KR950034650A - 반도체 제조장비의 웨이퍼 장착 카세트 - Google Patents
반도체 제조장비의 웨이퍼 장착 카세트 Download PDFInfo
- Publication number
- KR950034650A KR950034650A KR1019940012215A KR19940012215A KR950034650A KR 950034650 A KR950034650 A KR 950034650A KR 1019940012215 A KR1019940012215 A KR 1019940012215A KR 19940012215 A KR19940012215 A KR 19940012215A KR 950034650 A KR950034650 A KR 950034650A
- Authority
- KR
- South Korea
- Prior art keywords
- wafer
- shelf
- semiconductor manufacturing
- mounting cassette
- wafer mounting
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract 8
- 239000004065 semiconductor Substances 0.000 title claims abstract 8
- 238000000034 method Methods 0.000 claims 2
- 230000007123 defense Effects 0.000 claims 1
- 230000003449 preventive effect Effects 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 abstract 7
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
- H01L21/67309—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
Abstract
본 발명은 반도체소자 제조장치에 사용되는 웨이퍼 장착카세트에 관한 것으로, 특히, 웨이퍼의 크기에 제약됨이 없이, 소정 범위내에서 여러가지 크기의 웨이퍼를 장입할 수 있는 반도체 제조장비의 웨이퍼 장착카세트에 관한 것이다.
종래의 웨이퍼 장착카세트는 크기가 다른 웨이퍼를 다룰 때에는 제조장치내의 모든 도구를 교체해야 하는 문제점들이 있었다.
본 발명은 상술한 문제점들을 극복하기 위한 것으로 여러크기의 웨이퍼를 동시에 각각 장입할 수 있도록 복수개의 단턱을 갖는 적어도 2개 이상의 선반과, 이 선반을 지지하는 선반고정수단으로 구성한다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
베1도는 본 발명의 전체적인 사시도.
Claims (4)
- 반도체의 공정장비중 복수개의 에이퍼를 장착하여 공정을 진행하기 위한 반도체제조방지의 웨이퍼 장착 카세트에 있어서, 상기 웨이퍼의 크기에 상관없이 수용할 수 있는 선반수단과, 상기 선반수단을 소정간격으로 적어도 2개 이상 고정할 수 있는 선반고정수단을 포함하는 것을 특징으로 하는 반도체 제조방비의 웨이퍼 장착 카세트.
- 제1항에 있어서, 상기 선반수단은 상부에 서로 다른 직경을 갖는 웨이퍼를 각각 장착할 수 잇도록 형성한 단턱(11)과, 일측이 소정길이 연장되어 상기 선반고정수단에 연결고정되는 연결편(12)을 구비한 한쌍의 선반(10)으로 구성된 것을 특징으로 하는 반도체 제조장비의 웨이퍼 장착카세트.
- 제3항에 있어서, 상기 단턱(11)은 장착되는 웨이퍼의 직경과 일치하는 원호형상을 갖는 것을 특징으로 하는 반도체 제조장비의 에이퍼 장착카세트.
- 제1항에 있어서, 상기 선반고정수단은 상기 선반의 연결편(12)이 삽입되어 고정되는 복수개의 요홈(21)을 구비한 대립된 구조의 한쌍의 지지프레임(20)과, 상기 지지프레임을 연결고정하는 고정프레임(30)으로 구성된 것을 특징으로 하는 반도체 제조방비의 웨이퍼 장착카세트.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019940012215A KR0135049B1 (ko) | 1994-05-31 | 1994-05-31 | 반도체 제조장비의 웨이퍼 장착 카세트 |
US08/353,255 US5577621A (en) | 1994-05-31 | 1994-12-02 | Wafer installing cassette for semiconductor manufacturing apparatus |
JP30509794A JP2702080B2 (ja) | 1994-05-31 | 1994-12-08 | 半導体の製造装備のウエハ装着のカセット |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019940012215A KR0135049B1 (ko) | 1994-05-31 | 1994-05-31 | 반도체 제조장비의 웨이퍼 장착 카세트 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR950034650A true KR950034650A (ko) | 1995-12-28 |
KR0135049B1 KR0135049B1 (ko) | 1998-04-20 |
Family
ID=19384396
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019940012215A KR0135049B1 (ko) | 1994-05-31 | 1994-05-31 | 반도체 제조장비의 웨이퍼 장착 카세트 |
Country Status (3)
Country | Link |
---|---|
US (1) | US5577621A (ko) |
JP (1) | JP2702080B2 (ko) |
KR (1) | KR0135049B1 (ko) |
Cited By (1)
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KR100946442B1 (ko) * | 2002-10-10 | 2010-03-10 | 하이디스 테크놀로지 주식회사 | 기판 적재용 카세트 |
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JP3552178B2 (ja) * | 1995-09-27 | 2004-08-11 | 大日本スクリーン製造株式会社 | 基板収納カセット、インターフェイス機構および基板処理装置 |
US5788086A (en) * | 1995-12-21 | 1998-08-04 | Dow Corning Corporation | Cartridge for storing and dispensing mirror mount buttons |
JP3122364B2 (ja) * | 1996-02-06 | 2001-01-09 | 東京エレクトロン株式会社 | ウエハボート |
US6145673A (en) * | 1999-03-31 | 2000-11-14 | Applied Materials, Inc. | Wafer transfer cassette |
JP4855569B2 (ja) * | 2000-10-20 | 2012-01-18 | コーニング インコーポレイテッド | ガラス基板を梱包するための容器 |
WO2002049095A1 (fr) * | 2000-12-12 | 2002-06-20 | Dainichi Shoji Kabushiki Kaisha | Support de plaquette |
KR100640105B1 (ko) * | 2001-04-19 | 2006-10-30 | 무라타 기카이 가부시키가이샤 | 무인운반차, 무인운반차시스템 및 웨이퍼운반방법 |
US6488497B1 (en) * | 2001-07-12 | 2002-12-03 | Saint-Gobain Ceramics & Plastics, Inc. | Wafer boat with arcuate wafer support arms |
TWI256372B (en) * | 2001-12-27 | 2006-06-11 | Tokyo Electron Ltd | Carrier system of polishing processing body and conveying method of polishing processing body |
JP3924714B2 (ja) | 2001-12-27 | 2007-06-06 | 東京エレクトロン株式会社 | ウエハカセット |
KR100870661B1 (ko) * | 2002-03-15 | 2008-11-26 | 엘지디스플레이 주식회사 | 기판 수납용 카세트 |
TW565008U (en) * | 2002-11-13 | 2003-12-01 | Foxsemicon Integrated Tech Inc | Substrate cassette |
KR100492977B1 (ko) * | 2002-12-12 | 2005-06-07 | 삼성전자주식회사 | 다공성 실리카 박막의 소결을 위한 웨이퍼 보트 |
JP2004210421A (ja) * | 2002-12-26 | 2004-07-29 | Semiconductor Energy Lab Co Ltd | 製造システム、並びに処理装置の操作方法 |
JP4667769B2 (ja) * | 2004-06-11 | 2011-04-13 | 信越ポリマー株式会社 | 基板収納容器 |
TWM258968U (en) * | 2004-07-22 | 2005-03-11 | Au Optronics Corp | Cassette |
TWI256938B (en) * | 2004-07-26 | 2006-06-21 | Au Optronics Corp | Glass substrate distribute system and method |
TWI268265B (en) * | 2004-08-13 | 2006-12-11 | Au Optronics Corp | Glass substrate cassette |
JP2006293257A (ja) * | 2005-04-08 | 2006-10-26 | Samsung Electronics Co Ltd | 表示パネル用ガラスを積載するためのガラスカセット |
US20090101067A1 (en) * | 2005-07-08 | 2009-04-23 | Bonora Anthony C | Method and apparatus for wafer support |
US20070029268A1 (en) * | 2005-08-04 | 2007-02-08 | King Yuan Electronics Co., Lt | Wafer cassette used in high temperature baking process |
JP4976415B2 (ja) * | 2005-11-29 | 2012-07-18 | 錦湖石油化學 株式會▲社▼ | 炭素ナノチューブの生成システム及びその生成方法 |
US7661544B2 (en) * | 2007-02-01 | 2010-02-16 | Tokyo Electron Limited | Semiconductor wafer boat for batch processing |
US8042697B2 (en) * | 2008-06-30 | 2011-10-25 | Memc Electronic Materials, Inc. | Low thermal mass semiconductor wafer support |
US20100098519A1 (en) * | 2008-10-17 | 2010-04-22 | Memc Electronic Materials, Inc. | Support for a semiconductor wafer in a high temperature environment |
TWI431712B (zh) * | 2011-09-20 | 2014-03-21 | Gudeng Prec Ind Co Ltd | 大型前開式晶圓盒 |
TWI541928B (zh) * | 2011-10-14 | 2016-07-11 | 晶元光電股份有限公司 | 晶圓載具 |
CN104139929A (zh) * | 2014-07-08 | 2014-11-12 | 深圳市华星光电技术有限公司 | 一种包装箱 |
WO2016046985A1 (ja) | 2014-09-26 | 2016-03-31 | ミライアル株式会社 | 基板収納容器 |
US9478697B2 (en) * | 2014-11-11 | 2016-10-25 | Applied Materials, Inc. | Reusable substrate carrier |
CN104600020B (zh) * | 2015-02-03 | 2018-01-26 | 北京七星华创电子股份有限公司 | 晶圆承载器、热处理装置及热处理方法 |
JP2017045823A (ja) * | 2015-08-26 | 2017-03-02 | 株式会社ディスコ | 収容カセット |
US10535541B2 (en) | 2015-12-29 | 2020-01-14 | Taiwan Semiconductor Manufacturing Co., Ltd. | Adaptive inset for wafer cassette system |
TWI664130B (zh) * | 2016-01-29 | 2019-07-01 | 旺矽科技股份有限公司 | 晶圓匣 |
JP2018093045A (ja) * | 2016-12-02 | 2018-06-14 | 株式会社日立国際電気 | 基板処理装置、半導体装置の製造方法、プログラム |
JP7045140B2 (ja) * | 2017-06-08 | 2022-03-31 | 株式会社ディスコ | ウエーハの加工方法及び加工装置 |
JP7009194B2 (ja) * | 2017-12-12 | 2022-01-25 | 株式会社ディスコ | ウエーハ生成装置および搬送トレー |
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JP7076897B2 (ja) * | 2018-02-07 | 2022-05-30 | 株式会社ディスコ | フレーム収容具 |
KR102290078B1 (ko) * | 2019-10-18 | 2021-08-17 | 주식회사 예스파워테크닉스 | 웨이퍼용 보트 |
US12027397B2 (en) * | 2020-03-23 | 2024-07-02 | Applied Materials, Inc | Enclosure system shelf including alignment features |
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US3534862A (en) * | 1968-09-13 | 1970-10-20 | Rca Corp | Semiconductor wafer transporting jig |
JPS6361145U (ko) * | 1986-10-13 | 1988-04-22 | ||
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JPH0320062A (ja) * | 1989-06-16 | 1991-01-29 | Matsushita Electron Corp | 半導体ウェハの収納ケース |
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US5154299A (en) * | 1991-10-01 | 1992-10-13 | Hwang Shih Ming | Super-thin type file holder |
JPH05102056A (ja) * | 1991-10-11 | 1993-04-23 | Rohm Co Ltd | ウエハー支持具 |
JPH05114645A (ja) * | 1991-10-22 | 1993-05-07 | Mitsubishi Electric Corp | ウエハ保持装置 |
JPH05291166A (ja) * | 1992-04-14 | 1993-11-05 | Tokyo Electron Tohoku Ltd | 異径被処理体用ボート及びそれを用いた被処理体の移し換え方法 |
-
1994
- 1994-05-31 KR KR1019940012215A patent/KR0135049B1/ko not_active IP Right Cessation
- 1994-12-02 US US08/353,255 patent/US5577621A/en not_active Expired - Lifetime
- 1994-12-08 JP JP30509794A patent/JP2702080B2/ja not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100946442B1 (ko) * | 2002-10-10 | 2010-03-10 | 하이디스 테크놀로지 주식회사 | 기판 적재용 카세트 |
Also Published As
Publication number | Publication date |
---|---|
JPH07326657A (ja) | 1995-12-12 |
JP2702080B2 (ja) | 1998-01-21 |
US5577621A (en) | 1996-11-26 |
KR0135049B1 (ko) | 1998-04-20 |
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