KR930004249B1 - 수지 봉지형 반도체장치 - Google Patents

수지 봉지형 반도체장치 Download PDF

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Publication number
KR930004249B1
KR930004249B1 KR1019880002703A KR880002703A KR930004249B1 KR 930004249 B1 KR930004249 B1 KR 930004249B1 KR 1019880002703 A KR1019880002703 A KR 1019880002703A KR 880002703 A KR880002703 A KR 880002703A KR 930004249 B1 KR930004249 B1 KR 930004249B1
Authority
KR
South Korea
Prior art keywords
epoxy resin
semiconductor device
resin
group
type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1019880002703A
Other languages
English (en)
Korean (ko)
Other versions
KR880011912A (ko
Inventor
도시오 시오하라
가즈또시 도미요시
Original Assignee
신에쓰 가가꾸 고오교 가부시기가이샤
고사까 유따로
시티즌 도께이 가부시끼가이샤
나까지마 미찌오
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 신에쓰 가가꾸 고오교 가부시기가이샤, 고사까 유따로, 시티즌 도께이 가부시끼가이샤, 나까지마 미찌오 filed Critical 신에쓰 가가꾸 고오교 가부시기가이샤
Publication of KR880011912A publication Critical patent/KR880011912A/ko
Application granted granted Critical
Publication of KR930004249B1 publication Critical patent/KR930004249B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1019880002703A 1987-03-16 1988-03-15 수지 봉지형 반도체장치 Expired - Lifetime KR930004249B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP62-61636 1987-03-16
JP61630/62 1987-03-16
JP62061630A JPS63226951A (ja) 1987-03-16 1987-03-16 樹脂封止型半導体装置

Publications (2)

Publication Number Publication Date
KR880011912A KR880011912A (ko) 1988-10-31
KR930004249B1 true KR930004249B1 (ko) 1993-05-22

Family

ID=13176702

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019880002703A Expired - Lifetime KR930004249B1 (ko) 1987-03-16 1988-03-15 수지 봉지형 반도체장치

Country Status (2)

Country Link
JP (1) JPS63226951A (https=)
KR (1) KR930004249B1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2519278B2 (ja) * 1987-12-15 1996-07-31 日東電工株式会社 半導体装置
JPH0618852B2 (ja) * 1988-06-15 1994-03-16 住友ベークライト株式会社 エポキシ樹脂組成物
JPH0662735B2 (ja) * 1989-02-07 1994-08-17 住友ベークライト株式会社 エポキシ樹脂組成物
JPH0362844A (ja) * 1989-02-27 1991-03-18 Shin Etsu Chem Co Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
DE69115058T2 (de) * 1990-01-25 1996-08-08 Shinetsu Chemical Co Epoxyharzzusammensetzung und damit verkapselte Halbleiteranordnung.
GB9110566D0 (en) * 1991-05-16 1991-07-03 Dow Corning Gmbh Method of coating
WO2024128191A1 (ja) * 2022-12-16 2024-06-20 株式会社レゾナック 硬化性樹脂組成物及び電子部品装置
JP2025102439A (ja) * 2023-12-26 2025-07-08 株式会社レゾナック 硬化性樹脂組成物及び電子部品装置

Also Published As

Publication number Publication date
JPH0577686B2 (https=) 1993-10-27
KR880011912A (ko) 1988-10-31
JPS63226951A (ja) 1988-09-21

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