KR930017475A - 반도체 장치와 그 면실장 방법 - Google Patents
반도체 장치와 그 면실장 방법 Download PDFInfo
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- KR930017475A KR930017475A KR1019930000701A KR930000701A KR930017475A KR 930017475 A KR930017475 A KR 930017475A KR 1019930000701 A KR1019930000701 A KR 1019930000701A KR 930000701 A KR930000701 A KR 930000701A KR 930017475 A KR930017475 A KR 930017475A
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- semiconductor device
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/12—Resilient or clamping means for holding component to structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1017—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support
- H01L2225/1029—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support the support being a lead frame
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1047—Details of electrical connections between containers
- H01L2225/107—Indirect electrical connections, e.g. via an interposer, a flexible substrate, using TAB
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1076—Shape of the containers
- H01L2225/1082—Shape of the containers for improving alignment between containers, e.g. interlocking features
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10454—Vertically mounted
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/1053—Mounted components directly electrically connected to each other, i.e. not via the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10537—Attached components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10696—Single-in-line [SIL] package
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
본 발명은 수직 실장형 반도체 장치를 면실장 할때, 복수개의 수직 실장형 반도체 장치를 병렬하고 연결하여 반도체 장치 블록을 형성하고, 이 반도체 장치블록을 면실장한다.
본 발명에 의하면 복수개의 수직 실장형 반도체 장치를 병렬하여 연결한 반도체 장치 블록을 면실장 하므로 리플로우시에 반도체 장치가 넘어져 버리는 일이 없다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 제1의 실시예를 나타내는 정면도 및 측면도, 제2도는 제1도의 실시예를 나타내는 정면도 및 측면도, 제3도는 제1의 실시예를 나타내는 사시도.
Claims (9)
- 복수개의 수직 실장형의 반도체 장치를 병렬하여 연결한 반도치 장치 블록을 형성하는 공정과; 상기 반도체 장치 블록을 프린트 기판상에 고정하는 공정을 구비하는 것을 특징으로 하는 반도체 장치의 면실장 방법.
- 복수개의 수직 실장형의 반도체 장치를 병렬연결하고 또 틈새를 열어서 연결한 반도체 장치 블록을 형성하는 공정과; 상기 반도체 장치 블록을 프린트 기판상에 고정하는 공정을 구비하는 것을 특징으로 하는 반도체 장치의 면실장 방법.
- 복수개의 수직 실장형의 반도체 장치를 병렬장치를 끼고 병렬하여 연결한 반도체 장치 블록을 형성하는 공정과; 상기 반도체 장치 블록을 프린트 기판상에 고정하는 공정을 구비하는 것을 특징으로 하는 반도체 장치의 면실장 방법.
- 복수개의 수직 실장형의 반도체 장치를 병렬장치를 틀을 사용하여 병렬하여 고정한 반도체 장치 블록을 형성하는 공정과; 상기 반도체 장치 블록을 프린트 기판상에 고정하는 공정과; 상기 틀을 반도체 장치 블록에서 떼어버리는 공정을 구비하는 것을 특징으로 하는 반도체 장치의 면실장 방법.
- 수직실장형의 반도체 장치에 있어서 L자형으로 구부려진 외부리드단자(102)를 지니는 동시에 복수의 상기 반도체 장치를 병렬하여 연결하는 수단을 지니는 것을 특징으로 하는 반도체 장치.
- 제5항에 있어서, 상기 연결 수단으로서 상기 반도체 장치의 외면에 형성된 凹凸(403, 405)을 사용하는 것을 특징으로 하는 반도체 장치.
- 제5항에 있어서, 상기 연결 수단으로서 상기 반도체 장치에서 노출한 연결수(503)를 사용하는 것을 특징으로 하는 반도체 장치.
- 제5항에 있어서, 상기 연결 수단으로서 상기 반도체 장치에 장착된 자석 (603;613, 614)을 사용하는 것을 특징으로 하는 반도체 장치.
- 제5항에 있어서, 상기 연결수단으로서 상기 반도체 장체에 형성된 구명(703)과 이 구멍에 통해지는 연결봉(709, 711, 719)을 사용하는 것을 특징으로 하는 반도체 장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4010441A JP2575566B2 (ja) | 1992-01-24 | 1992-01-24 | 半導体装置 |
JP92-010441 | 1992-01-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR930017475A true KR930017475A (ko) | 1993-08-30 |
KR0150805B1 KR0150805B1 (ko) | 1998-12-15 |
Family
ID=11750245
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019930000701A KR0150805B1 (ko) | 1992-01-24 | 1993-01-20 | 반도체 장치 및 그 면실장 방법 |
Country Status (3)
Country | Link |
---|---|
US (2) | US5616962A (ko) |
JP (1) | JP2575566B2 (ko) |
KR (1) | KR0150805B1 (ko) |
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JP5067038B2 (ja) * | 2007-06-22 | 2012-11-07 | ソニー株式会社 | 半導体装置 |
KR101774938B1 (ko) | 2011-08-31 | 2017-09-06 | 삼성전자 주식회사 | 지지대를 갖는 반도체 패키지 및 그 형성 방법 |
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JPS58178547A (ja) * | 1982-04-12 | 1983-10-19 | Matsushita Electric Ind Co Ltd | 電気部品組立体およびその製造方法 |
WO1993013557A1 (en) * | 1985-02-14 | 1993-07-08 | Yoshiyuki Sato | Structure for mounting the semiconductor chips in a three-dimensional manner |
US4661886A (en) * | 1985-10-03 | 1987-04-28 | Burroughs Corporation | Magnetically sealed multichip integrated circuit package |
JPS62293749A (ja) * | 1986-06-13 | 1987-12-21 | Nippon Telegr & Teleph Corp <Ntt> | 半導体装置の3次元的実装構造およびその製造方法 |
US4764846A (en) * | 1987-01-05 | 1988-08-16 | Irvine Sensors Corporation | High density electronic package comprising stacked sub-modules |
JPS63186457A (ja) * | 1987-01-29 | 1988-08-02 | Hitachi Ltd | 半導体装置及びその製造方法 |
JPS6439676U (ko) * | 1987-09-03 | 1989-03-09 | ||
JPH01133393A (ja) * | 1987-11-18 | 1989-05-25 | Matsushita Electric Ind Co Ltd | 電子部品の実装法 |
US4855809A (en) * | 1987-11-24 | 1989-08-08 | Texas Instruments Incorporated | Orthogonal chip mount system module and method |
US5198888A (en) * | 1987-12-28 | 1993-03-30 | Hitachi, Ltd. | Semiconductor stacked device |
JPH0617354Y2 (ja) * | 1988-02-03 | 1994-05-02 | 富士電機株式会社 | 発熱素子の取付装置 |
US4975763A (en) * | 1988-03-14 | 1990-12-04 | Texas Instruments Incorporated | Edge-mounted, surface-mount package for semiconductor integrated circuit devices |
JPH0226267U (ko) * | 1988-08-04 | 1990-02-21 | ||
US5107586A (en) * | 1988-09-27 | 1992-04-28 | General Electric Company | Method for interconnecting a stack of integrated circuits at a very high density |
JP2885414B2 (ja) * | 1989-03-13 | 1999-04-26 | 株式会社日立製作所 | 半導体装置、その実装方法および電子装置 |
JPH02146867U (ko) * | 1989-05-11 | 1990-12-13 | ||
US5065277A (en) * | 1990-07-13 | 1991-11-12 | Sun Microsystems, Inc. | Three dimensional packaging arrangement for computer systems and the like |
US5086018A (en) * | 1991-05-02 | 1992-02-04 | International Business Machines Corporation | Method of making a planarized thin film covered wire bonded semiconductor package |
US5239447A (en) * | 1991-09-13 | 1993-08-24 | International Business Machines Corporation | Stepped electronic device package |
JP3056187U (ja) * | 1998-06-01 | 1999-02-12 | 悟史 中島 | 市販ドリンク缶の飲み口清潔シート |
-
1992
- 1992-01-24 JP JP4010441A patent/JP2575566B2/ja not_active Expired - Fee Related
-
1993
- 1993-01-20 KR KR1019930000701A patent/KR0150805B1/ko not_active IP Right Cessation
-
1994
- 1994-11-28 US US08/348,128 patent/US5616962A/en not_active Expired - Fee Related
-
1996
- 1996-12-13 US US08/766,874 patent/US5773321A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US5773321A (en) | 1998-06-30 |
KR0150805B1 (ko) | 1998-12-15 |
JPH05206688A (ja) | 1993-08-13 |
US5616962A (en) | 1997-04-01 |
JP2575566B2 (ja) | 1997-01-29 |
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