KR960039248A - 프로브카드의 제조방법 - Google Patents

프로브카드의 제조방법 Download PDF

Info

Publication number
KR960039248A
KR960039248A KR1019960007109A KR19960007109A KR960039248A KR 960039248 A KR960039248 A KR 960039248A KR 1019960007109 A KR1019960007109 A KR 1019960007109A KR 19960007109 A KR19960007109 A KR 19960007109A KR 960039248 A KR960039248 A KR 960039248A
Authority
KR
South Korea
Prior art keywords
bump
forming
probe card
convex portion
concavo
Prior art date
Application number
KR1019960007109A
Other languages
English (en)
Other versions
KR0180579B1 (ko
Inventor
코이치 나가오
요시로 나카타
신이치 오키
Original Assignee
모리시다 요이치
마쯔시다 덴키 산교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 모리시다 요이치, 마쯔시다 덴키 산교 가부시키가이샤 filed Critical 모리시다 요이치
Publication of KR960039248A publication Critical patent/KR960039248A/ko
Application granted granted Critical
Publication of KR0180579B1 publication Critical patent/KR0180579B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G01R1/06761—Material aspects related to layers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0373—Conductors having a fine structure, e.g. providing a plurality of contact points with a structured tool
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09481—Via in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1152—Replicating the surface structure of a sacrificial layer, e.g. for roughening
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49004—Electrical device making including measuring or testing of device or component part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49149—Assembling terminal to base by metal fusion bonding

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Geometry (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

플렉시블 기판의 표면에 반도체칩의 검사용 전극과 접속되는 범프를 형성한다. 평탄한 금속판에 플렉시블 기판의 범프보다도 단단한 재료로 이루어지고 범프 직경의 반 이하 직경의 볼록부 또는 오목부를 가지는 도금층을 형성한다. 범프 선단면에 금속판의 도금층을 내리누름으로써 범프의 선단면에 요철부를 형성한다.

Description

프로브카드 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도 (a)∼(c)는 본 발명의 일실시예에 관한 프로브카드의 제조방법의 각 공정을 설명하는 단면도.

Claims (6)

  1. 반도체 웨이퍼상에 형성된 반도체칩의 전기특성을 검사하기 위한 프로브카드의 제조방법은, 배선 기판의 표면에 상기 반도체칩의 검사용 전극과 접속되는 범프를 형성하는 범프 형성공정과, 누름용 기판에 상기 범프보다도 단단한 재료로 이루어지고 상기 범프 직경의 반 이하의 직경의 볼록부 또는 오목부를 가지는 표면층을 형성하는 표면층 형성공정과, 상기 범프의 선단면에 상기 누름용 기판의 표면층을 내리누름으로써 상기 범프의 선단면에 요철부를 형성하는 요철부 형성공정을 구비하는 것을 특징으로 하는 프로브카드의 제조방법.
  2. 제1항에 있어서, 상기 요철부 형성공정은 상기 누름용 기판의 표면에 도금법에 의하여 Ni, Rh, Pb 또는 W로 이루어지는 금속입자 또는 세라믹스 또는 SiO2로 이루어지는 입자를 형성하는 공정을 포함하는 것을 특징으로 하는 프로브카드의 제조방법.
  3. 제1항에 있어서, 상기 표면층 형성공정은, 상기 누름용 기판의 표면에 접착제에 의하여 Ni, Rh, Pd 또는 W로 이루어지는 입자를 고정하는 공정을 포함하는 것을 특징으로 하는 프로브카드 제조방법.
  4. 제1항에 있어서, 선단면에 요철부가 형성된 상기 범프의 표면에 상기 범프보다도 단단한 금속으로 이루어지는 도금층을 형성하는 공정을 더욱 구비하고 있는 것을 특징으로 하는 프로브카드 제조방법.
  5. 제1항에 있어서, 상기 요철부 형성공정은, 상기 범프의 선단면에 상기 누름용 기판의 표면층을 2회이상 내리누르는 공정을 포함하고 이 공정은 1회 내리누를 때마다 상기 범프에 접촉하는 상기 누름용 기판의 위치를 바꾸는 공정을 가지는 것을 특징으로 하는 프로브카드의 제조방법.
  6. 반도체 웨이퍼상에 형성된 반도체칩의 전기특성을 검사하기 위한 프로브카드의 제조방법은, 상기 반도체칩의 검사용 전극과 접속되는 범프를, 하층의 금속배선과 상층의 금속전극과의 사이 또는 기재와 상기 금속전극과의 사이에 층간절연막을 가지는 배선기판에 상기 범프와 상기 상층의 금속전극이 전기적으로 접속하도록 형성하는 공정과, 상기 범프가 형성된 상기 배선기판을 상기 층간절연막이 연화하는 온도로 유지한 상태에서 상기 범프의 선단을 평탄한 기판에 내리눌러 상기 펌프의 선단을 동일 평면상에 위치시키는 공정을 구비하고 있는 프로브카드의 제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960007109A 1995-04-28 1996-03-16 프로브카드의 제조방법 KR0180579B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP95-129054 1995-04-28
JP7129054A JP2796070B2 (ja) 1995-04-28 1995-04-28 プローブカードの製造方法

Publications (2)

Publication Number Publication Date
KR960039248A true KR960039248A (ko) 1996-11-21
KR0180579B1 KR0180579B1 (ko) 1999-04-15

Family

ID=14999952

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960007109A KR0180579B1 (ko) 1995-04-28 1996-03-16 프로브카드의 제조방법

Country Status (3)

Country Link
US (1) US5829126A (ko)
JP (1) JP2796070B2 (ko)
KR (1) KR0180579B1 (ko)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020053734A1 (en) 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
JPH10260224A (ja) * 1997-03-19 1998-09-29 Fujitsu Ltd 半導体検査装置及びこれを用いた検査方法
US6281026B1 (en) * 1997-11-14 2001-08-28 Niigata Seimitsu Co., Ltd. Semiconductor device and method for manufacturing the same
JPH11326379A (ja) 1998-03-12 1999-11-26 Fujitsu Ltd 電子部品用コンタクタ及びその製造方法及びコンタクタ製造装置
US6137297A (en) * 1999-01-06 2000-10-24 Vertest Systemsn Corp. Electronic test probe interface assembly and method of manufacture
JP2001004698A (ja) 1999-06-18 2001-01-12 Mitsubishi Electric Corp テスト用ソケット、及びその接触端子の製造方法、並びに電子機器あるいは半導体パッケージ
US10388626B2 (en) * 2000-03-10 2019-08-20 STATS ChipPAC Pte. Ltd. Semiconductor device and method of forming flipchip interconnect structure
EP1264520A4 (en) * 2000-03-10 2007-02-28 Chippac Inc PACKAGING STRUCTURE AND METHOD
EP1278612B1 (en) 2000-03-10 2010-02-24 Chippac, Inc. Flip chip Interconnection structure and method of obtaining the same
US6737295B2 (en) 2001-02-27 2004-05-18 Chippac, Inc. Chip scale package with flip chip interconnect
US6780682B2 (en) * 2001-02-27 2004-08-24 Chippac, Inc. Process for precise encapsulation of flip chip interconnects
US6940178B2 (en) * 2001-02-27 2005-09-06 Chippac, Inc. Self-coplanarity bumping shape for flip chip
JP4723195B2 (ja) 2004-03-05 2011-07-13 株式会社オクテック プローブの製造方法
TWI368743B (en) * 2008-11-04 2012-07-21 King Yuan Electronics Co Ltd Probe card assembly and probes therein
US20170023617A1 (en) * 2015-06-10 2017-01-26 Translarity, Inc. Shaping of contact structures for semiconductor test, and associated systems and methods

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3835381A (en) * 1969-02-14 1974-09-10 Tieco Inc Probe card including a multiplicity of probe contacts and methods of making
JPS6362245A (ja) * 1986-09-02 1988-03-18 Canon Inc ウエハプロ−バ
JPS63208237A (ja) * 1987-02-25 1988-08-29 Hitachi Ltd 半導体装置の測定装置
JPS6445029A (en) * 1987-08-14 1989-02-17 Seiko Epson Corp Operation panel
JP2553661B2 (ja) 1987-09-24 1996-11-13 キヤノン株式会社 微小プローグ及びその製造方法
EP0355273B1 (en) * 1988-05-18 1994-08-03 Canon Kabushiki Kaisha Probe card, method for measuring part to be measured by use thereof and electrical circuit member
US5008614A (en) * 1988-10-11 1991-04-16 Hewlett-Packard Company TAB frame and process of testing same
JPH03180769A (ja) * 1989-12-11 1991-08-06 Kobe Steel Ltd 検査用触子
US5083697A (en) * 1990-02-14 1992-01-28 Difrancesco Louis Particle-enhanced joining of metal surfaces
US5471151A (en) * 1990-02-14 1995-11-28 Particle Interconnect, Inc. Electrical interconnect using particle enhanced joining of metal surfaces
US5356661A (en) * 1990-11-21 1994-10-18 Sumitomo Electric Industries, Ltd. Heat transfer insulated parts and manufacturing method thereof
US5308729A (en) * 1992-04-30 1994-05-03 Lexmark International, Inc. Electrophotographic liquid developer with charge director
US5402077A (en) * 1992-11-20 1995-03-28 Micromodule Systems, Inc. Bare die carrier
US5545589A (en) * 1993-01-28 1996-08-13 Matsushita Electric Industrial Co., Ltd. Method of forming a bump having a rugged side, a semiconductor device having the bump, and a method of mounting a semiconductor unit and a semiconductor device
JPH06347480A (ja) * 1993-06-04 1994-12-22 Nitto Denko Corp プローブ構造
JPH07140168A (ja) * 1993-11-19 1995-06-02 Mitsubishi Electric Corp 半導体用プローブ

Also Published As

Publication number Publication date
US5829126A (en) 1998-11-03
JP2796070B2 (ja) 1998-09-10
JPH08306749A (ja) 1996-11-22
KR0180579B1 (ko) 1999-04-15

Similar Documents

Publication Publication Date Title
KR960039248A (ko) 프로브카드의 제조방법
US6439898B2 (en) Method and apparatus for interconnecting devices using an adhesive
US5914614A (en) High density cantilevered probe for electronic devices
US5811982A (en) High density cantilevered probe for electronic devices
US7332922B2 (en) Method for fabricating a structure for making contact with a device
US6722032B2 (en) Method of forming a structure for electronic devices contact locations
KR970053206A (ko) 반도체 장치 및 그 제조 방법
KR900005587A (ko) 반도체 디바이스 및 그 제작방법
EP1267402A3 (en) Semiconductor device and method of production of same
KR920704343A (ko) 전도성 중합체 및 전극을 이용한 플립칩
KR950007059A (ko) 집적 회로
TW417232B (en) Semiconductor device and process for producing the same
KR900014901A (ko) 플립-칩 검사 소켓 아답터 및 이에 의한 검사 방법
TW200534493A (en) Microelectronic packages and methods therefor
TW200711065A (en) Semiconductor device and manufacturing method thereof
KR960702176A (ko) 수직 칩 연결을 위한 접촉 구조체(contact structure for vertical chip connections)
KR100349896B1 (ko) 집적회로칩의실장구조체및그실장방법
EP1313142A3 (en) Method of manufacturing a rerouting layer on a semiconductor device and corresponding semiconductor device
KR970702580A (ko) 수직 방향 집적을 위한 반도체 소자 및 그 제조 방법(semiconductor component designed for vertical integration, and method of manufacturing the component)
KR930024140A (ko) 반도체장치 및 그 제조방법
KR970077750A (ko) 광학 반도체 소자 및 이의 제조 방법
KR920015523A (ko) 미소장소의 전기접속방법과 그 방법에 의해 형성된 반도체장치 및 전자부품 부착기판
JPH0234949A (ja) 半導体装置の実装方法
US6612024B1 (en) Method of mounting a device to a mounting substrate
KR950004504A (ko) 광 반도체 소자의 광 기층 부착 방법

Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20131119

Year of fee payment: 16

FPAY Annual fee payment

Payment date: 20141117

Year of fee payment: 17

FPAY Annual fee payment

Payment date: 20151118

Year of fee payment: 18

EXPY Expiration of term