부착되며, 상기 반도체 칩이 부착된 부위의 PCB기판에는 구멍이 형성되고, 상기 반도체 칩과 PCB기판 상에는 와이어로 본딩되며, 그 외부는 컴파운드 몰딩된 BGA 반도체 패키지 구조에 있어서, 상기 PCB 기판에 형성된 구멍의 주변에 댐을 형성하여서 된 것을 특징으로 하는 BGA 반도체 패키지 구조.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950037513A 1995-10-27 1995-10-27 관통 슬롯 둘레에 에폭시 배리어가 형성된 기판 및 이를 이용한 향상된 습기 방출 특성을 갖는 볼 그리드 어레이 반도체 패키지 KR0170024B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1019950037513A KR0170024B1 (ko) 1995-10-27 1995-10-27 관통 슬롯 둘레에 에폭시 배리어가 형성된 기판 및 이를 이용한 향상된 습기 방출 특성을 갖는 볼 그리드 어레이 반도체 패키지
US08/736,107 US5767446A (en) 1995-10-27 1996-10-24 Printed circuit board having epoxy barrier around a throughout slot and ball grid array semiconductor package
JP8302542A JP2899958B2 (ja) 1995-10-27 1996-10-28 エポキシバリヤーが形成された基板及びこれを用いた半導体パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950037513A KR0170024B1 (ko) 1995-10-27 1995-10-27 관통 슬롯 둘레에 에폭시 배리어가 형성된 기판 및 이를 이용한 향상된 습기 방출 특성을 갖는 볼 그리드 어레이 반도체 패키지

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Publication Number Publication Date
KR970024042A true KR970024042A (ko) 1997-05-30
KR0170024B1 KR0170024B1 (ko) 1999-02-01

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