KR930003306A - 테이프 클램프기구 - Google Patents

테이프 클램프기구 Download PDF

Info

Publication number
KR930003306A
KR930003306A KR1019920010766A KR920010766A KR930003306A KR 930003306 A KR930003306 A KR 930003306A KR 1019920010766 A KR1019920010766 A KR 1019920010766A KR 920010766 A KR920010766 A KR 920010766A KR 930003306 A KR930003306 A KR 930003306A
Authority
KR
South Korea
Prior art keywords
clamp mechanism
tape clamp
tape
clamper
clamping
Prior art date
Application number
KR1019920010766A
Other languages
English (en)
Other versions
KR960001168B1 (ko
Inventor
고오지 사또오
데쓰야 오하라
Original Assignee
아라이 가즈오
가부시끼가이샤 신가와
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아라이 가즈오, 가부시끼가이샤 신가와 filed Critical 아라이 가즈오
Publication of KR930003306A publication Critical patent/KR930003306A/ko
Application granted granted Critical
Publication of KR960001168B1 publication Critical patent/KR960001168B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Package Closures (AREA)

Abstract

내용 없음.

Description

테이프 클램프기구
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 1실시예를 도시하는 평면도,
제2도는 제1도의 정면도,
제3도는 제2도의 A-A선 단면도,
제4도는 제1도의 B-B선 단면도,
제5도는 제1도의 C-C선 단면도.

Claims (1)

  1. 상부 클램퍼와 하부 클램퍼로 테이프를 클램프하는 테이프 클램프기구에 있어서, 상기 상부 클램퍼와 상기 하부 클램퍼에는 상하의 서로 대응하는 위치에 각각 위치결정 구멍이 형성되어 있는 것을 특징으로 하는 테이프 클램프가구.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019920010766A 1991-07-15 1992-06-20 테이프 클램프기구 KR960001168B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP91-198198 1991-07-15
JP3198198A JP2890335B2 (ja) 1991-07-15 1991-07-15 テープクランプ機構

Publications (2)

Publication Number Publication Date
KR930003306A true KR930003306A (ko) 1993-02-24
KR960001168B1 KR960001168B1 (ko) 1996-01-19

Family

ID=16387108

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920010766A KR960001168B1 (ko) 1991-07-15 1992-06-20 테이프 클램프기구

Country Status (3)

Country Link
US (1) US5249726A (ko)
JP (1) JP2890335B2 (ko)
KR (1) KR960001168B1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100765942B1 (ko) * 2005-03-30 2007-10-10 후지논 가부시키가이샤 위치결정구조

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5558267A (en) * 1995-03-31 1996-09-24 Texas Instruments Incorporated Moat for die pad cavity in bond station heater block
KR0152607B1 (ko) * 1995-08-17 1998-12-01 김주용 윈도우 클램프 및 그를 이용한 리드 프레임 스트립의 정렬방법
JP3151702B2 (ja) * 1995-11-24 2001-04-03 株式会社新川 ボンディング装置用クランプ機構
US6062459A (en) * 1998-04-29 2000-05-16 Advanced Micro Devices, Inc. Wire bond clamp
JP5078787B2 (ja) * 2008-07-24 2012-11-21 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法
US8381965B2 (en) 2010-07-22 2013-02-26 Taiwan Semiconductor Manufacturing Company, Ltd. Thermal compress bonding
US8104666B1 (en) * 2010-09-01 2012-01-31 Taiwan Semiconductor Manufacturing Company, Ltd. Thermal compressive bonding with separate die-attach and reflow processes
CN103057299A (zh) * 2012-12-29 2013-04-24 中国航空工业集团公司第六三一研究所 一种书夹制作工装及方法
DE102015106265A1 (de) 2015-02-06 2016-08-11 Auto-Kabel Management Gmbh Ultraschallschweißvorrichtung sowie Verfahren zum Ultraschallschweißen
WO2019139954A1 (en) * 2018-01-09 2019-07-18 Kulicke And Soffa Industries, Inc. Systems and methods of operating wire bonding machines including clamping systems
JPWO2023026430A1 (ko) 2021-08-26 2023-03-02

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3516155A (en) * 1967-02-02 1970-06-23 Bunker Ramo Method and apparatus for assembling electrical components
GB1294973A (ko) * 1969-02-12 1972-11-01
JPH0737186B2 (ja) * 1988-02-06 1995-04-26 株式会社サクライ 加熱転写法
JPH02273949A (ja) * 1989-04-17 1990-11-08 Shinkawa Ltd テープボンデイング装置
CH680176A5 (ko) * 1989-11-14 1992-06-30 Esec Sa
US5035034A (en) * 1990-07-16 1991-07-30 Motorola, Inc. Hold-down clamp with mult-fingered interchangeable insert for wire bonding semiconductor lead frames

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100765942B1 (ko) * 2005-03-30 2007-10-10 후지논 가부시키가이샤 위치결정구조

Also Published As

Publication number Publication date
JP2890335B2 (ja) 1999-05-10
KR960001168B1 (ko) 1996-01-19
US5249726A (en) 1993-10-05
JPH0521532A (ja) 1993-01-29

Similar Documents

Publication Publication Date Title
KR890011761A (ko) 배추묵는 원형 고무밴드
KR930003306A (ko) 테이프 클램프기구
KR850001435A (ko) 센서의 장치구조
KR830006815A (ko) 형광 램프 장치
KR910015739A (ko) 니트런 캠
DE58904620D1 (de) Einspannvorrichtung.
KR870009419A (ko) 회로차단기
KR840005881A (ko) 테이프 카셋트
KR920020662A (ko) 본딩장치
KR930005520A (ko) 부품장착장치
KR930003307A (ko) 테이프 반송장치
KR900003307A (ko) 고분자 엘라스토머 조성물
KR900015618A (ko) 재생판 자개
KR870007917A (ko) 4-아세틸 이소퀴놀리논 화합물의 제조방법
KR930011937A (ko) 커텐용 슬라이더 장치
KR850000056A (ko) 두칸 빨래대야
KR900015268A (ko) 20 dip 리드 프레임의 댐바
KR840009209A (ko) 재치반 겸용 설겆이 대야
KR900002657A (ko) 무선 헤드폰(HEAD phoNE)
KR920007589A (ko) 좌와 겸용 독서대
KR830008885A (ko) 유동식 발전선
KR840001796A (ko) 묘 취 기
KR850000058A (ko) 우툴두툴하고 오목하게 들어간 빨래판
KR910015471A (ko) 비행선(飛行線)
KR860008838A (ko) 지철(호스키스) 겸용 천공기(펀치)

Legal Events

Date Code Title Description
A201 Request for examination
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20071129

Year of fee payment: 15

LAPS Lapse due to unpaid annual fee