KR960704328A - 수평 트위스티드-페어 플래나 도체 라인 구조(a horizontally twisted-pair planar conductor line structure) - Google Patents

수평 트위스티드-페어 플래나 도체 라인 구조(a horizontally twisted-pair planar conductor line structure)

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Publication number
KR960704328A
KR960704328A KR1019960700980A KR19960700980A KR960704328A KR 960704328 A KR960704328 A KR 960704328A KR 1019960700980 A KR1019960700980 A KR 1019960700980A KR 19960700980 A KR19960700980 A KR 19960700980A KR 960704328 A KR960704328 A KR 960704328A
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South Korea
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conductive
polled
sides
fork
twisted
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KR1019960700980A
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English (en)
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KR100203001B1 (ko
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데이빗 이. 보클만
더글라스 에이취. 와이즈먼
Original Assignee
존 에이취. 무어
모토로라, 인크.
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Publication of KR100203001B1 publication Critical patent/KR100203001B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B11/00—Communication cables or conductors
    • H01B11/02—Cables with twisted pairs or quads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5386—Geometry or layout of the interconnection structure
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B3/00—Line transmission systems
    • H04B3/02—Details
    • H04B3/32—Reducing cross-talk, e.g. by compensating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0228—Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6638—Differential pair signal lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/097—Alternating conductors, e.g. alternating different shaped pads, twisted pairs; Alternating components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Signal Processing (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Communication Cables (AREA)
  • Cable Transmission Systems, Equalization Of Radio And Reduction Of Echo (AREA)
  • Near-Field Transmission Systems (AREA)

Abstract

트위스티드-페어 도체 라인 구조는 절연 도전 충돌(31,32)을 갖는 기판(22)위에 형성된다. 도전 층들은 제1, 제2, 제3 및 제4 도전성 플래나 세그먼트들(40,41,42,43)을 형성하는데 사용된다. 제1 도전성 링크(44)는 제1 신호 경로를 제공하기 위해 제1 및 제2 플래나 도전성 세그먼트들을 결합시킨다. 유사하게, 제2 도전성 링크(46)는 제2 신호 경로를 제공하기 위해 제3 및 제4 플래나 도전성 세그먼트들을 결합시킨다. 제1 및 제2 신호 경로들에서 트위스트(17)를 형성하기 위해 동작상 정렬되어서, 트위스티드 도전성 세그먼트들 주위의 최종 자기장들(57,59)이 서로 상쇄되도록 서로 대향되어 주위 환경으로의 자기장 반경을 감소시킨다.

Description

수평 트위스티드-페어 플래나 도체 라인 구조(A HORIZONTALLY TWISTED-PAIR PLANAR CONDUCTOR LINE STRUCTURE)
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따른 수평 배향 트위스디트-페어 도체 라인의 상부도이다.
제2도는 제1도의 수평 배향 트위스티드-페어 도체 라인의 단면도이다.
제3도는 본 발명에 따른 수직 배향 트위스티드-페어 도체 라인의 발신 언트위스티드 세그먼트들의 단면도이다.

Claims (5)

  1. 적층된 트위스티드-페어 차동 전송 라인 구조(stacked twisted-pair differential transmission line structure)에 있어서, 제1 방향으로 2개의 면들을 통해 감겨 있는 연속 터닝 부분들(successive turning portions) 및 곧은 부분들(straight portions)을 갖는 제1 바이-플래나(bi-planar) 도체; 2개의 면들을 통해 트위스티드-페어를 형성하기 위해 반대 방향으로 감겨 있는 연속 터닝 부분들 및 곧은 부분들을 갖는 제2 바이-플래나 도체; 제1 포크 측면들(forked sides)을 갖는 제1 폴케이티드(forcated) 플래나 도전성 부재를 포함하는 상기 터닝 부분들; 및 제1 폴케이티드 플래나 도전성 부재 하부에 배치되고 제2 포크 측면들을 가지며, 상기 제1 폴케이티드 부재 보다 폭이 더 협소한 제2 폴케이티드 플래나 부재를 포함하는 것을 특징으로 하는 트위스티드-페어 구조.
  2. 제1항에 있어서, 상기 제1 및 제2 포크 부재들을 정면 대 정면으로 또한 수직 배열로 접속시키기 위해 포그 측면들을 통해 형성된 적어도 하나의 제1 도전성 관통-홀(conductive through-hole)을 더 포함하는 것을 특징으로 하는 트위스티드-페어 구조.
  3. 제2항에 있어서, 상기 곧은 부분들은 상기 제2 폴케이티드 플래나 부재와 동일한 면 상에 형성되고 상기 포크 측면들 내에 중심이 맞추어진 내로우 스트림(narrow strip); 및 상기 제1 폴케이티드 플래나 부재와 동일한 면 상에 형성되고 상기 포크 측면들 내에 중심이 맞추어진 와이드 스트립(wide strip)을 포함하는 것을 특징으로 하는 트위스티드-페어 구조.
  4. 제3항에 있어서, 스트립들을 정면 대 정면으로 또한 수직 배열로 접속시키기 위해 스트립들을 통해 형성된 제2 도전성 관통-홀을 더 포함하는 것을 특징으로 하는 트위스티드-페어 구조.
  5. 트위스티드-페어 도체 라인 구조에 있어서, 제1 포크 측면들을 갖는 제1 폴케이티드 플래나 도전성 부재; 상기 제1 폴케이티드 부재 보다 얇고 제2 포크 측면들을 갖는, 상기 제1 폴케이티드 플래나 도전성 부재 하부의 제2 폴케이티드 플래나 부재; 상기 제1 및 제2 포크 부재들을 정면 대 정면으로 또한 수직 배열로 접속시키기 위해 상기 포크 측면들을 통해 형성된 적어도 하나의 제1 도전성 관통-홀; 상기 제2폴케이티드 플래나 부재와 동일한 면 위에 형성되고 상기 포크 측면들 내에 중심이 맞추어진 내로우 스트립; 상기 제1 폴케이티드 플래나 부재와 동일한 면 위에 형성되고 상기 포크 측면들 내에 중심이 맞추어진 와이드 스트립; 및 상기 스트립들을 정면 대 정면으로 또한 수직 배열로 접속시키기 위해 상기 스트립들을 통해 형성된 제2 도전성 관통-홀을 포함하는 것을 특징으로 하는 트위스티드-페어 도체 라인 구조.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960700980A 1993-08-31 1994-08-31 수평 트위스트 쌍 평탄 도체 라인 구조 KR100203001B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US08/115175 1993-08-31
US08/115,175 1993-08-31
US8/115,175 1993-08-31
US8/115175 1993-08-31
US08/115,175 US5397862A (en) 1993-08-31 1993-08-31 Horizontally twisted-pair planar conductor line structure
PCT/US1994/010004 WO1995006946A1 (en) 1993-08-31 1994-08-31 A horizontally twisted-pair planar conductor line structure

Publications (2)

Publication Number Publication Date
KR960704328A true KR960704328A (ko) 1996-08-31
KR100203001B1 KR100203001B1 (ko) 1999-06-15

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KR1019960700980A KR100203001B1 (ko) 1993-08-31 1994-08-31 수평 트위스트 쌍 평탄 도체 라인 구조

Country Status (6)

Country Link
US (1) US5397862A (ko)
EP (1) EP0720768A4 (ko)
JP (1) JPH09502304A (ko)
KR (1) KR100203001B1 (ko)
CN (1) CN1129993A (ko)
WO (1) WO1995006946A1 (ko)

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EP0720768A4 (en) 1998-05-20
EP0720768A1 (en) 1996-07-10
US5397862A (en) 1995-03-14
WO1995006946A1 (en) 1995-03-09
JPH09502304A (ja) 1997-03-04
KR100203001B1 (ko) 1999-06-15
CN1129993A (zh) 1996-08-28

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