KR950008844B1 - 반도체 처리시스템에 있어서 반도체 기판을 반송하는 방법 및 장치 - Google Patents

반도체 처리시스템에 있어서 반도체 기판을 반송하는 방법 및 장치 Download PDF

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Publication number
KR950008844B1
KR950008844B1 KR1019910015384A KR910015384A KR950008844B1 KR 950008844 B1 KR950008844 B1 KR 950008844B1 KR 1019910015384 A KR1019910015384 A KR 1019910015384A KR 910015384 A KR910015384 A KR 910015384A KR 950008844 B1 KR950008844 B1 KR 950008844B1
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KR
South Korea
Prior art keywords
time
processing
semiconductor substrate
conveying
condition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019910015384A
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English (en)
Korean (ko)
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KR920007081A (ko
Inventor
마사미 니시다
마사히로 히모토
테츠야 하마다
노리아키 요코노
다케오 오카모토
Original Assignee
다이닛뽕스크린 세이조오 가부시키가이샤
이시다 아키라
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Application filed by 다이닛뽕스크린 세이조오 가부시키가이샤, 이시다 아키라 filed Critical 다이닛뽕스크린 세이조오 가부시키가이샤
Publication of KR920007081A publication Critical patent/KR920007081A/ko
Application granted granted Critical
Publication of KR950008844B1 publication Critical patent/KR950008844B1/ko
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1019910015384A 1990-09-03 1991-09-03 반도체 처리시스템에 있어서 반도체 기판을 반송하는 방법 및 장치 Expired - Fee Related KR950008844B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2234095A JP2638668B2 (ja) 1990-09-03 1990-09-03 基板搬送方法および基板搬送装置
JP2-234095 1990-09-03

Publications (2)

Publication Number Publication Date
KR920007081A KR920007081A (ko) 1992-04-28
KR950008844B1 true KR950008844B1 (ko) 1995-08-08

Family

ID=16965545

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910015384A Expired - Fee Related KR950008844B1 (ko) 1990-09-03 1991-09-03 반도체 처리시스템에 있어서 반도체 기판을 반송하는 방법 및 장치

Country Status (4)

Country Link
EP (1) EP0474180B1 (https=)
JP (1) JP2638668B2 (https=)
KR (1) KR950008844B1 (https=)
DE (1) DE69128822T2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6969915B2 (en) 2001-01-15 2005-11-29 Nec Corporation Semiconductor device, manufacturing method and apparatus for the same

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3654597B2 (ja) * 1993-07-15 2005-06-02 株式会社ルネサステクノロジ 製造システムおよび製造方法
KR100198477B1 (ko) * 1994-04-08 1999-06-15 이시다 아키라 기판처리장치 및 방법
JP2994553B2 (ja) * 1994-04-08 1999-12-27 大日本スクリーン製造株式会社 基板処理装置
US5505132A (en) * 1995-04-03 1996-04-09 Warren; David K. Apparatus for field postage stamp cancellation
US6672819B1 (en) 1995-07-19 2004-01-06 Hitachi, Ltd. Vacuum processing apparatus and semiconductor manufacturing line using the same
JPH10112489A (ja) * 1996-10-07 1998-04-28 Dainippon Screen Mfg Co Ltd 基板搬送装置および基板処理装置
US6275744B1 (en) 1997-08-01 2001-08-14 Kokusai Electric Co., Ltd. Substrate feed control
US6466895B1 (en) * 1999-07-16 2002-10-15 Applied Materials, Inc. Defect reference system automatic pattern classification
JP4093462B2 (ja) 2002-10-09 2008-06-04 東京エレクトロン株式会社 基板処理方法及び基板処理装置
JP4279102B2 (ja) 2003-09-22 2009-06-17 大日本スクリーン製造株式会社 基板処理装置及び基板処理方法
WO2005055314A1 (ja) * 2003-12-01 2005-06-16 Hitachi Kokusai Electric Inc. 基板処理装置
JP4353903B2 (ja) 2005-01-07 2009-10-28 東京エレクトロン株式会社 クラスタツールの処理システム
JP4937559B2 (ja) * 2005-09-14 2012-05-23 株式会社Ｓｏｋｕｄｏ 基板処理装置および基板処理方法
JP7324811B2 (ja) * 2021-09-22 2023-08-10 株式会社Kokusai Electric 基板処理装置、半導体装置の製造方法、及びプログラム

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4507078A (en) * 1983-03-28 1985-03-26 Silicon Valley Group, Inc. Wafer handling apparatus and method
GB2194500B (en) * 1986-07-04 1991-01-23 Canon Kk A wafer handling apparatus
JP2704309B2 (ja) * 1990-06-12 1998-01-26 大日本スクリーン製造株式会社 基板処理装置及び基板の熱処理方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6969915B2 (en) 2001-01-15 2005-11-29 Nec Corporation Semiconductor device, manufacturing method and apparatus for the same
US7282432B2 (en) 2001-01-15 2007-10-16 Nec Corporation Semiconductor device, manufacturing method and apparatus for the same
US7611041B2 (en) 2001-01-15 2009-11-03 Nec Corporation Semiconductor device, manufacturing method and apparatus for the same
US7793818B2 (en) 2001-01-15 2010-09-14 Nec Corporation Semiconductor device, manufacturing method and apparatus for the same

Also Published As

Publication number Publication date
EP0474180B1 (en) 1998-01-28
JP2638668B2 (ja) 1997-08-06
EP0474180A2 (en) 1992-03-11
DE69128822D1 (de) 1998-03-05
JPH04113612A (ja) 1992-04-15
KR920007081A (ko) 1992-04-28
DE69128822T2 (de) 1998-09-24
EP0474180A3 (https=) 1995-02-15

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