KR960006732A - 부재의 냉각구조 - Google Patents

부재의 냉각구조 Download PDF

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Publication number
KR960006732A
KR960006732A KR1019950019697A KR19950019697A KR960006732A KR 960006732 A KR960006732 A KR 960006732A KR 1019950019697 A KR1019950019697 A KR 1019950019697A KR 19950019697 A KR19950019697 A KR 19950019697A KR 960006732 A KR960006732 A KR 960006732A
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KR
South Korea
Prior art keywords
cooling structure
heat dissipation
heat
cooling
component
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KR1019950019697A
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English (en)
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KR100253056B1 (ko
Inventor
타카오 이노우에
준지 이케다
나오미 니시키
카즈히로 모리
Original Assignee
모리시타 요이찌
마쯔시다덴기산교 가부시키가이샤
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Publication of KR960006732A publication Critical patent/KR960006732A/ko
Application granted granted Critical
Publication of KR100253056B1 publication Critical patent/KR100253056B1/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Carbon And Carbon Compounds (AREA)

Abstract

본 발명은, 부재의 냉각구조, 특히 발열하는 전자부품이나 가공공구등의 부재를 냉각하기 위한 부재의 냉각구조에 관한 것으로서, 방열부품을 소형화, 경량화하고 또한 가요성의 회로기판이면서도 기판이 방열부를 겸하도록 하는 것을 목적으로한 것이며, 그 구성에 있어서, 부재의 냉각구조는 발열하는 전자부품이나 공구등의 부재를 냉각하기 위한 냉각구조로서, 고배향성을 가진 흑연체의 방열부품은, 히트싱크(20), 밀봉케이스(14), 전열시트(15), 전열배선(16), 방열기판(27), 생크(35), 바이트팁(36), 흑연시트(38)등의 냉각용부품인 것을 특징으로 한 것이다.

Description

부재의 냉각구조
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 일실시예를 채용한 전원장치의 사시도.
제2도는 파워트랜지스터의 단면도.
제3도는 회로기판의 단면부분도.
제4도는 다른 실시예의 제2도에 상당하는 도면.

Claims (8)

  1. 발열하는 부재를 냉각하기 위한 냉각구조로서, 고배향성을 가진 흑연제의 방열부품을 포함한 것을 특징으로 하는 부재의 냉각구조.
  2. 제1항에 있어서, 상기 흑연은, 로킹특성이 20˚이하인 것을 특징으로 하는 부재의 냉각구조.
  3. 제1항 또는 제2항에 있어서, 상기 방열부품은, 상기 부재로서의 전자부품을 냉각하기 위한 히트싱크인 것을 특징으로 하는 부재의 냉각구조.
  4. 제1항 또는 제2항에 있어서, 상기 방열부품은, 상기 부재로서의 전자부품을 밀봉하기 위한 밀봉부재인 것을 특징으로 하는 부재의 냉각구조.
  5. 제1항 도는 제2항에 있어서, 상기 방열부품은, 상기 부재로서의 전자부품과 열을 방열하는 방열체를 접속하는 방열부재인 것을 특징으로 하는 부재의 냉각구조.
  6. 제1항 또는 제2항에 있어서, 상기 방열부품은, 상기 부재로서의 전자부품을 탑재하기 위한 회로기판에 사용되는 방열부재인 것을 특징으로 하는 부재의 냉각구조.
  7. 제5항 또는 제6항에 있어서, 상기 방열부재는, 가요성을 가진 흑연시트제이고, 비중이 0.5 이상 1.5이하인 것을 특징으로 하는 부재의 냉각구조.
  8. 제1항 또는 제2항에 있어서, 상기 방열부품은, 상기 부재로서의 발열하는 가공공구를 냉각하는 히트싱크인 것을 특징으로 하는 부재의 냉각구조.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950019697A 1994-07-06 1995-07-06 부재의 냉각구조 KR100253056B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP94-154627 1994-07-06
JP6154627A JPH0823183A (ja) 1994-07-06 1994-07-06 部材の冷却構造

Publications (2)

Publication Number Publication Date
KR960006732A true KR960006732A (ko) 1996-02-23
KR100253056B1 KR100253056B1 (ko) 2000-04-15

Family

ID=15588328

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950019697A KR100253056B1 (ko) 1994-07-06 1995-07-06 부재의 냉각구조

Country Status (5)

Country Link
EP (1) EP0691803B1 (ko)
JP (1) JPH0823183A (ko)
KR (1) KR100253056B1 (ko)
CN (1) CN1116400A (ko)
DE (1) DE69506957T2 (ko)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5991155A (en) * 1996-12-13 1999-11-23 Mitsubishi Denki Kabushiki Kaisha Heat sink assembly including flexible heat spreader sheet
DE69825153D1 (de) 1997-10-14 2004-08-26 Matsushita Electric Ind Co Ltd Wärmeleitende einheit und wärmeverbindungsstruktur welche diese einheit verwendet
JP3700348B2 (ja) * 1997-11-05 2005-09-28 松下電器産業株式会社 電子部品放熱装置
WO2000079848A1 (fr) 1999-06-21 2000-12-28 Mitsubishi Denki Kabushiki Kaisha Procede de production de carte de formation de circuit, carte de formation de circuit et feuille de carbone
US6482520B1 (en) * 2000-02-25 2002-11-19 Jing Wen Tzeng Thermal management system
JP4714371B2 (ja) 2001-06-06 2011-06-29 ポリマテック株式会社 熱伝導性成形体及びその製造方法
US20060099406A1 (en) * 2001-08-31 2006-05-11 Julian Norley Heat spreader for printed circuit boards
JP3713706B2 (ja) * 2001-09-28 2005-11-09 日本電気株式会社 放熱構造、パッケージ組立体、及び、放熱用シート
US6749010B2 (en) * 2002-06-28 2004-06-15 Advanced Energy Technology Inc. Composite heat sink with metal base and graphite fins
EP1986244B1 (en) 2002-11-12 2017-01-11 Fujitsu Limited Mounting structure
US6982874B2 (en) * 2003-11-25 2006-01-03 Advanced Energy Technology Inc. Thermal solution for electronic devices
EP1659838A3 (en) * 2004-10-27 2007-03-07 Brother Kogyo Kabushiki Kaisha Electronic part-mounted substrate, thermal conductive member for electronic part-mounted substrate, and liquid-jetting head
JP4316483B2 (ja) 2004-12-08 2009-08-19 ユーアイ電子株式会社 プリント基板の製造方法及びプリント基板
GB2432830A (en) 2005-12-02 2007-06-06 Morganite Elect Carbon Formation of thermally anisotropic carbon material
US8347502B2 (en) * 2007-12-28 2013-01-08 Ge Intelligent Platforms, Inc. Heat sink and method of forming a heatsink using a wedge-lock system
JP5392213B2 (ja) * 2010-03-23 2014-01-22 株式会社デンソー 電子制御装置およびその冷却装置
DE102011007171A1 (de) * 2011-04-12 2012-10-18 BSH Bosch und Siemens Hausgeräte GmbH Kühlvorrichtung für ein Elektronikmodul eines Haushaltsgeräts sowie Baugruppe und Haushaltsgerät mit einer Kühlvorrichtung
CN103096691B (zh) 2012-06-25 2015-04-29 北京中石伟业科技无锡有限公司 一种石墨膜导热体
JP5799051B2 (ja) * 2013-04-24 2015-10-21 株式会社カネカ グラファイトフィルムの製造方法
JP6594639B2 (ja) * 2015-02-12 2019-10-23 株式会社カネカ 高熱伝導性放熱基板、及びその製造方法
KR101856341B1 (ko) * 2016-07-26 2018-05-09 현대자동차주식회사 그라파이트 구조물 및 이의 제조방법
US10275000B2 (en) * 2016-09-06 2019-04-30 Google Llc Thermally conductive cables
JP2019080041A (ja) * 2017-10-25 2019-05-23 パナソニックＩｐマネジメント株式会社 グラファイトヒートシンク及びその製造方法

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US4849858A (en) * 1986-10-20 1989-07-18 Westinghouse Electric Corp. Composite heat transfer means
FR2616997B1 (fr) 1987-06-16 1989-08-25 Thomson Csf Support pour circuit imprime, formant drain thermique a dilatation controlee, et procede de fabrication
JPH0821375B2 (ja) 1990-06-28 1996-03-04 新日本製鐵株式会社 リチウム二次電池用負極
JPH0597418A (ja) 1991-10-04 1993-04-20 Matsushita Electric Ind Co Ltd 高配向グラフアイトの製造方法

Also Published As

Publication number Publication date
JPH0823183A (ja) 1996-01-23
CN1116400A (zh) 1996-02-07
EP0691803B1 (en) 1998-12-30
DE69506957T2 (de) 1999-08-19
DE69506957D1 (de) 1999-02-11
KR100253056B1 (ko) 2000-04-15
EP0691803A1 (en) 1996-01-10

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