KR960019621A - 수지 봉합형 반도체장치의 구조 - Google Patents

수지 봉합형 반도체장치의 구조 Download PDF

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KR960019621A
KR960019621A KR1019950036671A KR19950036671A KR960019621A KR 960019621 A KR960019621 A KR 960019621A KR 1019950036671 A KR1019950036671 A KR 1019950036671A KR 19950036671 A KR19950036671 A KR 19950036671A KR 960019621 A KR960019621 A KR 960019621A
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semiconductor element
opposite
chip support
resin
bonded
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KR1019950036671A
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KR100366111B1 (ko
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에쓰오 야마다
야스시 시라이시
히로시 가와노
신지 오오우찌
히데까즈 나스
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사와무라 시꼬
오끼덴끼고오교 가부시끼가이샤
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Abstract

[목적]
종래의 박형의 수지봉합형 반도체장치에서는, 다이패드의 측면과 몰드수지의 사이에 박리가 발생하기 쉬우며, 더욱 진행하면 몰드수지에 균열이 발생한다는 문제도 있었다.
[해결수단]
반도체 소자(1)의 금선(4)이 접속되는 편면(1a)측에, 금선(4)이 접속되는 부분을 피하여 접착 테이프(2)로 면접착된 칩 서포트(3)를 형성함과 동시에, 반도체 소자(1)의 평면(1a)과 반대측에 위치하는 다른면(1b) 및, 칩 서포트(3)의 반도체 소자(1)에 접착된 면(3a)과 반대측의 면(3b)을 각각 노출시켜서 몰드수지(6)로 봉합한다.

Description

수지 봉합형 반도체장치의 구조
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 실시예 1로서 나타내는 수지봉합형 반도체장치의 종단측면도,
제2도는 본 발명의 실시예 2로서 나타내는 수지봉합형 반도체장치의 요부 평면도,
제3도는 제2도의 선 A-A에 따른 확대 종단 측면도.

Claims (12)

  1. 표면에 금선이 접속되는 반도체 소자와, 상기 반도체 소자의 금선이 접속되는 부분을 피하여 고착되는 칩 서포트와, 상기 반도체 소자의 상기 표면과 반대측에 위치하는 이면 및, 상기 칩 서포트의 상기 반도체 소자에 고착된 면과 반대측의 면을 각각 노출시켜서 봉합하는 몰드수지를 포함하는 것을 특징으로 하는 수지봉합형 반도체장치의 구조.
  2. 표면에 금선이 접속되는 반도체 소자와, 상기 반도체 소자의 금선이 접속되는 부분을 피하여 고착되는 한 쌍의 칩 서포트와, 상기 한 쌍의 칩 서포트와, 상기 반도체장치를 고착하는 상기 한 쌍의 칩 서포트 사이에 주입되는 접착제와, 상기 반도체 소자의 상기 표면과 반대측에 위치하는 이면 및, 상기 칩 서포트의 상기 반도체 소자에 고착된 면과 반대측의 면을 각각 노출시켜서 봉합하는 몰드수지를 포함하는 것을 특징으로 하는 수지봉합형 반도체장치의 구조.
  3. 제2항에 있어서, 상기 칩 서포트를 수평부와 수직부를 일체로 형성하여 단면이 대락 L자 상으로 형성되고, 각 칩 서포트의 수평부의 선단을 각각 대향하게 맞추어서 배치하여 이루어지는 수지봉합형 반도체장치의 구조.
  4. 표면에 금선이 접속되는 반도체 소자와, 상기 반도체 소자의 금선이 접속되는 부분을 피하여 복수의 방향으로부터 신장하여 배치되고, 선단에 상하방향으로 관통된 접착제 주입용 구멍을 갖는 칩 서포트로서, 상기 접착제 주입용 구멍으로부터 주입된 접착제에 의해 상기 반도체 소자와 접착하는 상기 칩 서포트와, 상기 반도체 소자의 상기 표면과 반대측에 위치하는 이면 및, 상기 칩 서포트의 상기 반도체 소자에 접착된 면과 반대측의 면을 각각 노출시켜서 봉합되는 몰드수지를 포함하는 것을 특징으로 하는 수지봉합형 반도체장치의 구조.
  5. 표면에 금선이 접속되는 반도체 소자와, 상기 표면과 반대의 이면측에 배치되는 한 쌍이상의 다이패드와, 이 한 쌍의 다이패드 사이에 주입되는 상기 다이패드 사이 및, 상기 다이패드 사이와 상기 반도체 소자를 각각 접속시킴과 동시에 상기 다이패드의 상기 반도체 소자에 접착된 면과 반대측의 면을 노출시켜서 수지봉합하는 몰드수지를 포함하는 것을 특징으로 하는 수지봉합형 반도체장치의 구조.
  6. 반도체 소자와, 상기 반도체 소자의 표면에 배치되는 선단에 접착제 주입용 구멍을 가진 리드와, 상기 반도체 소자와 상기 리드의 사이를 접착시키는 상기 접착제 주입용 구멍으로부터 주입되는 접착제와, 상기 반도체 소자와, 상기 리드를 봉합하는 몰드수지를 포함하는 것을 특징으로 하는 수지봉합형 반도체장치의 구조.
  7. 표면에 금선이 접속되는 반도체 소자와, 상기 반도체 소자의 표면에 상기 금선이 접속되는 부분을 피하여 접속되고, 이 접착되는 면과 반대측의 면에 돌기부를 갖는 칩 서포트와, 상기 반도체 소자의 상기 표면과 반대측에 위치하는 이면 및, 상기 칩 서포트의 상기 돌기부의 선단을 각각 노출시켜 봉합하는 몰드수지를 포함하는 것을 특징으로 하는 수지봉합형 반도체장치의 구조.
  8. 표면에 금선이 접속되는 반도체 소자와, 상기 금선이 접속되는 부분을 피하여 탄력성의 접착층을 통하여 면접착된 칩 서포트와, 상기 반도체 소자의 상기 표면과 반대측에 위치하는 이면 및, 상기 칩 서포트의 상기 반도체 소자에 접착된 면과 반대측의 면을 각각 노출시켜서 봉합하는 몰드수지를 포함하는 것을 특징으로 하는 수지봉합형 반도체장치의 구조.
  9. 표면에 본딩패드를 갖는 반도체 소자와, 상기 본딩패드와 전기적으로 접속되는 내부리드와, 상기 반도체 소자의 표면의 상기 본딩패드를 피하여 접착되는 금속판과, 상기 반도체 소자의 상기 표면과 반대측에 위치하는 다른면 및, 상기 금속판의 상기 반도체 소자에 접착된 면과 반대측의 면을 각각 노출시켜서 봉합하는 몰드수지를 포함하는 것을 특징으로 하는 수지봉합형 반도체장치의 구조.
  10. 제9항에 있어서, 상기 금속판은, 방열성의 금속판인 것을 특징으로 하는 수지봉합형 반도체장치의 구조.
  11. 제10항에 있어서, 상기 방열성의 금속판은, Cu, Al, Cu/W로부터 선택된 것을 특징으로 하는 수지봉합형 반도체장치의 구조.
  12. 표면에 본딩패드를 갖는 반도체 소자와, 상기 본딩패드와 전기적으로 접속되는 내부리드와, 상기 반도체 소자의 표면의 상기 본딩패드를 피하여 접착되는 상기 내부리드 보다도 얇은 칩 서포트와, 상기 반도체 소자의 상기 표면과 반대측에 위치하는 다른면 및, 상기 칩 서포트의 상기 반도체 소자에 접착된 면과 반대측의 면을 각각 노출시켜서 봉합하는 몰드수지를 포함하는 것을 특징으로 하는 수지봉합형 반도체장치의 구조.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950036671A 1994-11-08 1995-10-23 수지봉합형 반도체장치의 구조 KR100366111B1 (ko)

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