KR950012692A - 반도체 패키지 및 모듈과 그 제조 방법 - Google Patents

반도체 패키지 및 모듈과 그 제조 방법 Download PDF

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Publication number
KR950012692A
KR950012692A KR1019940024850A KR19940024850A KR950012692A KR 950012692 A KR950012692 A KR 950012692A KR 1019940024850 A KR1019940024850 A KR 1019940024850A KR 19940024850 A KR19940024850 A KR 19940024850A KR 950012692 A KR950012692 A KR 950012692A
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KR
South Korea
Prior art keywords
semiconductor device
manufacturing
mounting region
module
closing wall
Prior art date
Application number
KR1019940024850A
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English (en)
Inventor
엘. 로메로 길러모
Original Assignee
빈센트 비. 인그라시아
모토로라 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 빈센트 비. 인그라시아, 모토로라 인코포레이티드 filed Critical 빈센트 비. 인그라시아
Publication of KR950012692A publication Critical patent/KR950012692A/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/165—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Wire Bonding (AREA)

Abstract

반도체 패키지(107) 및 모듈(300)은 단일기본 구조물(101)과 배열 기구(104)를 포함하고, 상기 단일기본 구조물(101)은 반도체 장착 영역 (102)과 폐쇄벽 (103)을 포함하며, 상기 구조물은 평평한 기부와 비교하여 굽힘 저항을 제공하고 굽힘의 제거는 작업 환경의 차거운 플레이트와의 개선된 열 접촉부를 제공하며 또한 특정 파손 모드를 감소시킨다 상기 배열 기구(104)는 조립시 모듈 부품을 정렬시키므로써, 부품을 적소에 유지시키는 복잡한 설비의 필요성을 제거하여 조립을 단순화 한다.

Description

반도체 패키지 및 모듈과 그 제조 방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 양호한 실시예에 따른 반도체 패키지를 나타내는 사시도,
제2도는 제1도에 도시된 패키지의 단면도.

Claims (5)

  1. 반도체 패키지(100) 제조 방법에 있어서, 상기 방법은, 반도체 장치 장착 영역(102)과 폐쇄벽(103)을 포함한 단일 기본 구조물(101)을 다공 매트릭스 재료로 제조하는 단계와, 상기 다공매트릭스 재료를 채우기 위해 상기 단일기본 구조물(101)에 전도성 재료를 침투시키는 단계를 포함하는 것을 특징으로 하는 반도체 패키지 제조 방법.
  2. 제1항에 있어서, 상기 제조 단계는 또한 상기 단일기본 구조물(101)내에 소자를 정렬시키기 위한 배열 기구(104)를 형성하는 단계를 포함하는 것을 특징으로 하는 반도체 패키지 제조 방법.
  3. 제1항에 있어서, 상기 제조 단계는 또한 상기 단일기본 구조물(101)상에 볼록한 바닥표면(108)을 형성하는 단계를 포함하는 것을 특징으로 하는 반도체 패키지 제조방법.
  4. 반도체 모듈 제조 방법에 있어서, 상기 방법은, 반도체 장치 장착 영역 (102)과 폐쇄벽 (103)을 포함하는 단일기본 구조물(101)을 제공하는 단계와, 반도체 장치 (401)를 반도체 장치 장착 영역 (102)에 장착하는 단계와, 적어도 하나의 전극(405)을 반도체 장치 (401)에 접속시키는 단계를 포함하는 것을 특징으로 하는
    반도체 모듈 제조 방법.
  5. 다공 매트릭스 재료로 형성된 단일기본 구조물(101)을 포함하며, 상기 단일기본 구조물은 반도체 장치장착 영역 (102)과 폐쇄벽 (103) 및 침투된 전도성 재료를 구비하는 것을 특징으로 하는 반도체 패키지.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019940024850A 1993-10-04 1994-09-30 반도체 패키지 및 모듈과 그 제조 방법 KR950012692A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US130,824 1987-12-09
US08/130,824 US5465481A (en) 1993-10-04 1993-10-04 Method for fabricating a semiconductor package

Publications (1)

Publication Number Publication Date
KR950012692A true KR950012692A (ko) 1995-05-16

Family

ID=22446523

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940024850A KR950012692A (ko) 1993-10-04 1994-09-30 반도체 패키지 및 모듈과 그 제조 방법

Country Status (4)

Country Link
US (1) US5465481A (ko)
EP (1) EP0646958A3 (ko)
JP (1) JPH07161863A (ko)
KR (1) KR950012692A (ko)

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US5616886A (en) * 1995-06-05 1997-04-01 Motorola Wirebondless module package
US5801074A (en) * 1996-02-20 1998-09-01 Kim; Jong Tae Method of making an air tight cavity in an assembly package
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JP3468358B2 (ja) * 1998-11-12 2003-11-17 電気化学工業株式会社 炭化珪素質複合体及びその製造方法とそれを用いた放熱部品
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JP4761157B2 (ja) * 2004-09-14 2011-08-31 電気化学工業株式会社 アルミニウム−炭化珪素質複合体
DE102011085629A1 (de) * 2011-11-02 2013-05-02 Robert Bosch Gmbh Elektronikmodul zum Betrieb im Getriebe
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Also Published As

Publication number Publication date
JPH07161863A (ja) 1995-06-23
EP0646958A3 (en) 1997-01-29
EP0646958A2 (en) 1995-04-05
US5465481A (en) 1995-11-14

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