KR920014881A - 경화성 폴리페닐렌 에테르 수지 조성물 및 이로부터 수득가능한 경화 수지 조성물 - Google Patents

경화성 폴리페닐렌 에테르 수지 조성물 및 이로부터 수득가능한 경화 수지 조성물 Download PDF

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KR920014881A
KR920014881A KR1019920000310A KR920000310A KR920014881A KR 920014881 A KR920014881 A KR 920014881A KR 1019920000310 A KR1019920000310 A KR 1019920000310A KR 920000310 A KR920000310 A KR 920000310A KR 920014881 A KR920014881 A KR 920014881A
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resin composition
polyphenylene ether
ether resin
curable
cured
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KR950013821B1 (ko
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데루오 가따요세
요시유끼 이시이
히로지 오다
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유미꾸라 레이이찌
아사히가세이고오교 가부시끼가이샤
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C08F290/142—Polyethers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C08L71/126—Polyphenylene oxides modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S525/00—Synthetic resins or natural rubbers -- part of the class 520 series
    • Y10S525/905—Polyphenylene oxide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31692—Next to addition polymer from unsaturated monomers

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Abstract

내용 없음

Description

경화성 폴리페닐렌 에테르 수지 조성물 및 이로부터 수득가능한 경화 수지 조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (25)

  1. 하기의 성분을 함유함을 특징으로 하는 경화성 폴리페닐렌 에테르 수지 조성물: (a)폴레페닐렌 에테르와 불포화 카르복실산 또는 산 무수물과의 적어도 하나의 반응 생성물을 함유하는 경화성 폴리페닐렌 에테르 수지, 성분 (a) 및 (b)의 총 중량에 대하여 98-40중량%, (b)트리알릴 이소시아누레이트 및 트리알릴 시아누레이트로 구성된 군으로부터 선택된 적어도 하나의 시아누레이트, 성분 (a) 및 (b)의 총중량에 대하여 2-60중량%, (c)에폭시수지와 경화제를 함유하는 수지 조성물, 성분 (a),(b) 및 (c)의 총 중량에 대하여 0~90중량%, (d)적어도 하나의 에폭시기와 적어도 하나의 불포화 이중결합을 갖는 화합물, 성분 (a),(b),(c) 및 (d)의 총 중량에 대하여 0~30중량%, (e)강화제, 성분 (a),(b),(c),(d) 및 (e)성분의 총 중량에 대하여 0~90중량%.
  2. 제1항에 있어서, 성분 (c),(d) 및 (e)의 각 양이 0인 경화성 폴리페닐렌 에테르 수지 조성물.
  3. 제2항의 경화성 폴리페닐렌 에테르 수지 조성물로부터 제조된 필름.
  4. 제2항의 경화성 폴리페닐렌 에테르 수지 조성물을 경화시켜 수득한 경화 폴리페닐렌 에테르 수지 조성물.
  5. 제4항의 경화 폴리페닐렌 에테르수지 조성물로부터 제조된 필름.
  6. 제1항에 있어서, 성분 (e)의 양이 성분 (a),(b),(c),(d) 및 (e)의 총 중량에 대하여 5~90중량%이며 성분 (c) 및 (d)의 각 양이 0인 경화성 폴리페닐렌 에테르 수지 조성물.
  7. 제6항의 경화성 폴리페닐렌 에테르 수지 조성물을 경화시켜 수득한 경화 폴리페닐렌 에테르 수지 조성물.
  8. 제1항에 있어서, 성분 (c)의 양이 성분 (a),(b),(c),(d) 및 (e)의 총 중량에 대하여 10~90중량%이며, 성분 (d) 및 (e)의 각 양이 0인 경화성 폴리페닐렌 에테르 수지 조성물.
  9. 제1항 또는 제8항에 있어서, 에폭시 수지가 브롬화 비스페놀 폴리글리시딜 에테르 수지(ⅰ)과 누볼락 에폭시수지(ⅱ)이며, 경화제가 성분(c)중의 페놀 수지(ⅲ)인 경화성 폴리페닐렌 에테르 수지 조성물.
  10. 제9항에 있어서, 브롬의 함량이 5~20중량%인 경화성 폴리페닐렌 에테르 수지 조성물.
  11. 제8항, 9항 및 10항중 어느 한 항의 경화성 폴리페닐렌 에테르로부터 제조된 필름.
  12. 제8항, 9항 및 10항중 어느 한 항의 경화성 폴리페닐렌 에테르 수지 조성물을 경화시켜 수득한, 유리 전이 온도가 하나인 경화 폴리페닐렌 에테르 수지 조성물.
  13. 제12항의 경화 폴리페닐렌 에테르 수지 조성물로 부터 제조된 필름.
  14. 제1항, 8항, 9항 및 10항중 어느 한 항에 있어서, 성분 (e)의 양이 성분 (a),(b),(c),(d) 및 (e)의 총 중량에 대하여 5~90중량%이며, 성분(d)의 양이 0인 경화성 폴리페닐렌 에테르 수지 조성물.
  15. 제14항의 경화성 폴리페닐렌 에테르 수지 조성물을 경화시켜 수득한, 유리전이 온도가 하나인 경화 폴리페닐렌 에테르 수지 조성물.
  16. 제1항에 있어서, 성분(c)의 양과 성분(d)의 양이 성분 (a),(b),(c),(d) 및 (e)의 총 중량에 대하여 각각 10~90중량%와 0.1~30중량%이며, 성분(e)의 양이 0인 경화성 폴리페닐렌 에테르 수지 조성물.
  17. 제16항에 있어서, 에폭시 수지가 브롬화 비스페놀 폴리글리시딜 에테르 수지(ⅰ)과 노볼락 에폭시 수지(ⅱ)이며, 경화제가 성분(c)중의 페놀 수지(ⅲ)인 경화성 폴리페닐렌 에테르 수지 조성물.
  18. 제17항에 있어서, 브롬 함량이 5~20중량%인 경화성 폴리페닐렌 에테르 수지 조성물.
  19. 제16,17및 18항중 어느 한 항의 경화성 폴리페닐렌 에테르 수지 조성물로부터 제조된 필름.
  20. 제16,17및 18항중 어느 한 항의 경화성 폴리페닐렌 에테르 수지 조성물을 경화시켜 수득한, 유리 전이 온도가 하나인 경화 폴리페닐렌 에테르 수지 조성물.
  21. 제20항의 경화 폴리페닐렌 에테르 수지 조성물로부터 제조된 필름.
  22. 제1항,16항,17항 및 18항중 어느 한 항에 있어서, 성분(e)의 양이 성분 (a),(b),(c),(d)및 (e)의 총 중량에 대하여 5~90중량%인 경화성 폴리페닐렌 에테르 수지 조성물.
  23. 제22항의 경화성 폴리페닐렌 에테르 수지 조성물을 경화시켜 수득한, 유리 전이 온도가 하나인 경화 폴리페닐렌 에테르 수지 조성물.
  24. 1차 금속 호일과 이 금속 호일의 하나 이상의 표면상에 제4항, 5항, 7항, 12항, 13항, 15항, 20항, 21항 및 23항중 어느 한 항의 경화 폴리페닐렌 에테르 수지 조성물인 하나 이상의 경화수지 조성물 층이 부착된 적층구조. 단, 복합 구조가 상기 금속 기판의 하나 이상의 표면상에 둘이상의 경화수지 조성물을 층을 갖는 경우, 둘 이상의 경화 수지 조성물 층은 동일하거나 상이하며 서로 다른 층위에 배치된다.
  25. 제25항에 있어서, 복합 구조가 1차 구리 금속 호일의 하나 이상의 표면상에 하나의 경화 수지 조성물 층을 갖는 경우, 경화 수지 조성물 층의 최외표면상에 부착된 추가의 금속 호일층을 가지고 있거나, 또는 복합 구조가 1차 구리 금속 호일의 하나 이상의 표면상에 2이상의 경화 수지 조성물 층을 갖는 경우, 경화 수지 조성물 층의 최외 표면상에 및/또는 경화수지 조성물 층과 여기에 인접한 경화 수지 조성물 층 사이에 부착된 추가의 금속호일을 가지고 있는 적층구조.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019920000310A 1991-01-11 1992-01-11 경화성 폴리페닐렌 에테르 수지 조성물, 이로부터 수득가능한 경화 수지 조성물 및 적층체 KR950013821B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP91-12581 1991-01-11
JP91-12582 1991-01-11
JP1258291A JPH0737568B2 (ja) 1991-01-11 1991-01-11 新規な硬化性ポリフェニレンエーテル・エポキシ樹脂組成物並びにこれを用いた複合材料および積層体
JP3012581A JPH0737567B2 (ja) 1991-01-11 1991-01-11 硬化性樹脂組成物並びにこれを用いた複合材料および積層体
JP12581 1991-01-11
JP12582 1991-01-11

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KR920014881A true KR920014881A (ko) 1992-08-25
KR950013821B1 KR950013821B1 (ko) 1995-11-16

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Families Citing this family (72)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2124588T3 (es) * 1994-09-08 1999-02-01 Akzo Nobel Nv Composicion de resina epoxidica que contiene alilo que comprende un copolimero de un anhidrido etilenicamente insaturado y un compuesto vinilico.
US6254971B1 (en) * 1996-06-07 2001-07-03 Asahi Kasei Kabushiki Kaisha Resin-having metal foil for multilayered wiring board, process for producing the same, multilayered wiring board, and electronic device
US6197898B1 (en) 1997-11-18 2001-03-06 General Electric Company Melt-mixing thermoplastic and epoxy resin above Tg or Tm of thermoplastic with curing agent
CN1101420C (zh) * 1997-11-25 2003-02-12 通用电气公司 聚(亚苯基醚)热固性组合物
AU2441199A (en) * 1998-02-23 1999-09-06 Asahi Kasei Kogyo Kabushiki Kaisha Thermosetting polyphenylene ether resin composition, cured resin composition obtained therefrom, and laminated structure
SG80588A1 (en) * 1998-04-04 2001-05-22 Gen Electric A curable polyphenylene ether-thermosetting resin composition and process
US6387990B1 (en) * 1999-09-10 2002-05-14 General Electric Company Curable epoxy resin compositions with brominated triazine flame retardants
JP3681118B2 (ja) * 1999-09-16 2005-08-10 ニッコー マテリアルズ ユーエスエイ、 インク エポキシプレプレグと併用する接着促進層
US6878782B2 (en) * 1999-12-01 2005-04-12 General Electric Thermoset composition, method, and article
US6905637B2 (en) * 2001-01-18 2005-06-14 General Electric Company Electrically conductive thermoset composition, method for the preparation thereof, and articles derived therefrom
US6812276B2 (en) * 1999-12-01 2004-11-02 General Electric Company Poly(arylene ether)-containing thermoset composition, method for the preparation thereof, and articles derived therefrom
US6627704B2 (en) 1999-12-01 2003-09-30 General Electric Company Poly(arylene ether)-containing thermoset composition, method for the preparation thereof, and articles derived therefrom
US7235192B2 (en) 1999-12-01 2007-06-26 General Electric Company Capped poly(arylene ether) composition and method
US6352782B2 (en) * 1999-12-01 2002-03-05 General Electric Company Poly(phenylene ether)-polyvinyl thermosetting resin
US6521703B2 (en) 2000-01-18 2003-02-18 General Electric Company Curable resin composition, method for the preparation thereof, and articles derived thereform
JP4231976B2 (ja) * 2000-03-30 2009-03-04 日本ゼオン株式会社 硬化性組成物及び多層回路基板
US6306963B1 (en) * 2000-05-08 2001-10-23 General Electric Co. Thermosetting resins and laminates
US6906120B1 (en) * 2000-06-20 2005-06-14 General Electric Poly(arylene ether) adhesive compositions
US6897282B2 (en) * 2000-07-10 2005-05-24 General Electric Compositions comprising functionalized polyphenylene ether resins
US6384176B1 (en) 2000-07-10 2002-05-07 General Electric Co. Composition and process for the manufacture of functionalized polyphenylene ether resins
JP2002265777A (ja) * 2001-03-12 2002-09-18 Matsushita Electric Works Ltd ポリフェニレンオキサイド樹脂組成物、プリプレグ、積層板、プリント配線板、多層プリント配線板
US6593391B2 (en) * 2001-03-27 2003-07-15 General Electric Company Abrasive-filled thermoset composition and its preparation, and abrasive-filled articles and their preparation
US6878781B2 (en) * 2001-03-27 2005-04-12 General Electric Poly(arylene ether)-containing thermoset composition in powder form, method for the preparation thereof, and articles derived therefrom
US7022777B2 (en) * 2001-06-28 2006-04-04 General Electric Moldable poly(arylene ether) thermosetting compositions, methods, and articles
US20030078347A1 (en) 2001-08-28 2003-04-24 General Electric Company Triazine compounds, polymers comprising triazine structural units, and method
US6608166B2 (en) * 2001-08-30 2003-08-19 General Electric Company Three-dimensional copolymers of polyphenylene ether resinsand sytrenic resins
US6620885B2 (en) 2001-08-30 2003-09-16 General Electric Company Copolymers of functionalized polyphenylene ether resins and blends thereof
US6500529B1 (en) * 2001-09-14 2002-12-31 Tonoga, Ltd. Low signal loss bonding ply for multilayer circuit boards
US6783841B2 (en) 2001-09-14 2004-08-31 Tonoga, Inc. Low signal loss bonding ply for multilayer circuit boards
US6826830B2 (en) * 2002-02-05 2004-12-07 International Business Machines Corporation Multi-layered interconnect structure using liquid crystalline polymer dielectric
US20030215588A1 (en) * 2002-04-09 2003-11-20 Yeager Gary William Thermoset composition, method, and article
US6734259B1 (en) * 2002-10-24 2004-05-11 International Business Machines Corporation Resin composition with a polymerizing agent and method of manufacturing prepreg and other laminate structures therefrom
US7250330B2 (en) * 2002-10-29 2007-07-31 International Business Machines Corporation Method of making an electronic package
SG157958A1 (en) * 2003-05-22 2010-01-29 Asahi Kasei Chemicals Corp Epoxy resin composition
US6905941B2 (en) * 2003-06-02 2005-06-14 International Business Machines Corporation Structure and method to fabricate ultra-thin Si channel devices
US7226980B2 (en) 2003-08-07 2007-06-05 General Electric Company Thermoset composition, method for the preparation thereof, and articles prepared therefrom
US7067595B2 (en) * 2003-10-03 2006-06-27 General Electric Company Poly (arylene ether) composition and method
US7148296B2 (en) * 2003-10-03 2006-12-12 General Electric Company Capped poly(arylene ether) composition and process
US7101923B2 (en) * 2003-10-03 2006-09-05 General Electric Company Flame-retardant thermoset composition, method, and article
US7211639B2 (en) * 2003-10-03 2007-05-01 General Electric Company Composition comprising functionalized poly(arylene ether) and ethylene-alkyl (meth)acrylate copolymer, method for the preparation thereof, and articles prepared therefrom
US6962965B2 (en) * 2004-02-20 2005-11-08 General Electric Company Functionalized poly(arylene ether) composition and process
US7329708B2 (en) * 2004-08-18 2008-02-12 General Electric Company Functionalized poly(arylene ether) composition and method
US20060038324A1 (en) * 2004-08-20 2006-02-23 Yeager Gary W Molding method for curable poly(arylene ether) composition and article thereby
US20060074151A1 (en) * 2004-09-28 2006-04-06 Polyclad Laminates, Inc. Low expansion dielectric compositions
US20070066710A1 (en) * 2005-09-21 2007-03-22 Peters Edward N Method for electrical insulation and insulated electrical conductor
US20080071000A1 (en) * 2006-09-15 2008-03-20 Christina Louise Braidwood Poly(arylene ether) composition and article
US20080071034A1 (en) * 2006-09-15 2008-03-20 Christina Louise Braidwood Poly(arylene ether) composition and method
US7582691B2 (en) * 2007-01-17 2009-09-01 Sabic Innovative Plastics Ip B.V. Poly(arylene ether) compositions and articles
JP5554500B2 (ja) * 2007-01-25 2014-07-23 パナソニック株式会社 プリプレグ、プリント配線板、多層回路基板、プリント配線板の製造方法
US7655278B2 (en) * 2007-01-30 2010-02-02 Sabic Innovative Plastics Ip B.V. Composite-forming method, composites formed thereby, and printed circuit boards incorporating them
US20080194724A1 (en) * 2007-02-12 2008-08-14 Pankaj Singh Gautam Method of forming a crosslinked poly(arylene ether) film, and film formed thereby
EP2113534B8 (en) * 2008-04-01 2011-09-21 Mitsubishi Gas Chemical Company, Inc. Resin composition, prepreg and metal-foil-clad laminate
US8614155B2 (en) 2010-08-20 2013-12-24 International Business Machines Corporation Resin composition eliminating volatile loss of initiating species for the preparation of printed circuit board laminates
US9243164B1 (en) 2012-02-21 2016-01-26 Park Electrochemical Corporation Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound
US9051465B1 (en) 2012-02-21 2015-06-09 Park Electrochemical Corporation Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound
JP6228732B2 (ja) * 2012-11-19 2017-11-08 日東電工株式会社 樹脂シート
KR102018232B1 (ko) * 2013-02-15 2019-09-04 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 고유전율 재료용 수지 조성물, 이것을 포함하는 성형품, 및 착색용 마스터배치
US9296916B2 (en) * 2013-08-09 2016-03-29 Sabic Global Technologies B.V. Poly(phenylene ether)/epoxy homogeneous solid and powder coating composition incorporating same
CN103467967A (zh) * 2013-09-16 2013-12-25 广东生益科技股份有限公司 一种热固性树脂组合物及其用途
US20150105505A1 (en) * 2013-10-11 2015-04-16 Isola Usa Corp. Varnishes and Prepregs and Laminates Made Therefrom
EP3569591A1 (en) 2014-07-22 2019-11-20 SABIC Global Technologies B.V. High heat monomers and methods of use thereof
US9752051B2 (en) 2015-04-06 2017-09-05 Rohm And Haas Electronic Materials Llc Polyarylene polymers
CN110551257B (zh) 2018-06-04 2021-10-08 台燿科技股份有限公司 树脂组合物及其预浸渍片、金属箔积层板和印刷电路板
CN109294215B (zh) * 2018-08-08 2020-11-20 万华化学集团股份有限公司 一种聚氨酯树脂组合料及用途和一种高强度高模量聚氨酯材料
TWI686436B (zh) 2018-08-28 2020-03-01 台燿科技股份有限公司 無鹵素低介電樹脂組合物，以及使用該組合物所製得之預浸漬片、金屬箔積層板與印刷電路板
TWI700332B (zh) 2018-12-06 2020-08-01 台燿科技股份有限公司 無鹵素低介電樹脂組合物，使用彼所製得之預浸漬片、金屬箔積層板及印刷電路板
CN111867239B (zh) * 2019-04-24 2021-08-27 广东生益科技股份有限公司 覆铜层压板和印制电路板
CN114207021B (zh) * 2019-07-17 2024-06-11 松下知识产权经营株式会社 树脂组合物、预浸料、带树脂的膜、带树脂的金属箔、覆金属箔层压板以及布线板
CN110607064A (zh) * 2019-08-13 2019-12-24 瑞声科技（南京）有限公司 树脂组合物、预浸料及相关基板
CN115626981A (zh) * 2019-12-31 2023-01-20 山东圣泉新材料股份有限公司 一种新型聚亚芳基醚树脂及其制备方法
TWI725851B (zh) 2020-05-15 2021-04-21 台燿科技股份有限公司 樹脂組合物，使用該樹脂組合物所製得之預浸漬片、金屬箔積層板及印刷電路板
CN111718659A (zh) * 2020-07-08 2020-09-29 铜陵华科电子材料有限公司 一种用于生产高频覆铜板的改性聚丁二烯胶水的制备方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4034136A (en) * 1969-06-30 1977-07-05 Fmc Corporation Flame-retardant resin compositions
CA927032A (en) * 1969-06-30 1973-05-22 H. Beacham Harry Flame-retardant resin compositions
JPS5869052A (ja) * 1981-10-21 1983-04-25 旭化成株式会社 新規な積層板及びその成形法
US4533727A (en) * 1983-04-06 1985-08-06 Mitsubishi Gas Chemical Company, Inc. Process for producing a curable resin from cyanate ester compound and unsaturated 1,2-epoxy compound
JPS61287739A (ja) * 1985-06-15 1986-12-18 松下電工株式会社 積層板
CA1285675C (en) * 1985-03-25 1991-07-02 Takaaki Sakamoto Method of preparing polyphenylene oxide composition and laminate using the composition
US4978715A (en) * 1985-08-02 1990-12-18 General Electric Company Solvent-resistant, compatible blends of polyphenylene ethers and linear polyesters
US4806297A (en) * 1986-02-11 1989-02-21 General Electric Company Solvent-resistant, compatible blends of polyphenylene ethers and linear polyesters
US4786664A (en) * 1987-03-26 1988-11-22 General Electric Company Compatible polyphenylene ether-linear polyester blends having improved coefficient of thermal expansion
JPS643223A (en) * 1987-06-25 1989-01-09 Mazda Motor Swirl chamber for internal combustion engine
US4912172A (en) * 1987-09-03 1990-03-27 General Electric Company Compositions comprising polyphenylene ethers, polyepoxides and aluminum or zinc diketone salt
EP0315829A3 (en) * 1987-11-10 1991-04-03 General Electric Company Drill back-up material for small bore drilling of circuit boards
US4853423A (en) * 1988-07-14 1989-08-01 General Electric Company Curable polyphenylene ether-polyepoxide compositions useful in printed circuit board production
CA1336464C (en) * 1988-07-14 1995-07-25 John Edward Hallgren Polyepoxide and polyphenylene ether-polyepoxide compositions useful in printed circuit board production
DE3931809C2 (de) * 1988-10-03 1998-09-17 Gen Electric Härtbare Polyphenylenäther/Polyepoxid-Zubereitungen und deren Verwendung
US5001010A (en) * 1988-10-11 1991-03-19 General Electric Company Curable polyphenylene ether-polyepoxide compositions from melt processed polyphenylene ethers, and laminates prepared therefrom
US5043367A (en) * 1988-12-22 1991-08-27 General Electric Company Curable dielectric polyphenylene ether-polyepoxide compositions useful in printed circuit board production
US5218030A (en) * 1989-02-08 1993-06-08 Asahi Kasei Kogyo Kabushiki Kaisha Curable polyphenylene ether resin composition and a cured resin composition obtainable therefrom
US5162450A (en) * 1989-02-17 1992-11-10 General Electric Company Curable dielectric polyphenylene ether-polyepoxide compositions
KR920701362A (ko) * 1989-10-06 1992-08-11 아더 엠.킹 전기 적층품을 위한 폴리페닐렌 옥시드/하이브리드 에폭시 수지계

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EP0494722A2 (en) 1992-07-15
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HK20597A (en) 1997-02-20
CN1174861A (zh) 1998-03-04
EP0494722A3 (en) 1993-07-21
CN1081658C (zh) 2002-03-27
CN1064088A (zh) 1992-09-02
US5352745A (en) 1994-10-04
KR950013821B1 (ko) 1995-11-16
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