KR920004508A - 수지 조성물 - Google Patents

수지 조성물 Download PDF

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Publication number
KR920004508A
KR920004508A KR1019910013903A KR910013903A KR920004508A KR 920004508 A KR920004508 A KR 920004508A KR 1019910013903 A KR1019910013903 A KR 1019910013903A KR 910013903 A KR910013903 A KR 910013903A KR 920004508 A KR920004508 A KR 920004508A
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KR
South Korea
Prior art keywords
resin
integer
formula
resin composition
phenolic
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KR1019910013903A
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English (en)
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KR950011915B1 (ko
Inventor
미끼오 키타하라
코이찌 마찌다
카타유끼 구보
모또유끼 토리카이
코타로 아사히나
준스께 타나까
아끼히로 야마구찌
Original Assignee
사와무라 하루오
미쯔이도오아쯔가가꾸 가부시기가이샤
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Application filed by 사와무라 하루오, 미쯔이도오아쯔가가꾸 가부시기가이샤 filed Critical 사와무라 하루오
Publication of KR920004508A publication Critical patent/KR920004508A/ko
Application granted granted Critical
Publication of KR950011915B1 publication Critical patent/KR950011915B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3415—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C08L61/12—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols with polyhydric phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/36—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes condensation products of phenols with aldehydes or ketones
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

내용 없음

Description

수지 조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (7)

  1. 식(I)
    (식중, R1은 탄소수 2이상의 m가 유기기, m은 2이상의 정수)로 표현된 폴리말레이미드화합물(a)및 식(II)
    (식중, X는 식
    을 지니는 2기기이고, m은 0~100의 정수)로 표현된 페놀성아르알킬수지(b)또는 페놀성아르알킬수지와 페놀과 혼합물을 함유하는 유기성분(A)및 무기충전물을 함유하는 성분(B)로 이루어진 수지조성물.
  2. 식(II)
    (식중, m은 탄소수 2이상의 m가 유기기, m은 2이상의 정수)로 표현된 폴리말레이미드화합물(a)및 식(II)
    식중, X는 식을 지니는 2가기이고, n은 0~100의 정수)로 표현된 페놀성아르알킬수지(b)또는 페놀성아르알킬수지와 페놀과의 혼합물 및 에폭시수지(c)를 함유하는 유기성분(A) 및 , 무기 충전물을 함유하는 성분(B)로 이루어진 수지조성물.
  3. 제1항 또는 제2항에 있어서, 페놀성아르알킬수지는 식 (II-A).
    (식중, n은 0~100의 정수)로 표현된 페닐페놀아르알킬수지인 것을 특징으로 하는 수지 조성물.
  4. 제1항 또는 제2항에 있어서, 페놀성 아르알킬수지는 식 (II-B)
    (식중, n은 0~100의 정수)로 표현된 나프톨아르알킬수지인 것을 특징으로 하는 수지조성물.
  5. 제1항 내지 제4항의 어느 한항의 수지조성물로 이루어진 반도체시일링 수지조성물.
  6. 제5항에 있어서, 성분(b)에 있어서, 페놀성아르알킬수지와 혼합물을 형성하는 페놀은 페놀및/ 또는 치환페놀과 알데히드의 반응생성물이며, 식(III)
    (식중, R2는 수소원자, 히드록시기, 또는 탄소수1~9의 알킬기, r은 1이상의 정수)로 표현된 페놀성노보락수지인 것을 특징으로 반도체시일링 수지조성물.
  7. 제5항에 있어서, 에폭시수지(c)는 페놀 및/ 또는 치환페놀과 알데히드의 반응생성물인 페놀성노브락수지에서 유도된 것으로 식(IV)
    (식중, R3는 수소원자 또는 탄소수 1~9의 알킬기, P는 1이상의 정수)로 표현된 것을 특징으로 하는 반도체시일링 수지조성물.
    ※ 참고사항: 최초출원 내용에 의하여 공개하는 것임.
KR1019910013903A 1990-08-13 1991-08-13 수지조성물 KR950011915B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP215837 1983-11-16
JP21154590 1990-08-13
JP211545 1990-08-13
JP90-211545 1990-08-13
JP90-215837 1990-08-17
JP21583790 1990-08-17

Publications (2)

Publication Number Publication Date
KR920004508A true KR920004508A (ko) 1992-03-27
KR950011915B1 KR950011915B1 (ko) 1995-10-12

Family

ID=26518710

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910013903A KR950011915B1 (ko) 1990-08-13 1991-08-13 수지조성물

Country Status (5)

Country Link
US (1) US5266654A (ko)
EP (1) EP0471522B1 (ko)
KR (1) KR950011915B1 (ko)
CA (1) CA2048981A1 (ko)
DE (1) DE69115381T2 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI274771B (en) * 2003-11-05 2007-03-01 Mitsui Chemicals Inc Resin composition, prepreg and laminate using the same
JP5918425B1 (ja) * 2015-06-23 2016-05-18 エア・ウォーター株式会社 イミド基含有ナフトール樹脂製造方法、熱硬化性樹脂組成物およびその硬化物ならびに用途
TWI681991B (zh) * 2018-10-11 2020-01-11 日商昭和電工股份有限公司 硬化性樹脂組成物、其硬化物、使用該硬化性樹脂組成物的構造體之製造方法，及包含該硬化物的構造體

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1462781A (en) * 1973-01-16 1977-01-26 Albright & Wilson Resin composition
EP0225174A3 (en) * 1985-11-26 1989-04-12 Sumitomo Chemical Company, Limited Thermosetting resin composition and a composite material comprising the cured product of the resin composition as its matrix
JPH0794920B2 (ja) * 1987-05-18 1995-10-11 松下精工株式会社 空調用グリル
JPH01213335A (ja) * 1988-02-22 1989-08-28 Mitsui Toatsu Chem Inc 半導体封止用樹脂組成物
JPH0243205A (ja) * 1988-08-03 1990-02-13 Mitsui Toatsu Chem Inc 半導体封止用樹脂組成物
US5015674A (en) * 1988-08-05 1991-05-14 Mitsui Toatsu Chemicals, Inc. Composition of vinyl polymer-grafted, silicone polymer-modified epoxy resin and polymaleimide
JPH0245554A (ja) * 1988-08-08 1990-02-15 Mitsui Toatsu Chem Inc 半導体封止用樹脂組成物
EP0400898A3 (en) * 1989-05-30 1993-01-07 MITSUI TOATSU CHEMICALS, Inc. Heat resistant epoxy resin composition

Also Published As

Publication number Publication date
KR950011915B1 (ko) 1995-10-12
EP0471522B1 (en) 1995-12-13
EP0471522A1 (en) 1992-02-19
DE69115381T2 (de) 1996-07-04
DE69115381D1 (de) 1996-01-25
US5266654A (en) 1993-11-30
CA2048981A1 (en) 1992-02-14

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