KR920004080A - 분산 강화된 납 주석 합금 땜납 - Google Patents

분산 강화된 납 주석 합금 땜납 Download PDF

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Publication number
KR920004080A
KR920004080A KR1019910014223A KR910014223A KR920004080A KR 920004080 A KR920004080 A KR 920004080A KR 1019910014223 A KR1019910014223 A KR 1019910014223A KR 910014223 A KR910014223 A KR 910014223A KR 920004080 A KR920004080 A KR 920004080A
Authority
KR
South Korea
Prior art keywords
particles
solder
tin alloy
solder according
alloy
Prior art date
Application number
KR1019910014223A
Other languages
English (en)
Inventor
에스. 버트라벳 헤만트
에이취. 보서 오트마르
에이취. 케인 로버트
맥기 수잔
칼필드 토마스
Original Assignee
프레데릭 얀 스미트
앤.브이.필립스 글로아이람펜파브리켄
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 프레데릭 얀 스미트, 앤.브이.필립스 글로아이람펜파브리켄 filed Critical 프레데릭 얀 스미트
Publication of KR920004080A publication Critical patent/KR920004080A/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/268—Pb as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0215—Metallic fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0272—Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12486—Laterally noncoextensive components [e.g., embedded, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12687—Pb- and Sn-base components: alternative to or next to each other

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Powder Metallurgy (AREA)

Abstract

내용 없음

Description

분산 강화된 납 주석 합금 땜납
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제2도 및 제4도는 본 발명의 땜납에서 형성된 결합부의 포토 마이크로 그래프.

Claims (13)

  1. 입자의 크기가 5㎛보다 적은 니켈-주석 금속간물 및 황화 금속으로 구성하는 그룹에서 선택된 입자를 5Vol.%까지 포함하는 것을 특징으로 하는 분산 강화된 납 주석 합금 땜납.
  2. 제1항에 있어서, 입자의 0.5-5Vol.%가 존재하는 것을 특징으로 하는 땜납.
  3. 제2항에 있어서, 입자의 0.2-2Vol.%가 존재하는 것을 특징으로 하는 땜납.
  4. 제3항에 있어서, 입자가 황화 금속의 입자인 것을 특징으로 하는 땜납.
  5. 제4항에 있어서, 입자의 크기가 1㎛보다 적은 것을 특징으로 하는 땜납.
  6. 제5항에 있어서, 입자가 황화철 혹은 황화망간인 것을 특징으로 하는 땜납.
  7. 제3항에 있어서, 입자가 니켈 주석 금속간물인 것을 특징으로 하는 땜납.
  8. 제7항에 있어서, 입자의 크기가 1㎛보다 적은 것을 특징으로 하는 땜납.
  9. 제8항에 있어서, 입자가 Ni3Sn4혹은 Cu9NiSn3의 입자인 것을 특징으로 하는 땜납.
  10. 제6항에 있어서, 납 주석 합금은 약 60%중량의 Sn과 약 40%중량의 Pb혹은 약 95%중량의 Pb와 약5%중량의 Sn으로 구성하는 합금인 것을 특징으로 하는 땜납.
  11. 제9항에 있어서, 납 주석 합금은 약 60%중량의 Sn과 약 40%중량의 Pb혹은 약 95%중량의 Pb와 약5%중량의 Sn으로 구성하는 합금인 것을 특징으로 하는 땜납.
  12. 제1항의 땜납으로 형성된 땜납된 결합부.
  13. 납 주석 합금을 사용하여 두 부분을 서로 땜납하는 방법에 있어서, 합금은 입자의 크기가 5㎛보다 적은 니켈 주석 금속간물 및 황화 금속으로 구성하는 그룹에서 선택된 입자를 포함하는 것을 특징으로 하는 땜납.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910014223A 1990-08-27 1991-08-19 분산 강화된 납 주석 합금 땜납 KR920004080A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US573,440 1990-08-27
US07/573,440 US5066544A (en) 1990-08-27 1990-08-27 Dispersion strengthened lead-tin alloy solder

Publications (1)

Publication Number Publication Date
KR920004080A true KR920004080A (ko) 1992-03-27

Family

ID=24292004

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910014223A KR920004080A (ko) 1990-08-27 1991-08-19 분산 강화된 납 주석 합금 땜납

Country Status (6)

Country Link
US (1) US5066544A (ko)
EP (1) EP0476734B1 (ko)
JP (1) JPH04305395A (ko)
KR (1) KR920004080A (ko)
CN (1) CN1059372A (ko)
DE (1) DE69108333D1 (ko)

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KR100438409B1 (ko) * 2001-10-26 2004-07-02 한국과학기술원 복합솔더 및 이의 제조방법

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Also Published As

Publication number Publication date
CN1059372A (zh) 1992-03-11
EP0476734A1 (en) 1992-03-25
EP0476734B1 (en) 1995-03-22
DE69108333D1 (de) 1995-04-27
US5066544A (en) 1991-11-19
JPH04305395A (ja) 1992-10-28

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