KR940009030A - 진공상태에서의 부품 이송을 위한 공간과 그 공간의 조합 및 부품이송방법 - Google Patents

진공상태에서의 부품 이송을 위한 공간과 그 공간의 조합 및 부품이송방법 Download PDF

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Publication number
KR940009030A
KR940009030A KR1019930020570A KR930020570A KR940009030A KR 940009030 A KR940009030 A KR 940009030A KR 1019930020570 A KR1019930020570 A KR 1019930020570A KR 930020570 A KR930020570 A KR 930020570A KR 940009030 A KR940009030 A KR 940009030A
Authority
KR
South Korea
Prior art keywords
space
transfer
axis
parts
inlet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1019930020570A
Other languages
English (en)
Korean (ko)
Inventor
로만 쉬어트러
Original Assignee
이.해페리, 유.웨그만
발저스 아크티엔게젤샤프트
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이.해페리, 유.웨그만, 발저스 아크티엔게젤샤프트 filed Critical 이.해페리, 유.웨그만
Publication of KR940009030A publication Critical patent/KR940009030A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
    • H10P72/3304—
    • H10P72/3308—

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manufacturing Optical Record Carriers (AREA)
  • Automatic Assembly (AREA)
KR1019930020570A 1992-10-06 1993-10-06 진공상태에서의 부품 이송을 위한 공간과 그 공간의 조합 및 부품이송방법 Withdrawn KR940009030A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH3'121/92-4 1992-10-06
CH03121/92A CH691377A5 (de) 1992-10-06 1992-10-06 Kammeranordnung für den Transport von Werkstücken und deren Verwendung.

Publications (1)

Publication Number Publication Date
KR940009030A true KR940009030A (ko) 1994-05-16

Family

ID=4249064

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019930020570A Withdrawn KR940009030A (ko) 1992-10-06 1993-10-06 진공상태에서의 부품 이송을 위한 공간과 그 공간의 조합 및 부품이송방법

Country Status (6)

Country Link
US (1) US6818108B2 (enExample)
JP (1) JP3323601B2 (enExample)
KR (1) KR940009030A (enExample)
CH (1) CH691377A5 (enExample)
FR (1) FR2696428A1 (enExample)
GB (2) GB2271332B (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI874121A7 (fi) * 1986-09-24 1988-03-25 Sumitomo Chemical Co Heterocykliska foereningar, och deras framstaellning och anvaendning.
US6264804B1 (en) 2000-04-12 2001-07-24 Ske Technology Corp. System and method for handling and masking a substrate in a sputter deposition system
US6413381B1 (en) 2000-04-12 2002-07-02 Steag Hamatech Ag Horizontal sputtering system
US8408858B2 (en) * 2007-08-30 2013-04-02 Ascentool International Limited Substrate processing system having improved substrate transport system
US7806641B2 (en) * 2007-08-30 2010-10-05 Ascentool, Inc. Substrate processing system having improved substrate transport system
KR102103477B1 (ko) * 2009-03-18 2020-06-01 에바텍 아크티엔게젤샤프트 진공처리 장치
DE102009037290A1 (de) * 2009-04-24 2010-11-11 Singulus Technologies Ag Transporteinrichtung mit einem auslenkbaren Dichtrahmen
US8567340B2 (en) * 2009-08-12 2013-10-29 Abbott Cardiovascular Systems Inc. System and method for coating a medical device
EP2445003A1 (en) * 2010-10-25 2012-04-25 Applied Materials, Inc. Apparatus for providing a rotation carrier magazine, and method of operating thereof

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3968885A (en) 1973-06-29 1976-07-13 International Business Machines Corporation Method and apparatus for handling workpieces
JPS5350224Y2 (enExample) 1973-09-25 1978-12-01
CH573985A5 (enExample) * 1973-11-22 1976-03-31 Balzers Patent Beteilig Ag
GB2054345B (en) 1979-06-19 1984-02-22 Peanuts Ltd Q Fluidised bed
US4433951A (en) * 1981-02-13 1984-02-28 Lam Research Corporation Modular loadlock
JPS6052574A (ja) * 1983-09-02 1985-03-25 Hitachi Ltd 連続スパツタ装置
DE3716498C2 (de) * 1987-05-16 1994-08-04 Leybold Ag Vorrichtung zum Ein- und Ausschleusen von Werkstücken in eine Beschichtungskammer
US4851101A (en) * 1987-09-18 1989-07-25 Varian Associates, Inc. Sputter module for modular wafer processing machine
DE3912295C2 (de) * 1989-04-14 1997-05-28 Leybold Ag Katodenzerstäubungsanlage
JPH03109727A (ja) * 1989-09-25 1991-05-09 Fujitsu Ltd 半導体製造装置
DE4110490C2 (de) * 1991-03-30 2002-02-28 Unaxis Deutschland Holding Kathodenzerstäubungsanlage
DE4117969C2 (de) * 1991-05-31 2000-11-09 Balzers Ag Liechtenstein Vakuumkammer
CH686445A5 (de) * 1992-10-06 1996-03-29 Balzers Hochvakuum Kammer und Kammerkombination fuer eine Vakuumanlage und Verfahren zum Durchreichen mindestens eines Werkstueckes.
EP0591706B1 (de) * 1992-10-06 2002-04-24 Unaxis Balzers Aktiengesellschaft Kammer für den Transport von Werkstücken
JP3109727B2 (ja) 1997-04-28 2000-11-20 セイコーエプソン株式会社 文字処理方法及び文字処理装置

Also Published As

Publication number Publication date
FR2696428B1 (enExample) 1997-02-21
FR2696428A1 (fr) 1994-04-08
JPH06267069A (ja) 1994-09-22
US6818108B2 (en) 2004-11-16
GB9604252D0 (en) 1996-05-01
CH691377A5 (de) 2001-07-13
JP3323601B2 (ja) 2002-09-09
GB2271332B (en) 1996-12-18
GB9320452D0 (en) 1993-11-24
US20030106789A1 (en) 2003-06-12
GB2271332A (en) 1994-04-13
GB2296698B (en) 1996-12-18
GB2296698A (en) 1996-07-10

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PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000