FR2696428A1 - Chambre pour le transport de pièces sous vide, combinaison de chambres et procédé pour le transport d'une pièce. - Google Patents

Chambre pour le transport de pièces sous vide, combinaison de chambres et procédé pour le transport d'une pièce. Download PDF

Info

Publication number
FR2696428A1
FR2696428A1 FR9311796A FR9311796A FR2696428A1 FR 2696428 A1 FR2696428 A1 FR 2696428A1 FR 9311796 A FR9311796 A FR 9311796A FR 9311796 A FR9311796 A FR 9311796A FR 2696428 A1 FR2696428 A1 FR 2696428A1
Authority
FR
France
Prior art keywords
chamber
transport
axis
combination
openings
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR9311796A
Other languages
English (en)
French (fr)
Other versions
FR2696428B1 (enExample
Inventor
Schertler Roman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OC Oerlikon Balzers AG
Original Assignee
Balzers AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Balzers AG filed Critical Balzers AG
Publication of FR2696428A1 publication Critical patent/FR2696428A1/fr
Application granted granted Critical
Publication of FR2696428B1 publication Critical patent/FR2696428B1/fr
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3308—Vertical transfer of a single workpiece

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Automatic Assembly (AREA)
  • Manufacturing Optical Record Carriers (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
FR9311796A 1992-10-06 1993-10-04 Chambre pour le transport de pièces sous vide, combinaison de chambres et procédé pour le transport d'une pièce. Granted FR2696428A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH03121/92A CH691377A5 (de) 1992-10-06 1992-10-06 Kammeranordnung für den Transport von Werkstücken und deren Verwendung.

Publications (2)

Publication Number Publication Date
FR2696428A1 true FR2696428A1 (fr) 1994-04-08
FR2696428B1 FR2696428B1 (enExample) 1997-02-21

Family

ID=4249064

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9311796A Granted FR2696428A1 (fr) 1992-10-06 1993-10-04 Chambre pour le transport de pièces sous vide, combinaison de chambres et procédé pour le transport d'une pièce.

Country Status (6)

Country Link
US (1) US6818108B2 (enExample)
JP (1) JP3323601B2 (enExample)
KR (1) KR940009030A (enExample)
CH (1) CH691377A5 (enExample)
FR (1) FR2696428A1 (enExample)
GB (2) GB2296698B (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI874121A7 (fi) * 1986-09-24 1988-03-25 Sumitomo Chemical Co Heterocykliska foereningar, och deras framstaellning och anvaendning.
US6264804B1 (en) 2000-04-12 2001-07-24 Ske Technology Corp. System and method for handling and masking a substrate in a sputter deposition system
US6413381B1 (en) 2000-04-12 2002-07-02 Steag Hamatech Ag Horizontal sputtering system
US7806641B2 (en) * 2007-08-30 2010-10-05 Ascentool, Inc. Substrate processing system having improved substrate transport system
US8408858B2 (en) * 2007-08-30 2013-04-02 Ascentool International Limited Substrate processing system having improved substrate transport system
PL2409317T3 (pl) * 2009-03-18 2014-06-30 Oerlikon Advanced Tech Ag Urządzenie do obróbki próżniowej
DE102009037290A1 (de) * 2009-04-24 2010-11-11 Singulus Technologies Ag Transporteinrichtung mit einem auslenkbaren Dichtrahmen
US8567340B2 (en) * 2009-08-12 2013-10-29 Abbott Cardiovascular Systems Inc. System and method for coating a medical device
EP2445003A1 (en) * 2010-10-25 2012-04-25 Applied Materials, Inc. Apparatus for providing a rotation carrier magazine, and method of operating thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2143494A (en) * 1981-02-13 1985-02-13 Lam Res Corp Improvements in or relating to workpiece transfer means for loadlocks
EP0308275A2 (en) * 1987-09-18 1989-03-22 Varian Associates, Inc. Sputter module for modular wafer processing machine
DE3912295A1 (de) * 1989-04-14 1990-10-18 Leybold Ag Katodenzerstaeubungsanlage
DE4110490A1 (de) * 1991-03-30 1992-10-01 Leybold Ag Kathodenzerstaeubungsanlage

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3968885A (en) 1973-06-29 1976-07-13 International Business Machines Corporation Method and apparatus for handling workpieces
JPS5350224Y2 (enExample) 1973-09-25 1978-12-01
CH573985A5 (enExample) * 1973-11-22 1976-03-31 Balzers Patent Beteilig Ag
GB2054345B (en) 1979-06-19 1984-02-22 Peanuts Ltd Q Fluidised bed
JPS6052574A (ja) * 1983-09-02 1985-03-25 Hitachi Ltd 連続スパツタ装置
DE3716498C2 (de) 1987-05-16 1994-08-04 Leybold Ag Vorrichtung zum Ein- und Ausschleusen von Werkstücken in eine Beschichtungskammer
JPH03109727A (ja) * 1989-09-25 1991-05-09 Fujitsu Ltd 半導体製造装置
DE4117969C2 (de) * 1991-05-31 2000-11-09 Balzers Ag Liechtenstein Vakuumkammer
EP1179611B1 (de) * 1992-10-06 2004-09-15 Unaxis Balzers Aktiengesellschaft Kammer für den Transport von Werkstücken
CH686445A5 (de) * 1992-10-06 1996-03-29 Balzers Hochvakuum Kammer und Kammerkombination fuer eine Vakuumanlage und Verfahren zum Durchreichen mindestens eines Werkstueckes.
JP3109727B2 (ja) 1997-04-28 2000-11-20 セイコーエプソン株式会社 文字処理方法及び文字処理装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2143494A (en) * 1981-02-13 1985-02-13 Lam Res Corp Improvements in or relating to workpiece transfer means for loadlocks
EP0308275A2 (en) * 1987-09-18 1989-03-22 Varian Associates, Inc. Sputter module for modular wafer processing machine
DE3912295A1 (de) * 1989-04-14 1990-10-18 Leybold Ag Katodenzerstaeubungsanlage
DE4110490A1 (de) * 1991-03-30 1992-10-01 Leybold Ag Kathodenzerstaeubungsanlage

Also Published As

Publication number Publication date
US6818108B2 (en) 2004-11-16
GB2271332A (en) 1994-04-13
GB9604252D0 (en) 1996-05-01
FR2696428B1 (enExample) 1997-02-21
US20030106789A1 (en) 2003-06-12
GB2271332B (en) 1996-12-18
GB2296698B (en) 1996-12-18
CH691377A5 (de) 2001-07-13
GB9320452D0 (en) 1993-11-24
JP3323601B2 (ja) 2002-09-09
KR940009030A (ko) 1994-05-16
JPH06267069A (ja) 1994-09-22
GB2296698A (en) 1996-07-10

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Effective date: 20100630