HK20597A - A curable polyphenylene ether resin composition and a cured resin composition obtainable therefrom - Google Patents

A curable polyphenylene ether resin composition and a cured resin composition obtainable therefrom

Info

Publication number
HK20597A
HK20597A HK20597A HK20597A HK20597A HK 20597 A HK20597 A HK 20597A HK 20597 A HK20597 A HK 20597A HK 20597 A HK20597 A HK 20597A HK 20597 A HK20597 A HK 20597A
Authority
HK
Hong Kong
Prior art keywords
resin composition
polyphenylene ether
obtainable therefrom
curable polyphenylene
cured resin
Prior art date
Application number
HK20597A
Other languages
English (en)
Inventor
Teruo Katayose
Yoshiyuki Ishii
Hiroji Oda
Original Assignee
Asahi Chemical Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP1258291A external-priority patent/JPH0737568B2/ja
Priority claimed from JP3012581A external-priority patent/JPH0737567B2/ja
Application filed by Asahi Chemical Ind filed Critical Asahi Chemical Ind
Publication of HK20597A publication Critical patent/HK20597A/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C08F290/142—Polyethers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C08L71/126—Polyphenylene oxides modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S525/00—Synthetic resins or natural rubbers -- part of the class 520 series
    • Y10S525/905—Polyphenylene oxide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31692—Next to addition polymer from unsaturated monomers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Epoxy Resins (AREA)
HK20597A 1991-01-11 1997-02-20 A curable polyphenylene ether resin composition and a cured resin composition obtainable therefrom HK20597A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1258291A JPH0737568B2 (ja) 1991-01-11 1991-01-11 新規な硬化性ポリフェニレンエーテル・エポキシ樹脂組成物並びにこれを用いた複合材料および積層体
JP3012581A JPH0737567B2 (ja) 1991-01-11 1991-01-11 硬化性樹脂組成物並びにこれを用いた複合材料および積層体

Publications (1)

Publication Number Publication Date
HK20597A true HK20597A (en) 1997-02-20

Family

ID=26348206

Family Applications (1)

Application Number Title Priority Date Filing Date
HK20597A HK20597A (en) 1991-01-11 1997-02-20 A curable polyphenylene ether resin composition and a cured resin composition obtainable therefrom

Country Status (6)

Country Link
US (1) US5352745A (xx)
EP (1) EP0494722B1 (xx)
KR (1) KR950013821B1 (xx)
CN (2) CN1036402C (xx)
DE (1) DE69204689T2 (xx)
HK (1) HK20597A (xx)

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CN110551257B (zh) 2018-06-04 2021-10-08 台燿科技股份有限公司 树脂组合物及其预浸渍片、金属箔积层板和印刷电路板
CN109294215B (zh) * 2018-08-08 2020-11-20 万华化学集团股份有限公司 一种聚氨酯树脂组合料及用途和一种高强度高模量聚氨酯材料
TWI686436B (zh) 2018-08-28 2020-03-01 台燿科技股份有限公司 無鹵素低介電樹脂組合物，以及使用該組合物所製得之預浸漬片、金屬箔積層板與印刷電路板
TWI700332B (zh) 2018-12-06 2020-08-01 台燿科技股份有限公司 無鹵素低介電樹脂組合物，使用彼所製得之預浸漬片、金屬箔積層板及印刷電路板
CN111867239B (zh) * 2019-04-24 2021-08-27 广东生益科技股份有限公司 覆铜层压板和印制电路板
JP7519587B2 (ja) * 2019-07-17 2024-07-22 パナソニックＩｐマネジメント株式会社 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板
CN110607064A (zh) * 2019-08-13 2019-12-24 瑞声科技（南京）有限公司 树脂组合物、预浸料及相关基板
CN113121825B (zh) * 2019-12-31 2022-09-27 山东圣泉新材料股份有限公司 一种聚亚芳基醚树脂及其制备方法
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Also Published As

Publication number Publication date
EP0494722A2 (en) 1992-07-15
CN1174861A (zh) 1998-03-04
KR920014881A (ko) 1992-08-25
CN1036402C (zh) 1997-11-12
US5352745A (en) 1994-10-04
KR950013821B1 (ko) 1995-11-16
CN1064088A (zh) 1992-09-02
DE69204689T2 (de) 1996-05-09
EP0494722A3 (en) 1993-07-21
EP0494722B1 (en) 1995-09-13
DE69204689D1 (de) 1995-10-19
CN1081658C (zh) 2002-03-27

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