KR950023254A - 전자 패키지용 공동 및 범프 접속 구조물 - Google Patents
전자 패키지용 공동 및 범프 접속 구조물 Download PDFInfo
- Publication number
- KR950023254A KR950023254A KR1019940034641A KR19940034641A KR950023254A KR 950023254 A KR950023254 A KR 950023254A KR 1019940034641 A KR1019940034641 A KR 1019940034641A KR 19940034641 A KR19940034641 A KR 19940034641A KR 950023254 A KR950023254 A KR 950023254A
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- South Korea
- Prior art keywords
- printed wiring
- holes
- wiring board
- plated
- connection structure
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/62—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/365—Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0367—Metallic bump or raised conductor not used as solder bump
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Metallurgy (AREA)
- Combinations Of Printed Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
본 발명은 두 개의 인쇄 배선 구조물들의 전기 접속에 관한 것이다. 두 개의 인쇄 배선판(11,16)들 또는 플렉스 프린트(20)과 인쇄 배선판(11)은 인쇄 배선판(11)의 표면(12) 상에 도금된 구멍 패턴(12)를 형성함으로써 접속되고, 도금된 구멍 패턴(12)의 구멍(13)들은 제2 인쇄 배선판(16) 또는 플렉스프린트 회로(20) 상에 설치된 대응범프(17)들 또는 딤플(17)들과 접합된다. 제1 인쇄 배선판(11)에 형성된 구멍(13)들은 인쇄 배선판(11)의 표면(18) 아래로 소정의 깊이, 통상 0.178mm 내지 0.508mm(0.007 인치 내지 0.020 인치)의 깊이로 설치된다. 복수의 도금된 구멍(13)들은 구멍(13)들을 무전해 도금 또는 전기 도금함으로써 형성된다. 본 접속 구조물(10)은 두개의 인쇄 배선판(11,16)들 또는 플렉스프린트 회로(20)과 인쇄 배선판(11)의 신뢰할 수 있고 자체 정력가능한 접속을 제공한다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 원리에 따른 두 개의 인쇄 배선 구조물을 상호 접속하기 위한 공동 및 범프 접속 구조물을 도시하는 도면,
제2도는 접합하기 전의 본 발명에서 채용한 공동 및 범프의 확대도,
제3도는 접합한 후의 제2도의 공동 및 범프의 확대도.
Claims (7)
- 복수의 인쇄 배선 구조물들을 접속하는데 사용하기 위한 접속 구조물에 있어서, 제1 인쇄 배선 구조물(11)에 설치된 오목한 횡단면을 갖는 복수의 도금된 구멍(13)들을 구비하는 도금된 구멍 패턴(12)와, 제1 인쇄 배선 구조물(11)에 설치된 복수의 도금된 구멍(13)들과 접합하도록 된 제2 인쇄 배선 구조물(16,20) 상에 설치된 복수의 범프(17)들을 구비하고 있는 접속 구조물.
- 제1항에 있어서, 제1 및 제2 인쇄 배선 구조물들은 인쇄 배선판(11,16)들인 것을 특징으로 하는 접속 구조물.
- 제1항에 있어서, 제1 인쇄 배선 구조물은 인쇄 배선판(11)이고, 제2 인쇄 배선 구조물은 플렉스프린트 회로(20)인 것을 특징으로 하는 접속 구조물.
- 제1항에 있어서, 제1 인쇄 배선판(11)에 설치된 구멍(13)들은 제1 인쇄 배선판(11)의 표면(18) 이래로 소정의 깊이로 설치되는 것을 특징으로 하는 접속 구조물.
- 제4항에 있어서, 소정의 깊이는 제1 인쇄 배선판(11)의 표면(18) 이래로 0.178mm 내지 0.508mm(0.007인치 내지 0.020인치)인 것을 특징으로 하는 접속 구조물.
- 제1항에 있어서, 복수의 도금된 구멍(13)들은 구멍(13)들을 무전해 도금함으로써 형성되는 것을 특징으로 하는 접속 구조물.
- 제1항에 있어서, 복수의 도금된 구멍(13)들은 구멍(13)들을 전기 도금함으로써 형성되는 것을 특징으로 하는 접속 구조물.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16834293A | 1993-12-17 | 1993-12-17 | |
US08/168,342 | 1993-12-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR950023254A true KR950023254A (ko) | 1995-07-28 |
Family
ID=22611130
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019940034641A KR950023254A (ko) | 1993-12-17 | 1994-12-16 | 전자 패키지용 공동 및 범프 접속 구조물 |
Country Status (6)
Country | Link |
---|---|
US (1) | US5525065A (ko) |
EP (1) | EP0658960A3 (ko) |
JP (1) | JP2825772B2 (ko) |
KR (1) | KR950023254A (ko) |
CA (1) | CA2135241C (ko) |
IL (1) | IL111951A (ko) |
Families Citing this family (79)
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KR20130051498A (ko) * | 2010-10-13 | 2013-05-20 | 에이비비 리써치 리미티드 | 반도체 모듈 및 반도체 모듈을 제조하는 방법 |
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US10008797B2 (en) | 2015-07-10 | 2018-06-26 | Te Connectivity Corporation | Flexible printed circuit connector and connector assembly including the same |
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US10468363B2 (en) | 2015-08-10 | 2019-11-05 | X-Celeprint Limited | Chiplets with connection posts |
US10750614B2 (en) * | 2017-06-12 | 2020-08-18 | Invensas Corporation | Deformable electrical contacts with conformable target pads |
CN107741676A (zh) * | 2017-10-19 | 2018-02-27 | 武汉华星光电半导体显示技术有限公司 | 一种耦合压接端子结构及显示装置 |
WO2021184188A1 (zh) * | 2020-03-17 | 2021-09-23 | 元锦生物科技股份有限公司 | 可拆式接合结构 |
WO2022261970A1 (zh) * | 2021-06-18 | 2022-12-22 | 庆鼎精密电子(淮安)有限公司 | 电路板组件及其制作方法 |
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-
1994
- 1994-11-07 CA CA002135241A patent/CA2135241C/en not_active Expired - Fee Related
- 1994-12-11 IL IL111951A patent/IL111951A/en not_active IP Right Cessation
- 1994-12-15 EP EP94119849A patent/EP0658960A3/en not_active Ceased
- 1994-12-16 JP JP6313818A patent/JP2825772B2/ja not_active Expired - Fee Related
- 1994-12-16 KR KR1019940034641A patent/KR950023254A/ko not_active Application Discontinuation
-
1995
- 1995-02-15 US US08/389,436 patent/US5525065A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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US5525065A (en) | 1996-06-11 |
CA2135241A1 (en) | 1995-06-18 |
CA2135241C (en) | 1998-08-04 |
IL111951A0 (en) | 1995-03-15 |
EP0658960A2 (en) | 1995-06-21 |
EP0658960A3 (en) | 1997-01-29 |
JP2825772B2 (ja) | 1998-11-18 |
IL111951A (en) | 1998-02-22 |
JPH07263830A (ja) | 1995-10-13 |
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