DE69204689D1 - Eine härtbare Polyphenylenetherharzzusammensetzung und eine daraus herstellbare gehärtete Harzzusammensetzung. - Google Patents

Eine härtbare Polyphenylenetherharzzusammensetzung und eine daraus herstellbare gehärtete Harzzusammensetzung.

Info

Publication number
DE69204689D1
DE69204689D1 DE69204689T DE69204689T DE69204689D1 DE 69204689 D1 DE69204689 D1 DE 69204689D1 DE 69204689 T DE69204689 T DE 69204689T DE 69204689 T DE69204689 T DE 69204689T DE 69204689 D1 DE69204689 D1 DE 69204689D1
Authority
DE
Germany
Prior art keywords
resin composition
polyphenylene ether
curable polyphenylene
producible therefrom
cured resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69204689T
Other languages
English (en)
Other versions
DE69204689T2 (de
Inventor
Teruo Katayose
Yoshiyuki Ishii
Hiroji Oda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei Corp
Asahi Chemical Industry Co Ltd
Original Assignee
Asahi Chemical Industry Co Ltd
Asahi Kasei Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP1258291A external-priority patent/JPH0737568B2/ja
Priority claimed from JP3012581A external-priority patent/JPH0737567B2/ja
Application filed by Asahi Chemical Industry Co Ltd, Asahi Kasei Kogyo KK filed Critical Asahi Chemical Industry Co Ltd
Publication of DE69204689D1 publication Critical patent/DE69204689D1/de
Application granted granted Critical
Publication of DE69204689T2 publication Critical patent/DE69204689T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C08F290/142—Polyethers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C08L71/126—Polyphenylene oxides modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S525/00—Synthetic resins or natural rubbers -- part of the class 520 series
    • Y10S525/905—Polyphenylene oxide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31692—Next to addition polymer from unsaturated monomers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
DE1992604689 1991-01-11 1992-01-10 Eine härtbare Polyphenylenetherharzzusammensetzung und eine daraus herstellbare gehärtete Harzzusammensetzung. Expired - Lifetime DE69204689T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1258291A JPH0737568B2 (ja) 1991-01-11 1991-01-11 新規な硬化性ポリフェニレンエーテル・エポキシ樹脂組成物並びにこれを用いた複合材料および積層体
JP3012581A JPH0737567B2 (ja) 1991-01-11 1991-01-11 硬化性樹脂組成物並びにこれを用いた複合材料および積層体

Publications (2)

Publication Number Publication Date
DE69204689D1 true DE69204689D1 (de) 1995-10-19
DE69204689T2 DE69204689T2 (de) 1996-05-09

Family

ID=26348206

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1992604689 Expired - Lifetime DE69204689T2 (de) 1991-01-11 1992-01-10 Eine härtbare Polyphenylenetherharzzusammensetzung und eine daraus herstellbare gehärtete Harzzusammensetzung.

Country Status (6)

Country Link
US (1) US5352745A (de)
EP (1) EP0494722B1 (de)
KR (1) KR950013821B1 (de)
CN (2) CN1036402C (de)
DE (1) DE69204689T2 (de)
HK (1) HK20597A (de)

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US6905637B2 (en) * 2001-01-18 2005-06-14 General Electric Company Electrically conductive thermoset composition, method for the preparation thereof, and articles derived therefrom
US6878782B2 (en) * 1999-12-01 2005-04-12 General Electric Thermoset composition, method, and article
US6352782B2 (en) 1999-12-01 2002-03-05 General Electric Company Poly(phenylene ether)-polyvinyl thermosetting resin
US7235192B2 (en) 1999-12-01 2007-06-26 General Electric Company Capped poly(arylene ether) composition and method
US6627704B2 (en) 1999-12-01 2003-09-30 General Electric Company Poly(arylene ether)-containing thermoset composition, method for the preparation thereof, and articles derived therefrom
US6812276B2 (en) * 1999-12-01 2004-11-02 General Electric Company Poly(arylene ether)-containing thermoset composition, method for the preparation thereof, and articles derived therefrom
US6521703B2 (en) 2000-01-18 2003-02-18 General Electric Company Curable resin composition, method for the preparation thereof, and articles derived thereform
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CN106660953B (zh) 2014-07-22 2020-07-28 沙特基础工业全球技术有限公司 高耐热单体及其使用方法
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CN109294215B (zh) * 2018-08-08 2020-11-20 万华化学集团股份有限公司 一种聚氨酯树脂组合料及用途和一种高强度高模量聚氨酯材料
TWI686436B (zh) 2018-08-28 2020-03-01 台燿科技股份有限公司 無鹵素低介電樹脂組合物，以及使用該組合物所製得之預浸漬片、金屬箔積層板與印刷電路板
TWI700332B (zh) 2018-12-06 2020-08-01 台燿科技股份有限公司 無鹵素低介電樹脂組合物，使用彼所製得之預浸漬片、金屬箔積層板及印刷電路板
CN111867239B (zh) * 2019-04-24 2021-08-27 广东生益科技股份有限公司 覆铜层压板和印制电路板
CN114207021A (zh) * 2019-07-17 2022-03-18 松下知识产权经营株式会社 树脂组合物、预浸料、带树脂的膜、带树脂的金属箔、覆金属箔层压板以及布线板
CN110607064A (zh) * 2019-08-13 2019-12-24 瑞声科技（南京）有限公司 树脂组合物、预浸料及相关基板
CN115626981A (zh) * 2019-12-31 2023-01-20 山东圣泉新材料股份有限公司 一种新型聚亚芳基醚树脂及其制备方法
TWI725851B (zh) 2020-05-15 2021-04-21 台燿科技股份有限公司 樹脂組合物，使用該樹脂組合物所製得之預浸漬片、金屬箔積層板及印刷電路板
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Also Published As

Publication number Publication date
HK20597A (en) 1997-02-20
EP0494722A2 (de) 1992-07-15
KR950013821B1 (ko) 1995-11-16
CN1081658C (zh) 2002-03-27
EP0494722B1 (de) 1995-09-13
DE69204689T2 (de) 1996-05-09
EP0494722A3 (en) 1993-07-21
US5352745A (en) 1994-10-04
CN1036402C (zh) 1997-11-12
CN1174861A (zh) 1998-03-04
CN1064088A (zh) 1992-09-02
KR920014881A (ko) 1992-08-25

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