KR950023254A - 전자 패키지용 공동 및 범프 접속 구조물 - Google Patents

전자 패키지용 공동 및 범프 접속 구조물 Download PDF

Info

Publication number
KR950023254A
KR950023254A KR1019940034641A KR19940034641A KR950023254A KR 950023254 A KR950023254 A KR 950023254A KR 1019940034641 A KR1019940034641 A KR 1019940034641A KR 19940034641 A KR19940034641 A KR 19940034641A KR 950023254 A KR950023254 A KR 950023254A
Authority
KR
South Korea
Prior art keywords
printed wiring
holes
wiring board
plated
connection structure
Prior art date
Application number
KR1019940034641A
Other languages
English (en)
Inventor
소브하니 모히
Original Assignee
완다 케이. 덴슨-로우
휴우즈 에어크라프트 캄파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 완다 케이. 덴슨-로우, 휴우즈 에어크라프트 캄파니 filed Critical 완다 케이. 덴슨-로우
Publication of KR950023254A publication Critical patent/KR950023254A/ko

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/51Fixed connections for rigid printed circuits or like structures
    • H01R12/52Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/59Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/62Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits
    • H05K3/365Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007Surface contacts, e.g. bumps
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0364Conductor shape
    • H05K2201/0367Metallic bump or raised conductor not used as solder bump
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09036Recesses or grooves in insulating substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09372Pads and lands
    • H05K2201/09472Recessed pad for surface mounting; Recessed electrode of component
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09736Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16Inspection; Monitoring; Aligning
    • H05K2203/167Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128Assembling formed circuit to base
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49204Contact or terminal manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)

Abstract

본 발명은 두 개의 인쇄 배선 구조물들의 전기 접속에 관한 것이다. 두 개의 인쇄 배선판(11,16)들 또는 플렉스 프린트(20)과 인쇄 배선판(11)은 인쇄 배선판(11)의 표면(12) 상에 도금된 구멍 패턴(12)를 형성함으로써 접속되고, 도금된 구멍 패턴(12)의 구멍(13)들은 제2 인쇄 배선판(16) 또는 플렉스프린트 회로(20) 상에 설치된 대응범프(17)들 또는 딤플(17)들과 접합된다. 제1 인쇄 배선판(11)에 형성된 구멍(13)들은 인쇄 배선판(11)의 표면(18) 아래로 소정의 깊이, 통상 0.178mm 내지 0.508mm(0.007 인치 내지 0.020 인치)의 깊이로 설치된다. 복수의 도금된 구멍(13)들은 구멍(13)들을 무전해 도금 또는 전기 도금함으로써 형성된다. 본 접속 구조물(10)은 두개의 인쇄 배선판(11,16)들 또는 플렉스프린트 회로(20)과 인쇄 배선판(11)의 신뢰할 수 있고 자체 정력가능한 접속을 제공한다.

Description

전자 패키지용 공동 및 범프 접속 구조물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 원리에 따른 두 개의 인쇄 배선 구조물을 상호 접속하기 위한 공동 및 범프 접속 구조물을 도시하는 도면,
제2도는 접합하기 전의 본 발명에서 채용한 공동 및 범프의 확대도,
제3도는 접합한 후의 제2도의 공동 및 범프의 확대도.

Claims (7)

  1. 복수의 인쇄 배선 구조물들을 접속하는데 사용하기 위한 접속 구조물에 있어서, 제1 인쇄 배선 구조물(11)에 설치된 오목한 횡단면을 갖는 복수의 도금된 구멍(13)들을 구비하는 도금된 구멍 패턴(12)와, 제1 인쇄 배선 구조물(11)에 설치된 복수의 도금된 구멍(13)들과 접합하도록 된 제2 인쇄 배선 구조물(16,20) 상에 설치된 복수의 범프(17)들을 구비하고 있는 접속 구조물.
  2. 제1항에 있어서, 제1 및 제2 인쇄 배선 구조물들은 인쇄 배선판(11,16)들인 것을 특징으로 하는 접속 구조물.
  3. 제1항에 있어서, 제1 인쇄 배선 구조물은 인쇄 배선판(11)이고, 제2 인쇄 배선 구조물은 플렉스프린트 회로(20)인 것을 특징으로 하는 접속 구조물.
  4. 제1항에 있어서, 제1 인쇄 배선판(11)에 설치된 구멍(13)들은 제1 인쇄 배선판(11)의 표면(18) 이래로 소정의 깊이로 설치되는 것을 특징으로 하는 접속 구조물.
  5. 제4항에 있어서, 소정의 깊이는 제1 인쇄 배선판(11)의 표면(18) 이래로 0.178mm 내지 0.508mm(0.007인치 내지 0.020인치)인 것을 특징으로 하는 접속 구조물.
  6. 제1항에 있어서, 복수의 도금된 구멍(13)들은 구멍(13)들을 무전해 도금함으로써 형성되는 것을 특징으로 하는 접속 구조물.
  7. 제1항에 있어서, 복수의 도금된 구멍(13)들은 구멍(13)들을 전기 도금함으로써 형성되는 것을 특징으로 하는 접속 구조물.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019940034641A 1993-12-17 1994-12-16 전자 패키지용 공동 및 범프 접속 구조물 KR950023254A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US16834293A 1993-12-17 1993-12-17
US08/168,342 1993-12-17

Publications (1)

Publication Number Publication Date
KR950023254A true KR950023254A (ko) 1995-07-28

Family

ID=22611130

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940034641A KR950023254A (ko) 1993-12-17 1994-12-16 전자 패키지용 공동 및 범프 접속 구조물

Country Status (6)

Country Link
US (1) US5525065A (ko)
EP (1) EP0658960A3 (ko)
JP (1) JP2825772B2 (ko)
KR (1) KR950023254A (ko)
CA (1) CA2135241C (ko)
IL (1) IL111951A (ko)

Families Citing this family (78)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5372512A (en) * 1993-04-30 1994-12-13 Hewlett-Packard Company Electrical interconnect system for a flexible circuit
US5620329A (en) * 1996-06-17 1997-04-15 General Motors Corporation Self-aligning electrical connective arrangement
SE516011C2 (sv) * 1996-12-19 2001-11-05 Ericsson Telefon Ab L M Tätpackade elektriska kontaktdon
US6246548B1 (en) 1997-03-24 2001-06-12 Maxtor Corporation Mechanically formed standoffs in a circuit interconnect
US6114221A (en) * 1998-03-16 2000-09-05 International Business Machines Corporation Method and apparatus for interconnecting multiple circuit chips
US6172414B1 (en) * 1998-04-28 2001-01-09 Trw Inc. Apparatus and method for snap-on thermo-compression bonding
SG75841A1 (en) 1998-05-02 2000-10-24 Eriston Invest Pte Ltd Flip chip assembly with via interconnection
US6406939B1 (en) 1998-05-02 2002-06-18 Charles W. C. Lin Flip chip assembly with via interconnection
TW444236B (en) 1998-12-17 2001-07-01 Charles Wen Chyang Lin Bumpless flip chip assembly with strips and via-fill
TW396462B (en) 1998-12-17 2000-07-01 Eriston Technologies Pte Ltd Bumpless flip chip assembly with solder via
SG78324A1 (en) 1998-12-17 2001-02-20 Eriston Technologies Pte Ltd Bumpless flip chip assembly with strips-in-via and plating
US6316737B1 (en) * 1999-09-09 2001-11-13 Vlt Corporation Making a connection between a component and a circuit board
US6350633B1 (en) 2000-08-22 2002-02-26 Charles W. C. Lin Semiconductor chip assembly with simultaneously electroplated contact terminal and connection joint
US6551861B1 (en) 2000-08-22 2003-04-22 Charles W. C. Lin Method of making a semiconductor chip assembly by joining the chip to a support circuit with an adhesive
US6403460B1 (en) 2000-08-22 2002-06-11 Charles W. C. Lin Method of making a semiconductor chip assembly
US6562657B1 (en) 2000-08-22 2003-05-13 Charles W. C. Lin Semiconductor chip assembly with simultaneously electrolessly plated contact terminal and connection joint
US6660626B1 (en) 2000-08-22 2003-12-09 Charles W. C. Lin Semiconductor chip assembly with simultaneously electrolessly plated contact terminal and connection joint
US6562709B1 (en) 2000-08-22 2003-05-13 Charles W. C. Lin Semiconductor chip assembly with simultaneously electroplated contact terminal and connection joint
US6402970B1 (en) 2000-08-22 2002-06-11 Charles W. C. Lin Method of making a support circuit for a semiconductor chip assembly
US6436734B1 (en) 2000-08-22 2002-08-20 Charles W. C. Lin Method of making a support circuit for a semiconductor chip assembly
US6350386B1 (en) 2000-09-20 2002-02-26 Charles W. C. Lin Method of making a support circuit with a tapered through-hole for a semiconductor chip assembly
US6511865B1 (en) 2000-09-20 2003-01-28 Charles W. C. Lin Method for forming a ball bond connection joint on a conductive trace and conductive pad in a semiconductor chip assembly
US6350632B1 (en) 2000-09-20 2002-02-26 Charles W. C. Lin Semiconductor chip assembly with ball bond connection joint
US6544813B1 (en) 2000-10-02 2003-04-08 Charles W. C. Lin Method of making a semiconductor chip assembly with a conductive trace subtractively formed before and after chip attachment
US6448108B1 (en) 2000-10-02 2002-09-10 Charles W. C. Lin Method of making a semiconductor chip assembly with a conductive trace subtractively formed before and after chip attachment
US6673710B1 (en) 2000-10-13 2004-01-06 Bridge Semiconductor Corporation Method of connecting a conductive trace and an insulative base to a semiconductor chip
US6699780B1 (en) 2000-10-13 2004-03-02 Bridge Semiconductor Corporation Method of connecting a conductive trace to a semiconductor chip using plasma undercut etching
US6548393B1 (en) 2000-10-13 2003-04-15 Charles W. C. Lin Semiconductor chip assembly with hardened connection joint
US7009297B1 (en) 2000-10-13 2006-03-07 Bridge Semiconductor Corporation Semiconductor chip assembly with embedded metal particle
US6576493B1 (en) 2000-10-13 2003-06-10 Bridge Semiconductor Corporation Method of connecting a conductive trace and an insulative base to a semiconductor chip using multiple etch steps
US6984576B1 (en) 2000-10-13 2006-01-10 Bridge Semiconductor Corporation Method of connecting an additively and subtractively formed conductive trace and an insulative base to a semiconductor chip
US7132741B1 (en) 2000-10-13 2006-11-07 Bridge Semiconductor Corporation Semiconductor chip assembly with carved bumped terminal
US6872591B1 (en) 2000-10-13 2005-03-29 Bridge Semiconductor Corporation Method of making a semiconductor chip assembly with a conductive trace and a substrate
US7264991B1 (en) 2000-10-13 2007-09-04 Bridge Semiconductor Corporation Method of connecting a conductive trace to a semiconductor chip using conductive adhesive
US6576539B1 (en) 2000-10-13 2003-06-10 Charles W.C. Lin Semiconductor chip assembly with interlocked conductive trace
US6492252B1 (en) 2000-10-13 2002-12-10 Bridge Semiconductor Corporation Method of connecting a bumped conductive trace to a semiconductor chip
US7414319B2 (en) * 2000-10-13 2008-08-19 Bridge Semiconductor Corporation Semiconductor chip assembly with metal containment wall and solder terminal
US6440835B1 (en) 2000-10-13 2002-08-27 Charles W. C. Lin Method of connecting a conductive trace to a semiconductor chip
US7190080B1 (en) 2000-10-13 2007-03-13 Bridge Semiconductor Corporation Semiconductor chip assembly with embedded metal pillar
US6537851B1 (en) 2000-10-13 2003-03-25 Bridge Semiconductor Corporation Method of connecting a bumped compliant conductive trace to a semiconductor chip
US7129575B1 (en) 2000-10-13 2006-10-31 Bridge Semiconductor Corporation Semiconductor chip assembly with bumped metal pillar
US6949408B1 (en) 2000-10-13 2005-09-27 Bridge Semiconductor Corporation Method of connecting a conductive trace and an insulative base to a semiconductor chip using multiple etch steps
US7262082B1 (en) 2000-10-13 2007-08-28 Bridge Semiconductor Corporation Method of making a three-dimensional stacked semiconductor package with a metal pillar and a conductive interconnect in an encapsulant aperture
US6908788B1 (en) 2000-10-13 2005-06-21 Bridge Semiconductor Corporation Method of connecting a conductive trace to a semiconductor chip using a metal base
US7094676B1 (en) 2000-10-13 2006-08-22 Bridge Semiconductor Corporation Semiconductor chip assembly with embedded metal pillar
US6740576B1 (en) 2000-10-13 2004-05-25 Bridge Semiconductor Corporation Method of making a contact terminal with a plated metal peripheral sidewall portion for a semiconductor chip assembly
US7129113B1 (en) 2000-10-13 2006-10-31 Bridge Semiconductor Corporation Method of making a three-dimensional stacked semiconductor package with a metal pillar in an encapsulant aperture
US7071089B1 (en) 2000-10-13 2006-07-04 Bridge Semiconductor Corporation Method of making a semiconductor chip assembly with a carved bumped terminal
US6876072B1 (en) 2000-10-13 2005-04-05 Bridge Semiconductor Corporation Semiconductor chip assembly with chip in substrate cavity
US7319265B1 (en) 2000-10-13 2008-01-15 Bridge Semiconductor Corporation Semiconductor chip assembly with precision-formed metal pillar
US7075186B1 (en) 2000-10-13 2006-07-11 Bridge Semiconductor Corporation Semiconductor chip assembly with interlocked contact terminal
US6667229B1 (en) 2000-10-13 2003-12-23 Bridge Semiconductor Corporation Method of connecting a bumped compliant conductive trace and an insulative base to a semiconductor chip
US6444489B1 (en) 2000-12-15 2002-09-03 Charles W. C. Lin Semiconductor chip assembly with bumped molded substrate
US6653170B1 (en) 2001-02-06 2003-11-25 Charles W. C. Lin Semiconductor chip assembly with elongated wire ball bonded to chip and electrolessly plated to support circuit
US6674647B2 (en) * 2002-01-07 2004-01-06 International Business Machines Corporation Low or no-force bump flattening structure and method
DE10304906A1 (de) * 2003-02-06 2004-09-16 Siemens Ag SMT-fähiges Bauelement und Leiterplatte sowie SMT-Verfahren
JP2006518944A (ja) * 2003-02-25 2006-08-17 テッセラ,インコーポレイテッド バンプを有するボールグリッドアレー
DE10324450A1 (de) * 2003-05-28 2005-01-05 Infineon Technologies Ag Kontaktierungsvorrichtung für elektronische Schaltungseinheiten und Herstellungsverfahren
US7993983B1 (en) 2003-11-17 2011-08-09 Bridge Semiconductor Corporation Method of making a semiconductor chip assembly with chip and encapsulant grinding
US7425759B1 (en) 2003-11-20 2008-09-16 Bridge Semiconductor Corporation Semiconductor chip assembly with bumped terminal and filler
US7538415B1 (en) 2003-11-20 2009-05-26 Bridge Semiconductor Corporation Semiconductor chip assembly with bumped terminal, filler and insulative base
US7404252B2 (en) * 2004-10-18 2008-07-29 International Business Machines Corporation Method for fastening two coplanar edges without a weld
US7750483B1 (en) 2004-11-10 2010-07-06 Bridge Semiconductor Corporation Semiconductor chip assembly with welded metal pillar and enlarged plated contact terminal
US7446419B1 (en) 2004-11-10 2008-11-04 Bridge Semiconductor Corporation Semiconductor chip assembly with welded metal pillar of stacked metal balls
US7268421B1 (en) 2004-11-10 2007-09-11 Bridge Semiconductor Corporation Semiconductor chip assembly with welded metal pillar that includes enlarged ball bond
US7494843B1 (en) 2006-12-26 2009-02-24 Bridge Semiconductor Corporation Method of making a semiconductor chip assembly with thermal conductor and encapsulant grinding
US7811863B1 (en) 2006-10-26 2010-10-12 Bridge Semiconductor Corporation Method of making a semiconductor chip assembly with metal pillar and encapsulant grinding and heat sink attachment
US7785113B2 (en) 2006-10-27 2010-08-31 Asahi Denka Kenkyusho Co., Ltd. Electrical connection structure
KR101022912B1 (ko) * 2008-11-28 2011-03-17 삼성전기주식회사 금속범프를 갖는 인쇄회로기판 및 그 제조방법
TWI395279B (zh) * 2009-12-30 2013-05-01 Ind Tech Res Inst 微凸塊結構
EP2628173A2 (en) * 2010-10-13 2013-08-21 ABB Research Ltd. Semiconductor module and method of manufacturing a semiconductor module
US9832887B2 (en) * 2013-08-07 2017-11-28 Invensas Corporation Micro mechanical anchor for 3D architecture
US10008797B2 (en) 2015-07-10 2018-06-26 Te Connectivity Corporation Flexible printed circuit connector and connector assembly including the same
US10468363B2 (en) * 2015-08-10 2019-11-05 X-Celeprint Limited Chiplets with connection posts
US11495560B2 (en) * 2015-08-10 2022-11-08 X Display Company Technology Limited Chiplets with connection posts
US10750614B2 (en) * 2017-06-12 2020-08-18 Invensas Corporation Deformable electrical contacts with conformable target pads
CN107741676A (zh) * 2017-10-19 2018-02-27 武汉华星光电半导体显示技术有限公司 一种耦合压接端子结构及显示装置
WO2021184188A1 (zh) * 2020-03-17 2021-09-23 元锦生物科技股份有限公司 可拆式接合结构

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3465435A (en) * 1967-05-08 1969-09-09 Ibm Method of forming an interconnecting multilayer circuitry
DE2947811C2 (de) * 1979-11-28 1983-06-16 Leopold Kostal GmbH & Co KG, 5880 Lüdenscheid Kontaktkörper
US4813129A (en) * 1987-06-19 1989-03-21 Hewlett-Packard Company Interconnect structure for PC boards and integrated circuits
US4940181A (en) * 1989-04-06 1990-07-10 Motorola, Inc. Pad grid array for receiving a solder bumped chip carrier
KR940004246B1 (ko) * 1989-09-11 1994-05-19 신닛뽕 세이데쓰 가부시끼가이샤 Tab 테이프와 반도체칩을 접속하는 방법 및 그것에 사용하는 범프시이트와 범프 부착 tab 테이프
US5121299A (en) * 1989-12-29 1992-06-09 International Business Machines Corporation Multi-level circuit structure utilizing conductive cores having conductive protrusions and cavities therein
US5071363A (en) * 1990-04-18 1991-12-10 Minnesota Mining And Manufacturing Company Miniature multiple conductor electrical connector
US5197184A (en) * 1990-09-11 1993-03-30 Hughes Aircraft Company Method of forming three-dimensional circuitry
JPH04142095A (ja) * 1990-10-02 1992-05-15 Sharp Corp 部材の接続構造
JPH0467379U (ko) * 1990-10-23 1992-06-15
US5147208A (en) * 1991-06-28 1992-09-15 Rogers Corporation Flexible printed circuit with raised contacts
JPH07105420B2 (ja) * 1991-08-26 1995-11-13 ヒューズ・エアクラフト・カンパニー 成形された接点をもった電気接続
EP0529578B1 (en) * 1991-08-26 1996-01-31 Hughes Aircraft Company Semi-additive circuitry with raised features using formed mandrels
JPH05267811A (ja) * 1992-03-17 1993-10-15 Fujitsu Denso Ltd プリント基板の接続構造及びその接続ランドの製造方法
US5213511A (en) * 1992-03-27 1993-05-25 Hughes Aircraft Company Dimple interconnect for flat cables and printed wiring boards
US5245135A (en) * 1992-04-20 1993-09-14 Hughes Aircraft Company Stackable high density interconnection mechanism (SHIM)
US5288235A (en) * 1992-12-14 1994-02-22 Hughes Aircraft Company Electrical interconnects having a supported bulge configuration
US5342207A (en) * 1992-12-14 1994-08-30 Hughes Aircraft Company Electrical interconnection method and apparatus utilizing raised connecting means
US5326412A (en) * 1992-12-22 1994-07-05 Hughes Aircraft Company Method for electrodepositing corrosion barrier on isolated circuitry
US5372512A (en) * 1993-04-30 1994-12-13 Hewlett-Packard Company Electrical interconnect system for a flexible circuit

Also Published As

Publication number Publication date
IL111951A (en) 1998-02-22
US5525065A (en) 1996-06-11
IL111951A0 (en) 1995-03-15
JPH07263830A (ja) 1995-10-13
EP0658960A3 (en) 1997-01-29
CA2135241A1 (en) 1995-06-18
CA2135241C (en) 1998-08-04
JP2825772B2 (ja) 1998-11-18
EP0658960A2 (en) 1995-06-21

Similar Documents

Publication Publication Date Title
KR950023254A (ko) 전자 패키지용 공동 및 범프 접속 구조물
KR870009614A (ko) 드로우 홀 접속부를 가진 인쇄 배선기판
US4990724A (en) Method and apparatus for electrically interconnecting opposite sides of a flex circuit
JPH0268988A (ja) 表面実装プリント配線板
KR920003823A (ko) 직접 회로를 회로보오드에 접속하는 방법 및 회로 보오드 어셈블리
KR880700616A (ko) 다층 프린트 기판
KR950035538A (ko) 프린트 배선판
JPS6424491A (en) Printed board
JPH07131140A (ja) プリント板
JPH02146472U (ko)
JP2755029B2 (ja) 多層印刷配線板
JPS6437073A (en) Printed board
KR960028733A (ko) 전자부품의 고정단자구조체
KR970019776A (ko) 전자기기의 주회로기판과 보조회로기판의 장착구조
KR101036014B1 (ko) 커넥터 형상을 갖는 인쇄회로기판
JPH0143877Y2 (ko)
JPH073661Y2 (ja) プリント基板
JPH05110260A (ja) プリント配線板の配線構造
JPH05114774A (ja) Fpc及びfpcコネクタ
JPH05327225A (ja) 多層印刷配線板
JPH05121261A (ja) チツプ部品およびチツプ部品取付構造
JPS61158972U (ko)
JPH05267851A (ja) 多層印刷配線板
JPH03117867U (ko)
JPS61207063U (ko)

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application