KR930009046A - 리드프레임 - Google Patents

리드프레임 Download PDF

Info

Publication number
KR930009046A
KR930009046A KR1019920018712A KR920018712A KR930009046A KR 930009046 A KR930009046 A KR 930009046A KR 1019920018712 A KR1019920018712 A KR 1019920018712A KR 920018712 A KR920018712 A KR 920018712A KR 930009046 A KR930009046 A KR 930009046A
Authority
KR
South Korea
Prior art keywords
plating layer
iron
nickel
cobalt
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1019920018712A
Other languages
English (en)
Korean (ko)
Inventor
아끼히꼬 무라따
니리오 와까바야시
Original Assignee
이노우에 사다오
신꼬오 덴기 고오교오 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이노우에 사다오, 신꼬오 덴기 고오교오 가부시끼가이샤 filed Critical 이노우에 사다오
Publication of KR930009046A publication Critical patent/KR930009046A/ko
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials
    • H10W70/457—Materials of metallic layers on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/451—Multilayered leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Electroplating Methods And Accessories (AREA)
KR1019920018712A 1991-10-17 1992-10-12 리드프레임 Ceased KR930009046A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP91-298219 1991-10-17
JP3298219A JPH05109958A (ja) 1991-10-17 1991-10-17 リードフレーム

Publications (1)

Publication Number Publication Date
KR930009046A true KR930009046A (ko) 1993-05-22

Family

ID=17856767

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920018712A Ceased KR930009046A (ko) 1991-10-17 1992-10-12 리드프레임

Country Status (3)

Country Link
EP (1) EP0538019A2 (https=)
JP (1) JPH05109958A (https=)
KR (1) KR930009046A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100254271B1 (ko) * 1997-08-04 2000-05-01 유무성 다층 도금 리이드 프레임

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3693300B2 (ja) * 1993-09-03 2005-09-07 日本特殊陶業株式会社 半導体パッケージの外部接続端子及びその製造方法
US5436082A (en) * 1993-12-27 1995-07-25 National Semiconductor Corporation Protective coating combination for lead frames
US5650661A (en) * 1993-12-27 1997-07-22 National Semiconductor Corporation Protective coating combination for lead frames
US5728285A (en) * 1993-12-27 1998-03-17 National Semiconductor Corporation Protective coating combination for lead frames
US6140703A (en) * 1996-08-05 2000-10-31 Motorola, Inc. Semiconductor metallization structure
KR20100103015A (ko) * 2009-03-12 2010-09-27 엘지이노텍 주식회사 리드 프레임 및 그 제조방법
US10366946B2 (en) 2017-10-30 2019-07-30 Infineon Technologies Ag Connection member with bulk body and electrically and thermally conductive coating
CN110265376A (zh) 2018-03-12 2019-09-20 意法半导体股份有限公司 引线框架表面精整
US11735512B2 (en) 2018-12-31 2023-08-22 Stmicroelectronics International N.V. Leadframe with a metal oxide coating and method of forming the same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4141029A (en) * 1977-12-30 1979-02-20 Texas Instruments Incorporated Integrated circuit device
DE3312713A1 (de) * 1983-04-08 1984-10-11 The Furukawa Electric Co., Ltd., Tokio/Tokyo Silberbeschichtete elektrische materialien und verfahren zu ihrer herstellung
JPS607157A (ja) * 1983-06-25 1985-01-14 Masami Kobayashi Ｉｃ用リ−ドフレ−ム
EP0384586A3 (en) * 1989-02-22 1991-03-06 Texas Instruments Incorporated High reliability plastic package for integrated circuits
JPH02222567A (ja) * 1989-02-23 1990-09-05 Hitachi Cable Ltd リードフレーム
JPH03225947A (ja) * 1990-01-31 1991-10-04 Shinko Electric Ind Co Ltd リードフレーム

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100254271B1 (ko) * 1997-08-04 2000-05-01 유무성 다층 도금 리이드 프레임

Also Published As

Publication number Publication date
EP0538019A2 (en) 1993-04-21
JPH05109958A (ja) 1993-04-30
EP0538019A3 (https=) 1994-03-09

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Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000