KR950024296A - 진공처리장치 - Google Patents

진공처리장치 Download PDF

Info

Publication number
KR950024296A
KR950024296A KR1019950001403A KR19950001403A KR950024296A KR 950024296 A KR950024296 A KR 950024296A KR 1019950001403 A KR1019950001403 A KR 1019950001403A KR 19950001403 A KR19950001403 A KR 19950001403A KR 950024296 A KR950024296 A KR 950024296A
Authority
KR
South Korea
Prior art keywords
wafer
arm
vacuum processing
reaction chamber
load lock
Prior art date
Application number
KR1019950001403A
Other languages
English (en)
Other versions
KR100204976B1 (ko
Inventor
히데오 하라구치
마사키 스즈키
토시미치 이시다
Original Assignee
모리시타 요이찌
마쯔시다덴기산교 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 모리시타 요이찌, 마쯔시다덴기산교 가부시기가이샤 filed Critical 모리시타 요이찌
Publication of KR950024296A publication Critical patent/KR950024296A/ko
Application granted granted Critical
Publication of KR100204976B1 publication Critical patent/KR100204976B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

본 발명은 반도체제조, 박막형성 등을 위하여 사용되는 진공처리장치에 관한 것으로서, 1개의 구동원에 의해 구동되는 더블암 및 웨이퍼상하구동기구를 제공하고, 처리시간의 단축 및 동작의 신뢰성을 높이는 것을 목적으로 한것이며, 그 구성에 있어서, 상부암웨이퍼받침(32), 하부암웨이퍼받침(33)의 상부암구동원호기어(47), 하부암구동원호기어(50)와 웨이퍼상하구동기구를 동일축의 암구동홈캠판, 웨이퍼 쳐올리기용 홈캠판에 의해서 구동시킴으로써, 처리시간을 단축하고, 동작의 신뢰성을 높일 수 있는 것을 특징으로 한것이다.

Description

진공처리장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 제1실시예에 있어서의 진공처리장치의 웨이퍼반송기구의 구성도,
제2도는 본 발명의 제1실시예에 있어서의 진공처리장치의 진공처리장치의 전체구성도,
제3도는 본 발명의 제1실시예에 있어서의 웨이퍼반송기구의 부분평면도.

Claims (2)

  1. 반응실과, 로드록실 또는 더블로드록실과, 로드록실 또는 더블로드록실내에 있어서, 처리완료웨이퍼를 반응실로부터 꺼내는 1개의 암과 미처리웨이퍼를 반응실에 공급하는 또1개의 암으로 이루어진 더블암과, 반응실내의 웨이퍼상하기구와 웨이퍼공급기구와, 웨이퍼공급부의 웨이퍼상하기구를 구비한 진공처리장치에 있어서, 1개의 구동원에 의해 구동되는 더블암 및 웨이퍼상하구동기구와, 동기구의 선회기구와, 선회방향에 있어서의 반응실 또는, 웨이퍼공급부의 웨이퍼상하기구와 웨이퍼 상하구동기구의 선택적 걸어맞춤기구를 가진 것을 특징으로 하는 진공처리장치.
  2. 제1항에 있어서, 복수의 반응실을 가진 것을 특징으로하는 진공처리장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950001403A 1994-01-31 1995-01-26 진공처리장치 KR100204976B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP00922594A JP3264076B2 (ja) 1994-01-31 1994-01-31 真空処理装置
JP94-9225 1994-01-31

Publications (2)

Publication Number Publication Date
KR950024296A true KR950024296A (ko) 1995-08-21
KR100204976B1 KR100204976B1 (ko) 1999-06-15

Family

ID=11714483

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950001403A KR100204976B1 (ko) 1994-01-31 1995-01-26 진공처리장치

Country Status (4)

Country Link
US (2) US5636963A (ko)
JP (1) JP3264076B2 (ko)
KR (1) KR100204976B1 (ko)
CN (1) CN1114226C (ko)

Families Citing this family (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5934856A (en) * 1994-05-23 1999-08-10 Tokyo Electron Limited Multi-chamber treatment system
TW297910B (ko) * 1995-02-02 1997-02-11 Tokyo Electron Co Ltd
JPH0936198A (ja) * 1995-07-19 1997-02-07 Hitachi Ltd 真空処理装置およびそれを用いた半導体製造ライン
US6068088A (en) * 1995-08-21 2000-05-30 International Business Machines Corporation Releasable semiconductor wafer lifter basket
US5830272A (en) * 1995-11-07 1998-11-03 Sputtered Films, Inc. System for and method of providing a controlled deposition on wafers
TW318258B (ko) * 1995-12-12 1997-10-21 Tokyo Electron Co Ltd
JP3769802B2 (ja) * 1996-02-09 2006-04-26 株式会社日立製作所 半導体装置の製造方法
US5863170A (en) * 1996-04-16 1999-01-26 Gasonics International Modular process system
US5879128A (en) * 1996-07-24 1999-03-09 Applied Materials, Inc. Lift pin and support pin apparatus for a processing chamber
US6048154A (en) * 1996-10-02 2000-04-11 Applied Materials, Inc. High vacuum dual stage load lock and method for loading and unloading wafers using a high vacuum dual stage load lock
US5848670A (en) * 1996-12-04 1998-12-15 Applied Materials, Inc. Lift pin guidance apparatus
US6183183B1 (en) 1997-01-16 2001-02-06 Asm America, Inc. Dual arm linear hand-off wafer transfer assembly
US6213708B1 (en) * 1997-03-12 2001-04-10 Advanced Micro Devices, Inc. System for sorting multiple semiconductor wafers
JPH10329069A (ja) * 1997-03-31 1998-12-15 Daihen Corp 搬送システムの制御方法
JP3850952B2 (ja) * 1997-05-15 2006-11-29 東京エレクトロン株式会社 基板搬送装置及び基板搬送方法
JPH10329059A (ja) * 1997-05-30 1998-12-15 Daihen Corp ２アーム方式の搬送用ロボット装置
JP3806812B2 (ja) * 1997-07-16 2006-08-09 株式会社ダイヘン ２アーム方式の搬送用ロボット装置
JPH1138909A (ja) * 1997-07-18 1999-02-12 Toa Resin Kk 看 板
JP3722598B2 (ja) * 1997-07-16 2005-11-30 株式会社ダイヘン ２アーム方式の搬送用ロボット装置
US6722834B1 (en) 1997-10-08 2004-04-20 Applied Materials, Inc. Robot blade with dual offset wafer supports
US6164894A (en) * 1997-11-04 2000-12-26 Cheng; David Method and apparatus for integrated wafer handling and testing
KR100248704B1 (ko) * 1997-11-08 2000-03-15 정문술 반도체 소자검사기의 소자 간격조절장치
WO1999028951A2 (en) 1997-11-28 1999-06-10 Mattson Technology, Inc. Systems and methods for low contamination, high throughput handling of workpieces for vacuum processing
JPH11188671A (ja) * 1997-12-26 1999-07-13 Daihen Corp ２アーム方式の搬送用ロボット装置
JPH11188670A (ja) * 1997-12-26 1999-07-13 Daihen Corp ２アーム方式の搬送用ロボット装置
US6132165A (en) * 1998-02-23 2000-10-17 Applied Materials, Inc. Single drive, dual plane robot
US6000905A (en) * 1998-03-13 1999-12-14 Toro-Lira; Guillermo L. High speed in-vacuum flat panel display handler
JPH11333778A (ja) 1998-05-29 1999-12-07 Daihen Corp 搬送用ロボット装置
US6267549B1 (en) * 1998-06-02 2001-07-31 Applied Materials, Inc. Dual independent robot blades with minimal offset
DE19831032C2 (de) * 1998-07-11 2002-10-31 Asys Gmbh & Co Kg Greiferkopf für ein in der Herstellung und/oder Bearbeitung scheibenförmiger planarer Substrate eingesetztes Handhabungsgerät
JP3863671B2 (ja) 1998-07-25 2006-12-27 株式会社ダイヘン 搬送用ロボット装置
US6250870B1 (en) * 1998-08-05 2001-06-26 Micron Electronics, Inc. Apparatus for handling and processing microelectronic-device substrate assemblies
US6413459B1 (en) 1998-08-05 2002-07-02 Micron Technology, Inc. Method for handling and processing microelectronic-device substrate assemblies
US6178361B1 (en) * 1998-11-20 2001-01-23 Karl Suss America, Inc. Automatic modular wafer substrate handling device
JP2000174094A (ja) * 1998-12-08 2000-06-23 Hitachi Ltd 半導体製造装置
US6350097B1 (en) 1999-04-19 2002-02-26 Applied Materials, Inc. Method and apparatus for processing wafers
KR100355770B1 (ko) * 1999-12-31 2002-10-19 아남반도체 주식회사 웨이퍼 핸들링 시스템의 웨이퍼 핸들링 방법
US6420864B1 (en) * 2000-04-13 2002-07-16 Nanophotonics Ag Modular substrate measurement system
US6585478B1 (en) 2000-11-07 2003-07-01 Asm America, Inc. Semiconductor handling robot with improved paddle-type end effector
US6663333B2 (en) * 2001-07-13 2003-12-16 Axcelis Technologies, Inc. Wafer transport apparatus
US20040101385A1 (en) * 2002-11-25 2004-05-27 Ta-Kuang Chang Semiconductor process apparatus and SMIF pod used therein
US20060090703A1 (en) * 2004-11-01 2006-05-04 Tokyo Electron Limited Substrate processing method, system and program
TWI383430B (zh) * 2006-01-27 2013-01-21 Advanced Micro Fab Equip Inc 半導體製程處理系統及其處理方法
WO2008088109A1 (en) * 2007-01-16 2008-07-24 Tes Co., Ltd A loadlock chamber having dual-arm and a transportation system for processing semiconductor material using a loadlock chamber having dual-arm
US20100147396A1 (en) * 2008-12-15 2010-06-17 Asm Japan K.K. Multiple-Substrate Transfer Apparatus and Multiple-Substrate Processing Apparatus
CN101930904B (zh) * 2009-06-22 2012-11-21 由田新技股份有限公司 晶片顶出装置与取像装置的组合
KR101477366B1 (ko) * 2009-12-28 2015-01-06 가부시키가이샤 아루박 구동장치 및 반송 장치
US8802545B2 (en) * 2011-03-14 2014-08-12 Plasma-Therm Llc Method and apparatus for plasma dicing a semi-conductor wafer
CN103367222B (zh) * 2012-04-10 2016-08-17 上海卓晶半导体科技有限公司 一种多片盒升降旋转系统
CN103484819B (zh) * 2012-06-11 2017-08-04 赛恩倍吉科技顾问（深圳）有限公司 顶出装置
CN104995726B (zh) * 2013-03-14 2018-07-31 应用材料公司 多区加热器中的温度测量
CN106435507B (zh) * 2016-11-10 2018-11-20 北京帕托真空技术有限公司 一种镀膜机旋转装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0825151B2 (ja) * 1988-09-16 1996-03-13 東京応化工業株式会社 ハンドリングユニット
DE4232959C2 (de) * 1992-10-01 2001-05-10 Leybold Ag Vorrichtung zum Ein- und Ausschleusen scheibenförmiger Substrate

Also Published As

Publication number Publication date
CN1111033A (zh) 1995-11-01
US5851296A (en) 1998-12-22
US5636963A (en) 1997-06-10
KR100204976B1 (ko) 1999-06-15
CN1114226C (zh) 2003-07-09
JP3264076B2 (ja) 2002-03-11
JPH07221157A (ja) 1995-08-18

Similar Documents

Publication Publication Date Title
KR950024296A (ko) 진공처리장치
TW502284B (en) Multichamber system of etching facility for manufacturing semiconductor device
KR950034488A (ko) 반도체 제조장치 및 반도체장치의 제조방법과 반도체장치
KR930022122A (ko) 진공처리장치
DE60011215D1 (de) Vorrichtung zum Aufbringen von dünnen Schichten
ATE102397T1 (de) Integriertes bearbeitungssystem mit vielfachkammer.
KR900015861A (ko) 직접교시방식 로보트의 교시장치
KR910007100A (ko) 기판 처리 장치 및 기판 처리방법
KR100288085B1 (ko) 기판 반송용 스칼라형 로보트
ATE85783T1 (de) Vorrichtung zum foerdern von gegenstaenden.
KR890002979A (ko) 집적 회로 및 그외의 다른 전자 장치를 제조하기 위한 장치 및 방법
KR200156129Y1 (ko) 반도체 노광장비의 웨이퍼 반송용 핀셋 구동장치
WO1999063583A3 (en) Improved method and apparatus for contacting a wafer
JPH01206643A (ja) 基板吸着構造
KR890002978A (ko) 집적 회로 및 그외의 다른 전자 장치를 제조하기 위한 장치 및 방법
WO1998031046A3 (de) Teststation für halbleiterwafer bzw. bruchstücke von halbleiterwafern
JP2000021798A (ja) 基板処理装置
KR200152372Y1 (ko) 배큠캐리어용 이송벨트의 장력 조절장치
KR970052001A (ko) 반도체 제조장비의 도어 개폐장치
SE0203332D0 (sv) Anordning för utförande av en ytbehandling av en substrat under vakuum
JPH08290804A (ja) カセット位置決め装置
ITMI930708U1 (it) Dispositivo di avanzamento per macchine per la lavorazione del legno specialmente fresatrici
JPH04155925A (ja) ウェットエッチング装置
KR970077310A (ko) 건식식각설비의 웨이퍼 장착체의 구동장치
KR950024293A (ko) 웨이퍼 이송장치

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20100323

Year of fee payment: 12

LAPS Lapse due to unpaid annual fee