KR960026070A - 반도체 웨이퍼 생산 방법 - Google Patents

반도체 웨이퍼 생산 방법 Download PDF

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Publication number
KR960026070A
KR960026070A KR1019950061271A KR19950061271A KR960026070A KR 960026070 A KR960026070 A KR 960026070A KR 1019950061271 A KR1019950061271 A KR 1019950061271A KR 19950061271 A KR19950061271 A KR 19950061271A KR 960026070 A KR960026070 A KR 960026070A
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South Korea
Prior art keywords
production
unit
semiconductor wafer
status
process stage
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KR1019950061271A
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English (en)
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KR100201794B1 (ko
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요이찌 도가시
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가네꼬 히사시
닛본덴기 가부시끼가이샤
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Publication of KR960026070A publication Critical patent/KR960026070A/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32252—Scheduling production, machining, job shop
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45026—Circuit board, pcb
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • General Factory Administration (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Multi-Process Working Machines And Systems (AREA)

Abstract

본 발명에 따른 시스템은 생산 전개 상황 비교/계산 유닛, 생산 장치 상태 모니터 유닛, 목록 제어 유닛, 및 공정대 제어기 유닛을 포함하는 반도체 웨이퍼 생산 시스템이다. 생산 장치 상태 모니터 유닛으로부터의 타이밍 신호에 응답하여 생산 전개 상황 비교/계산 유닛이 다음에 처리되어야 할 반도체 웨이퍼를 결정하고, 결정된 반도체 웨이퍼는 공정대에서 자동적으로 서치된다. 반도체 웨이퍼 생산 라인의 생산 장치는 적정 시간에 반도체 웨이퍼의 처리를 개시함으로써 생산 계획에 따라 반도체 웨이퍼를 생산하고 반도체 웨이퍼에 대한 인도 시간에 맞출 수 있다.

Description

반도체 웨이퍼 생산 방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제4도는 본 발명에 따른 반도체 웨이퍼를 생산하는 방법의 처리 절차의 흐름도.

Claims (4)

  1. 준비된 생산 계획 및 생산 달성도를 비교하고 생산 전개 상황을 계산하기 위한 생산 전개 상황 비교/계산 유닛, 생산 장치의 처리 상태를 모니터하기 위한 생산 장치 상태 모니터 유닛, 생산 장치에서 처리되어야 할 공정대에 준비된 반도체 웨이퍼를 제어하기 위한 목록 제어 유닛, 및 상기 생산 장치에 의해 처리되어야 할 반도체 웨이퍼에 대한 공정대를 자동적으로 서칭하기 위한 공정대 제어기 유닛을 포함하는 시스템에서, 상기 생산 전개 상황 비교/계산 유닛에서의 생산 전개 상황의 계산은 다음에 유닛으로부터의 타이밍 신호에 응답하여 개시되고, 상기 공정대 제어기 유닛은 상기 결정된 반도체 웨이퍼에 대한 공정대를 자동적으로 서치하도록 구성한 반도체 웨이퍼 생산 방법.
  2. 제1항에 있어서, 상기 공정대를 자동적으로 서칭하는 것은 상기 공정대로부터 반도체 웨이퍼를 자동적으로 인도하는 것을 특징으로 하는 반도체 웨이퍼 생산 방법.
  3. 제1항에 있어서, 상기 생산 전개 상황 비교/계산 유닛, 상기 생산 장치 상태 모니터 유닛, 상기 목록 제어 유닛, 및 상기 공정대 제어기 유닛은 컴퓨터에 의해 제어되는 것을 특징으로 하는 반도체 웨이퍼 생산 방법.
  4. 제1항에 있어서, 상기 타이밍 신호는 생산 장치의 로더가 열려있을 때 상기 생산 장치 상태 모니터 유닛으로부터 발생되는 것을 특징으로 하는 반도체 웨이퍼 생산 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950061271A 1994-12-28 1995-12-28 반도체 웨이퍼 생산 방법 KR100201794B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP94-327885 1994-12-28
JP32788594 1994-12-28

Publications (2)

Publication Number Publication Date
KR960026070A true KR960026070A (ko) 1996-07-20
KR100201794B1 KR100201794B1 (ko) 1999-06-15

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Country Link
US (1) US5745364A (ko)
KR (1) KR100201794B1 (ko)
CN (1) CN1042374C (ko)
GB (1) GB2296818B (ko)

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Also Published As

Publication number Publication date
GB9526579D0 (en) 1996-02-28
CN1131813A (zh) 1996-09-25
CN1042374C (zh) 1999-03-03
GB2296818B (en) 1998-12-16
US5745364A (en) 1998-04-28
GB2296818A (en) 1996-07-10
KR100201794B1 (ko) 1999-06-15

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