KR920020659A - 본딩장치 - Google Patents

본딩장치 Download PDF

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Publication number
KR920020659A
KR920020659A KR1019920006178A KR920006178A KR920020659A KR 920020659 A KR920020659 A KR 920020659A KR 1019920006178 A KR1019920006178 A KR 1019920006178A KR 920006178 A KR920006178 A KR 920006178A KR 920020659 A KR920020659 A KR 920020659A
Authority
KR
South Korea
Prior art keywords
fixed
apparatus characterized
bonding
horn
bottom plate
Prior art date
Application number
KR1019920006178A
Other languages
English (en)
Other versions
KR960008511B1 (ko
Inventor
미노루 도리하다
오사무 나까무라
Original Assignee
아라이 가즈오
가부시끼가이샤 신가와
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아라이 가즈오, 가부시끼가이샤 신가와 filed Critical 아라이 가즈오
Publication of KR920020659A publication Critical patent/KR920020659A/ko
Application granted granted Critical
Publication of KR960008511B1 publication Critical patent/KR960008511B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B23K20/106—Features related to sonotrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)

Abstract

내용 없음

Description

본딩장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 븐 발명의 일실시예가 되는 본딩장치의 일부를 나타내는 사시도로, 제2도의 다른 부분과 조합된다.
제2도는 본 발명의 일실시예가 되는 본딩장치의 다른 부분을 나타내는 사시도.
제3도는 제1도, 제2도의 개략을 나타내는 일부 단면 측면도.
제4도는 제3도의 A-A선 단면도.
제5도는 제4도의 B-B선 부분 단면도.

Claims (3)

  1. XY 테이블의 상단의 테이블에 혼을 유지하는 리프터암을 요동가능하게 부착한 것을 특징으로 하는 본딩장치.
  2. XY 테이블의 상단의 테이블 자체를 본딩헤드의 저판으로 한 것을 특징으로 하는 본딩장치.
  3. XY 테이블의 상단의 테이블 자체를 본딩헤드의 저판으로 함과 동시에 상기 상단의 테이블내에 리니어 모터의 마그넷측의 일부 또는 전체가 위치하도록 상단의 테이블에 고정하고, 혼이 고정되어 요동하는 리프터 암에 상기 리니어 모터의 코일측을 고정한 것을 특징으로 하는 장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019920006178A 1991-04-16 1992-04-14 본딩장치 KR960008511B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP3109689A JP2879270B2 (ja) 1991-04-16 1991-04-16 ボンデイング装置
JP91-109689 1991-04-16

Publications (2)

Publication Number Publication Date
KR920020659A true KR920020659A (ko) 1992-11-21
KR960008511B1 KR960008511B1 (ko) 1996-06-26

Family

ID=14516700

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920006178A KR960008511B1 (ko) 1991-04-16 1992-04-14 본딩장치

Country Status (3)

Country Link
US (1) US5340010A (ko)
JP (1) JP2879270B2 (ko)
KR (1) KR960008511B1 (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05235077A (ja) * 1991-04-26 1993-09-10 Texas Instr Inc <Ti> 半導体デバイスボンディング用の極座標運動ボンディングヘッド
JP3005789B2 (ja) * 1993-11-25 2000-02-07 株式会社新川 ワイヤボンデイング装置
JP3235008B2 (ja) * 1994-07-16 2001-12-04 株式会社新川 ワイヤボンデイング部のボール検出方法及び検出装置
US6898454B2 (en) * 1996-04-25 2005-05-24 The Johns Hopkins University Systems and methods for evaluating the urethra and the periurethral tissues
JP3885867B2 (ja) * 2000-11-29 2007-02-28 日本電気株式会社 ワイヤボンディング装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61101039A (ja) * 1984-10-24 1986-05-19 Hitachi Ltd ワイヤボンデイング方法および装置
JPH0732174B2 (ja) * 1985-08-01 1995-04-10 株式会社東芝 超音波ワイヤボンディング方法および装置
JPS62123728A (ja) * 1985-11-25 1987-06-05 Hitachi Ltd ワイヤボンデイング方法および装置
JPS62150838A (ja) * 1985-12-25 1987-07-04 Hitachi Ltd 検出方法および装置
JPS62276841A (ja) * 1986-05-26 1987-12-01 Hitachi Ltd ワイヤボンデイング方法
JPH088285B2 (ja) * 1990-02-23 1996-01-29 株式会社東芝 ワイヤボンディング方法
JPH081920B2 (ja) * 1990-06-08 1996-01-10 株式会社東芝 ワイヤボンディング装置
JPH0547860A (ja) * 1991-08-08 1993-02-26 Shinkawa Ltd ワイヤボンデイング方法

Also Published As

Publication number Publication date
US5340010A (en) 1994-08-23
JP2879270B2 (ja) 1999-04-05
JPH04317342A (ja) 1992-11-09
KR960008511B1 (ko) 1996-06-26

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