KR950034650A - 반도체 제조장비의 웨이퍼 장착 카세트 - Google Patents

반도체 제조장비의 웨이퍼 장착 카세트 Download PDF

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Publication number
KR950034650A
KR950034650A KR1019940012215A KR19940012215A KR950034650A KR 950034650 A KR950034650 A KR 950034650A KR 1019940012215 A KR1019940012215 A KR 1019940012215A KR 19940012215 A KR19940012215 A KR 19940012215A KR 950034650 A KR950034650 A KR 950034650A
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KR
South Korea
Prior art keywords
wafer
shelf
semiconductor manufacturing
mounting cassette
wafer mounting
Prior art date
Application number
KR1019940012215A
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English (en)
Other versions
KR0135049B1 (ko
Inventor
이경수
Original Assignee
양승택
재단법인 한국전자통신연구소
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 양승택, 재단법인 한국전자통신연구소 filed Critical 양승택
Priority to KR1019940012215A priority Critical patent/KR0135049B1/ko
Priority to US08/353,255 priority patent/US5577621A/en
Priority to JP30509794A priority patent/JP2702080B2/ja
Publication of KR950034650A publication Critical patent/KR950034650A/ko
Application granted granted Critical
Publication of KR0135049B1 publication Critical patent/KR0135049B1/ko

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H01L21/67309Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

본 발명은 반도체소자 제조장치에 사용되는 웨이퍼 장착카세트에 관한 것으로, 특히, 웨이퍼의 크기에 제약됨이 없이, 소정 범위내에서 여러가지 크기의 웨이퍼를 장입할 수 있는 반도체 제조장비의 웨이퍼 장착카세트에 관한 것이다.
종래의 웨이퍼 장착카세트는 크기가 다른 웨이퍼를 다룰 때에는 제조장치내의 모든 도구를 교체해야 하는 문제점들이 있었다.
본 발명은 상술한 문제점들을 극복하기 위한 것으로 여러크기의 웨이퍼를 동시에 각각 장입할 수 있도록 복수개의 단턱을 갖는 적어도 2개 이상의 선반과, 이 선반을 지지하는 선반고정수단으로 구성한다.

Description

반도체 제조방비의 웨이퍼 장착 카세트
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
베1도는 본 발명의 전체적인 사시도.

Claims (4)

  1. 반도체의 공정장비중 복수개의 에이퍼를 장착하여 공정을 진행하기 위한 반도체제조방지의 웨이퍼 장착 카세트에 있어서, 상기 웨이퍼의 크기에 상관없이 수용할 수 있는 선반수단과, 상기 선반수단을 소정간격으로 적어도 2개 이상 고정할 수 있는 선반고정수단을 포함하는 것을 특징으로 하는 반도체 제조방비의 웨이퍼 장착 카세트.
  2. 제1항에 있어서, 상기 선반수단은 상부에 서로 다른 직경을 갖는 웨이퍼를 각각 장착할 수 잇도록 형성한 단턱(11)과, 일측이 소정길이 연장되어 상기 선반고정수단에 연결고정되는 연결편(12)을 구비한 한쌍의 선반(10)으로 구성된 것을 특징으로 하는 반도체 제조장비의 웨이퍼 장착카세트.
  3. 제3항에 있어서, 상기 단턱(11)은 장착되는 웨이퍼의 직경과 일치하는 원호형상을 갖는 것을 특징으로 하는 반도체 제조장비의 에이퍼 장착카세트.
  4. 제1항에 있어서, 상기 선반고정수단은 상기 선반의 연결편(12)이 삽입되어 고정되는 복수개의 요홈(21)을 구비한 대립된 구조의 한쌍의 지지프레임(20)과, 상기 지지프레임을 연결고정하는 고정프레임(30)으로 구성된 것을 특징으로 하는 반도체 제조방비의 웨이퍼 장착카세트.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019940012215A 1994-05-31 1994-05-31 반도체 제조장비의 웨이퍼 장착 카세트 KR0135049B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1019940012215A KR0135049B1 (ko) 1994-05-31 1994-05-31 반도체 제조장비의 웨이퍼 장착 카세트
US08/353,255 US5577621A (en) 1994-05-31 1994-12-02 Wafer installing cassette for semiconductor manufacturing apparatus
JP30509794A JP2702080B2 (ja) 1994-05-31 1994-12-08 半導体の製造装備のウエハ装着のカセット

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019940012215A KR0135049B1 (ko) 1994-05-31 1994-05-31 반도체 제조장비의 웨이퍼 장착 카세트

Publications (2)

Publication Number Publication Date
KR950034650A true KR950034650A (ko) 1995-12-28
KR0135049B1 KR0135049B1 (ko) 1998-04-20

Family

ID=19384396

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940012215A KR0135049B1 (ko) 1994-05-31 1994-05-31 반도체 제조장비의 웨이퍼 장착 카세트

Country Status (3)

Country Link
US (1) US5577621A (ko)
JP (1) JP2702080B2 (ko)
KR (1) KR0135049B1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100946442B1 (ko) * 2002-10-10 2010-03-10 하이디스 테크놀로지 주식회사 기판 적재용 카세트

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3552178B2 (ja) * 1995-09-27 2004-08-11 大日本スクリーン製造株式会社 基板収納カセット、インターフェイス機構および基板処理装置
US5788086A (en) * 1995-12-21 1998-08-04 Dow Corning Corporation Cartridge for storing and dispensing mirror mount buttons
JP3122364B2 (ja) * 1996-02-06 2001-01-09 東京エレクトロン株式会社 ウエハボート
US6145673A (en) * 1999-03-31 2000-11-14 Applied Materials, Inc. Wafer transfer cassette
JP4855569B2 (ja) * 2000-10-20 2012-01-18 コーニング インコーポレイテッド ガラス基板を梱包するための容器
WO2002049095A1 (fr) * 2000-12-12 2002-06-20 Dainichi Shoji Kabushiki Kaisha Support de plaquette
KR100640105B1 (ko) * 2001-04-19 2006-10-30 무라타 기카이 가부시키가이샤 무인운반차, 무인운반차시스템 및 웨이퍼운반방법
US6488497B1 (en) * 2001-07-12 2002-12-03 Saint-Gobain Ceramics & Plastics, Inc. Wafer boat with arcuate wafer support arms
TWI256372B (en) * 2001-12-27 2006-06-11 Tokyo Electron Ltd Carrier system of polishing processing body and conveying method of polishing processing body
JP3924714B2 (ja) 2001-12-27 2007-06-06 東京エレクトロン株式会社 ウエハカセット
KR100870661B1 (ko) * 2002-03-15 2008-11-26 엘지디스플레이 주식회사 기판 수납용 카세트
TW565008U (en) * 2002-11-13 2003-12-01 Foxsemicon Integrated Tech Inc Substrate cassette
KR100492977B1 (ko) * 2002-12-12 2005-06-07 삼성전자주식회사 다공성 실리카 박막의 소결을 위한 웨이퍼 보트
JP2004210421A (ja) 2002-12-26 2004-07-29 Semiconductor Energy Lab Co Ltd 製造システム、並びに処理装置の操作方法
JP4667769B2 (ja) * 2004-06-11 2011-04-13 信越ポリマー株式会社 基板収納容器
TWM258968U (en) * 2004-07-22 2005-03-11 Au Optronics Corp Cassette
TWI256938B (en) * 2004-07-26 2006-06-21 Au Optronics Corp Glass substrate distribute system and method
TWI268265B (en) * 2004-08-13 2006-12-11 Au Optronics Corp Glass substrate cassette
JP2006293257A (ja) * 2005-04-08 2006-10-26 Samsung Electronics Co Ltd 表示パネル用ガラスを積載するためのガラスカセット
US20090101067A1 (en) * 2005-07-08 2009-04-23 Bonora Anthony C Method and apparatus for wafer support
US20070029268A1 (en) * 2005-08-04 2007-02-08 King Yuan Electronics Co., Lt Wafer cassette used in high temperature baking process
US8916000B2 (en) * 2005-11-29 2014-12-23 Korea Kumho Petrochemical Co., Ltd. System and method for producing carbon nanotubes
US7661544B2 (en) * 2007-02-01 2010-02-16 Tokyo Electron Limited Semiconductor wafer boat for batch processing
US8042697B2 (en) * 2008-06-30 2011-10-25 Memc Electronic Materials, Inc. Low thermal mass semiconductor wafer support
US20100098519A1 (en) * 2008-10-17 2010-04-22 Memc Electronic Materials, Inc. Support for a semiconductor wafer in a high temperature environment
TWI431712B (zh) * 2011-09-20 2014-03-21 Gudeng Prec Ind Co Ltd 大型前開式晶圓盒
TWI541928B (zh) * 2011-10-14 2016-07-11 晶元光電股份有限公司 晶圓載具
CN104139929A (zh) * 2014-07-08 2014-11-12 深圳市华星光电技术有限公司 一种包装箱
WO2016046985A1 (ja) 2014-09-26 2016-03-31 ミライアル株式会社 基板収納容器
US9478697B2 (en) * 2014-11-11 2016-10-25 Applied Materials, Inc. Reusable substrate carrier
CN104600020B (zh) * 2015-02-03 2018-01-26 北京七星华创电子股份有限公司 晶圆承载器、热处理装置及热处理方法
JP2017045823A (ja) * 2015-08-26 2017-03-02 株式会社ディスコ 収容カセット
US10535541B2 (en) 2015-12-29 2020-01-14 Taiwan Semiconductor Manufacturing Co., Ltd. Adaptive inset for wafer cassette system
TWI664130B (zh) * 2016-01-29 2019-07-01 旺矽科技股份有限公司 晶圓匣
JP2018093045A (ja) * 2016-12-02 2018-06-14 株式会社日立国際電気 基板処理装置、半導体装置の製造方法、プログラム
JP7045140B2 (ja) * 2017-06-08 2022-03-31 株式会社ディスコ ウエーハの加工方法及び加工装置
JP7009194B2 (ja) * 2017-12-12 2022-01-25 株式会社ディスコ ウエーハ生成装置および搬送トレー
US10504762B2 (en) * 2018-02-06 2019-12-10 Applied Materials, Inc. Bridging front opening unified pod (FOUP)
JP7076897B2 (ja) * 2018-02-07 2022-05-30 株式会社ディスコ フレーム収容具
KR102290078B1 (ko) * 2019-10-18 2021-08-17 주식회사 예스파워테크닉스 웨이퍼용 보트
US12027397B2 (en) * 2020-03-23 2024-07-02 Applied Materials, Inc Enclosure system shelf including alignment features

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3534862A (en) * 1968-09-13 1970-10-20 Rca Corp Semiconductor wafer transporting jig
JPS6361145U (ko) * 1986-10-13 1988-04-22
JPH01139435U (ko) * 1988-03-17 1989-09-22
US4858764A (en) * 1988-06-20 1989-08-22 Hughes Aircraft Company Adjustable carrier device for ceramic substrates and the like
US5054418A (en) * 1989-05-23 1991-10-08 Union Oil Company Of California Cage boat having removable slats
JPH0320062A (ja) * 1989-06-16 1991-01-29 Matsushita Electron Corp 半導体ウェハの収納ケース
JPH04245453A (ja) * 1991-01-30 1992-09-02 Yodogawa Kasei Kk 液晶セル収納用の可動側板付きカセット
US5154299A (en) * 1991-10-01 1992-10-13 Hwang Shih Ming Super-thin type file holder
JPH05102056A (ja) * 1991-10-11 1993-04-23 Rohm Co Ltd ウエハー支持具
JPH05114645A (ja) * 1991-10-22 1993-05-07 Mitsubishi Electric Corp ウエハ保持装置
JPH05291166A (ja) * 1992-04-14 1993-11-05 Tokyo Electron Tohoku Ltd 異径被処理体用ボート及びそれを用いた被処理体の移し換え方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100946442B1 (ko) * 2002-10-10 2010-03-10 하이디스 테크놀로지 주식회사 기판 적재용 카세트

Also Published As

Publication number Publication date
JPH07326657A (ja) 1995-12-12
KR0135049B1 (ko) 1998-04-20
JP2702080B2 (ja) 1998-01-21
US5577621A (en) 1996-11-26

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