KR950703265A - 전자부품(electronic component) - Google Patents

전자부품(electronic component) Download PDF

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Publication number
KR950703265A
KR950703265A KR1019950700516A KR19950700516A KR950703265A KR 950703265 A KR950703265 A KR 950703265A KR 1019950700516 A KR1019950700516 A KR 1019950700516A KR 19950700516 A KR19950700516 A KR 19950700516A KR 950703265 A KR950703265 A KR 950703265A
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KR
South Korea
Prior art keywords
electronic component
support
lead electrode
resin layer
electrode
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KR1019950700516A
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English (en)
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KR100245381B1 (ko
Inventor
요시히사 수주키
유우이치 수가와라
수수무 이시하라
이쿠오 카토오
Original Assignee
사토오 히로시
티이디이케이 카부시키가이샤
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Publication of KR950703265A publication Critical patent/KR950703265A/ko
Application granted granted Critical
Publication of KR100245381B1 publication Critical patent/KR100245381B1/ko

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00—Piezoelectric transducers; Electrostrictive transducers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909—Special local insulating pattern, e.g. as dam around component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10083—Electromechanical or electro-acoustic component, e.g. microphone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10515—Stacked components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0465—Shape of solder, e.g. differing from spherical shape, different shapes due to different solder pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Details Of Resistors (AREA)

Abstract

전자부품소자(A1)는 가장자리에 리이드전극을 보유하며 지지체(A2)는 간격(G)을 두고 전자부품소자(a1)와 대향하여 배치된다. 지지체(A2)는 리이드전극(A4)과 대향하는 위치에 외부접속단자(A5)를 보유한다. 수지층(A3)은 전자부품소자(A1)와 지지체(A2) 사이에 전자부품소자(A1)의 가장자리로부터 내측으로 거리(d)만큼 들어가 배치되며 전자부품소자(A1)와 지지체(A2)를 접착시킨다. 거리(d)와 간격(G)은 G<d를 만족해야 한다. 도전제(A6)는 리이드전극(A4)과 외부접속단자(A5)의 간격(G)과 전자부품소자(A1)의 가장자리로부터 수지층(A3)까지의 거리(d)로 이루어지는 공간을 충전하며 리이드전극(A4)과 외부접속단자(A5)를 접속한다. 전자부품을 프린트기판에 장착할 때에 리이드전극과 외부접속단자의 접속불량이 일어나지 않는다.

Description

전자부품(ELECTRONIC COMPONENT)
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는, 본 발명의 전자부품의 부분단면측면도.
제2도는, 본 발명의 전자부품이 프린트기판에 장착될 때 도전제의 상태를 나타내는 부분단면측면도.

Claims (8)

  1. 가장자리에 리이드전극을 보유하는 전자부품소자와, 간격(G)을 두고, 상기한 전잡부품소자와 대향하여 배치되며 상기한 리이드전극과 대향하는 위치에 외부접속단자를 보유하는 지지체와, 상기한 전자부품소자와 상기한 지지체 사이에 상기한 전자부품소자의 가장자리로부터 내측으로 거리(d)만큼 들어가 배치되며 상기한 전자부품소자와 상기한 지지체를 접착하고 상기한 거리(d)와 상기한 간격(G)이 G<d을 만족하는 수지층과, 간격(G)과 거리(d)로 이루어지는 공간을 충전시키며 상기한 리이드전극과 상기한 외부접속단자를 접속시키는 도전제로 구성된 전자부품.
  2. 제1항에 있어서, 상기한 전자부품소자가 압전소자인 전자부품.
  3. 제2항에 있어서, 상기한 압전소자는 상기한 압전기판의 윗면과 아랫면에 서로 대향하여 배치되는 한개의 위전극과 두개이 아래전극을 보유하는 다수의 공진부와 압전기판을 포함하고, 상기한 리이드전극은 상기한 압전기판의 아랫면에 설치되며 제1리이드전극과 제2리이드전극을 포함하고, 각 리이드전극이 상기한 압전기판의 가장자리로 도출되며 상기한 제1리이드전극이 상기한 위전극으로 도통하고 상기한 제2리이드전극이 상기한 아래전극으로 도통하고 있는 전자부품.
  4. 제1항에 있어서, 상기한 지지체가 세라믹재료로 구성된 전자부품.
  5. 제4항에 있어서, 상기한 지지체는 위지지체와 아래지지체를 포함하며, 상기한 위지지체는 상기한 압전소자의 위측에 배치되고 상기한 아래지지체는 상기한 압전소자의 아래측에 배치되어 있는 전자부품.
  6. 제1항에 있어서, 상기한 수지층은 상기한 압전소자의 공진부 주위에 진동공간을 형성하는 전자부품.
  7. 제6항에 있어서, 상기한 수지층은 중공층과 봉지층을 포함하며, 상기한 중공층은 상기한 위전극과 상기한 아래전극으로부터 떨어진 위치에 개구부를 보유하는 중공부로 구성되며 상기한 봉지층은 상기한 중공층의 위에 밀착하여 상기한 개구부를 폐쇄하고 있다.
  8. 제6항에 있어서, 상기한 수지층은 제1수지층과 제2수지층을 포함하며, 상기한 제1수지층은 상기한 위지지체와 상기한 압전소자 사이에 위치하며 상기한 제2수지층은 상기한 압전소자와 상기한 아래지지체 사이에 위치하는 전자부품.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950700516A 1992-08-26 1993-07-05 전자부품 KR100245381B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP4250722A JP2915716B2 (ja) 1992-08-26 1992-08-26 電子部品
JP92-250722 1992-08-26
PCT/JP1993/000923 WO1994005134A1 (en) 1992-08-26 1993-07-05 Electronic component

Publications (2)

Publication Number Publication Date
KR950703265A true KR950703265A (ko) 1995-08-23
KR100245381B1 KR100245381B1 (ko) 2000-02-15

Family

ID=17212081

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Application Number Title Priority Date Filing Date
KR1019950700516A KR100245381B1 (ko) 1992-08-26 1993-07-05 전자부품

Country Status (8)

Country Link
US (1) US5469012A (ko)
EP (1) EP0659032B1 (ko)
JP (1) JP2915716B2 (ko)
KR (1) KR100245381B1 (ko)
CA (1) CA2143293C (ko)
DE (1) DE69331949T2 (ko)
MY (1) MY114759A (ko)
WO (1) WO1994005134A1 (ko)

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DE19928190A1 (de) * 1999-06-19 2001-01-11 Bosch Gmbh Robert Piezoaktor
GB0021596D0 (en) 2000-09-02 2000-10-18 Vlsi Vision Ltd Mounting electronic components
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US7564167B2 (en) * 2007-06-20 2009-07-21 Illinois Tool Works Inc. System and method of assembling a trapped acoustic wave system

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Also Published As

Publication number Publication date
KR100245381B1 (ko) 2000-02-15
DE69331949T2 (de) 2003-10-30
DE69331949D1 (de) 2002-06-27
JP2915716B2 (ja) 1999-07-05
CA2143293A1 (en) 1994-03-03
EP0659032B1 (en) 2002-05-22
US5469012A (en) 1995-11-21
WO1994005134A1 (en) 1994-03-03
EP0659032A4 (en) 1995-12-06
CA2143293C (en) 2000-10-10
MY114759A (en) 2003-01-31
JPH0677757A (ja) 1994-03-18
EP0659032A1 (en) 1995-06-21

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