KR950023254A - 전자 패키지용 공동 및 범프 접속 구조물 - Google Patents

전자 패키지용 공동 및 범프 접속 구조물 Download PDF

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Publication number
KR950023254A
KR950023254A KR1019940034641A KR19940034641A KR950023254A KR 950023254 A KR950023254 A KR 950023254A KR 1019940034641 A KR1019940034641 A KR 1019940034641A KR 19940034641 A KR19940034641 A KR 19940034641A KR 950023254 A KR950023254 A KR 950023254A
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KR
South Korea
Prior art keywords
printed wiring
holes
wiring board
plated
connection structure
Prior art date
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KR1019940034641A
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English (en)
Inventor
소브하니 모히
Original Assignee
완다 케이. 덴슨-로우
휴우즈 에어크라프트 캄파니
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Application filed by 완다 케이. 덴슨-로우, 휴우즈 에어크라프트 캄파니 filed Critical 완다 케이. 덴슨-로우
Publication of KR950023254A publication Critical patent/KR950023254A/ko

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/51Fixed connections for rigid printed circuits or like structures
    • H01R12/52Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/59Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/62Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits
    • H05K3/365Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007Surface contacts, e.g. bumps
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0364Conductor shape
    • H05K2201/0367Metallic bump or raised conductor not used as solder bump
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09036Recesses or grooves in insulating substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09372Pads and lands
    • H05K2201/09472Recessed pad for surface mounting; Recessed electrode of component
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09736Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16Inspection; Monitoring; Aligning
    • H05K2203/167Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128Assembling formed circuit to base
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49204Contact or terminal manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Combinations Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

본 발명은 두 개의 인쇄 배선 구조물들의 전기 접속에 관한 것이다. 두 개의 인쇄 배선판(11,16)들 또는 플렉스 프린트(20)과 인쇄 배선판(11)은 인쇄 배선판(11)의 표면(12) 상에 도금된 구멍 패턴(12)를 형성함으로써 접속되고, 도금된 구멍 패턴(12)의 구멍(13)들은 제2 인쇄 배선판(16) 또는 플렉스프린트 회로(20) 상에 설치된 대응범프(17)들 또는 딤플(17)들과 접합된다. 제1 인쇄 배선판(11)에 형성된 구멍(13)들은 인쇄 배선판(11)의 표면(18) 아래로 소정의 깊이, 통상 0.178mm 내지 0.508mm(0.007 인치 내지 0.020 인치)의 깊이로 설치된다. 복수의 도금된 구멍(13)들은 구멍(13)들을 무전해 도금 또는 전기 도금함으로써 형성된다. 본 접속 구조물(10)은 두개의 인쇄 배선판(11,16)들 또는 플렉스프린트 회로(20)과 인쇄 배선판(11)의 신뢰할 수 있고 자체 정력가능한 접속을 제공한다.

Description

전자 패키지용 공동 및 범프 접속 구조물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 원리에 따른 두 개의 인쇄 배선 구조물을 상호 접속하기 위한 공동 및 범프 접속 구조물을 도시하는 도면,
제2도는 접합하기 전의 본 발명에서 채용한 공동 및 범프의 확대도,
제3도는 접합한 후의 제2도의 공동 및 범프의 확대도.

Claims (7)

  1. 복수의 인쇄 배선 구조물들을 접속하는데 사용하기 위한 접속 구조물에 있어서, 제1 인쇄 배선 구조물(11)에 설치된 오목한 횡단면을 갖는 복수의 도금된 구멍(13)들을 구비하는 도금된 구멍 패턴(12)와, 제1 인쇄 배선 구조물(11)에 설치된 복수의 도금된 구멍(13)들과 접합하도록 된 제2 인쇄 배선 구조물(16,20) 상에 설치된 복수의 범프(17)들을 구비하고 있는 접속 구조물.
  2. 제1항에 있어서, 제1 및 제2 인쇄 배선 구조물들은 인쇄 배선판(11,16)들인 것을 특징으로 하는 접속 구조물.
  3. 제1항에 있어서, 제1 인쇄 배선 구조물은 인쇄 배선판(11)이고, 제2 인쇄 배선 구조물은 플렉스프린트 회로(20)인 것을 특징으로 하는 접속 구조물.
  4. 제1항에 있어서, 제1 인쇄 배선판(11)에 설치된 구멍(13)들은 제1 인쇄 배선판(11)의 표면(18) 이래로 소정의 깊이로 설치되는 것을 특징으로 하는 접속 구조물.
  5. 제4항에 있어서, 소정의 깊이는 제1 인쇄 배선판(11)의 표면(18) 이래로 0.178mm 내지 0.508mm(0.007인치 내지 0.020인치)인 것을 특징으로 하는 접속 구조물.
  6. 제1항에 있어서, 복수의 도금된 구멍(13)들은 구멍(13)들을 무전해 도금함으로써 형성되는 것을 특징으로 하는 접속 구조물.
  7. 제1항에 있어서, 복수의 도금된 구멍(13)들은 구멍(13)들을 전기 도금함으로써 형성되는 것을 특징으로 하는 접속 구조물.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019940034641A 1993-12-17 1994-12-16 전자 패키지용 공동 및 범프 접속 구조물 KR950023254A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US16834293A 1993-12-17 1993-12-17
US08/168,342 1993-12-17

Publications (1)

Publication Number Publication Date
KR950023254A true KR950023254A (ko) 1995-07-28

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KR1019940034641A KR950023254A (ko) 1993-12-17 1994-12-16 전자 패키지용 공동 및 범프 접속 구조물

Country Status (6)

Country Link
US (1) US5525065A (ko)
EP (1) EP0658960A3 (ko)
JP (1) JP2825772B2 (ko)
KR (1) KR950023254A (ko)
CA (1) CA2135241C (ko)
IL (1) IL111951A (ko)

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US5525065A (en) 1996-06-11
CA2135241A1 (en) 1995-06-18
CA2135241C (en) 1998-08-04
IL111951A0 (en) 1995-03-15
EP0658960A2 (en) 1995-06-21
EP0658960A3 (en) 1997-01-29
JP2825772B2 (ja) 1998-11-18
IL111951A (en) 1998-02-22
JPH07263830A (ja) 1995-10-13

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