KR890003973A - 전자 기기용 구리합금 - Google Patents

전자 기기용 구리합금 Download PDF

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Publication number
KR890003973A
KR890003973A KR1019870008521A KR870008521A KR890003973A KR 890003973 A KR890003973 A KR 890003973A KR 1019870008521 A KR1019870008521 A KR 1019870008521A KR 870008521 A KR870008521 A KR 870008521A KR 890003973 A KR890003973 A KR 890003973A
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KR
South Korea
Prior art keywords
weight
copper alloy
less
ppm
content
Prior art date
Application number
KR1019870008521A
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English (en)
Other versions
KR950004935B1 (ko
Inventor
마꼬또 아사이
요시마사 오오야마
도오루 다니가와
시게오 시노자끼
쇼지 시가
Original Assignee
구사까베 에쯔지
후루까와 덴끼 가부시끼 가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP61232956A external-priority patent/JP2542370B2/ja
Priority claimed from JP25264286A external-priority patent/JPS63109133A/ja
Application filed by 구사까베 에쯔지, 후루까와 덴끼 가부시끼 가이샤 filed Critical 구사까베 에쯔지
Publication of KR890003973A publication Critical patent/KR890003973A/ko
Application granted granted Critical
Publication of KR950004935B1 publication Critical patent/KR950004935B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Conductive Materials (AREA)

Abstract

내용 없음

Description

전자 기기용 구라합금
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (5)

  1. 전자 기기용 구리 합금에 있어서, Sn 2.0 내지 7.0중량%, Ni, Co, Cr중의 적어도 한 종류의 총량이 1.0 내지 6.0중량%, Si 0.1 내지 2.0중량%, 그리고 잔부는 Cu 및 불가피한 불순물로 구성하고, 이에 따라 불가피한 불순물 내의 O2의 함유량이 50ppm이하, S의 함유량이 20ppm이하이고, 침전물의 평균 입경이 10㎛이하인 것을 특징으로 하는 전자 기기용 구리 합금.
  2. 제1항에 있어서, 각기, Ni 1.0 내지 6.0중량%, Co 1.5중량%이하, Cr0.05 내지 0.8중량%의 범위내에서 Ni, Co, Cr중의 적어도 한 종류가 (Ni+Co+Cr)/Si=2 내지 8을 유지하도록 총량 1.0 내지 6.0중량%로 함유되고, 이에 따라 O2의 함유량이 30ppm이하, S의 함유량이 10ppm이하이고, 침전물의 평균 입경이 3㎛이하인 것을특징으로 하는 전자 기기용 구리 합금.
  3. 제1항 및 제2항에 있어서, 0.01 내지 5.0중량%로 범위를 정한 Zn 및 Mn, 0.01 내지 2.0중량%로 범위를 정한 Al 및 Fe, 0.01 내지 0.8중량%로 범위를 정한 Ti 및 ZR, 그리고 각기, 0.001 내지 0.3중량%로 범위를 정한 Ag, Mg, Be, In, Ca, P, B, Y, La, Te, Ce로 구성되어 있는 그룹에서 선택된 한종류 또는 두 종류 이상의 원소가 0.001 내지 5.0중량%의 양으로 포함되어 있는 것을 특징으로 하는 전자 기기용 구리 합금.
  4. 제1항, 제2항 및 제3항에 있어서, Sn 2 내지 5중량%의 범위내에서 반도체소자의 라이드 재료용으로 사용되는 것을 포함하는 것을 특징으로 하는 전자 기기용 구리 합금.
  5. 제1항, 제2항 및 제3항에 있어서, Sn 2.5 내지 7중량%의 범위내에서 전자 및 전기 기기의 코넥터, 소켓, 스프링, 단자용으로 사용되는 것을 포함하고 있는 것을 특징으로 하는 전자 기기용 구리 합금.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019870008521A 1986-09-30 1987-08-04 전자 기기용 구리 합금 KR950004935B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP?232956? 1986-09-30
JP61232956A JP2542370B2 (ja) 1986-09-30 1986-09-30 半導体リ−ド用銅合金
JP25264286A JPS63109133A (ja) 1986-10-23 1986-10-23 電子機器用銅合金とその製造法
JP?252642? 1986-10-23

Publications (2)

Publication Number Publication Date
KR890003973A true KR890003973A (ko) 1989-04-19
KR950004935B1 KR950004935B1 (ko) 1995-05-16

Family

ID=26530763

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019870008521A KR950004935B1 (ko) 1986-09-30 1987-08-04 전자 기기용 구리 합금

Country Status (3)

Country Link
US (1) US5021105A (ko)
KR (1) KR950004935B1 (ko)
DE (1) DE3725830C2 (ko)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5149917A (en) * 1990-05-10 1992-09-22 Sumitomo Electric Industries, Ltd. Wire conductor for harness
JP2673973B2 (ja) * 1991-03-07 1997-11-05 三菱伸銅 株式会社 耐熱間圧延割れ性のすぐれた高強度Ｃｕ合金
DE4121994C2 (de) * 1991-07-03 1995-06-08 Wieland Werke Ag Verfahren zur Herstellung einer Kupfer-Nickel-Zinn-Legierung sowie ihre Verwendung
EP0751567B1 (en) * 1995-06-27 2007-11-28 International Business Machines Corporation Copper alloys for chip interconnections and method of making
US6346215B1 (en) * 1997-12-19 2002-02-12 Wieland-Werke Ag Copper-tin alloys and uses thereof
CN1063801C (zh) * 1998-01-14 2001-03-28 浙江大学 一种高强度高软化温度铜基弹性材料
FR2787737B1 (fr) * 1998-12-23 2001-01-19 Commissariat Energie Atomique Composition de brasure, procede d'assemblage de pieces en materiaux a base d'alumine par brasage refractaire avec ladite composition de brasure, assemblage et joint refractaire ainsi obtenus
US6251199B1 (en) 1999-05-04 2001-06-26 Olin Corporation Copper alloy having improved resistance to cracking due to localized stress
DE10011199C1 (de) * 2000-03-08 2001-10-18 Kronenberg Gmbh H & J Elektrischer Kontakt
US20050127364A1 (en) * 2002-05-17 2005-06-16 Idemitsu Kosan Co., Ltd. Wiring material and wiring board using the same
US9340853B2 (en) * 2002-12-23 2016-05-17 Auxitrol Sa Cu—Al—Ni—Fe alloy and sensor for measuring a physical parameter comprising a component made of such an alloy
FR2849060B1 (fr) * 2002-12-23 2005-12-30 Auxitrol Sa Alliage cu-al-ni-fe et sonde pour la mesure d'un parametre physique comportant un element dans un tel alliage
WO2006101172A1 (ja) * 2005-03-24 2006-09-28 Nippon Mining & Metals Co., Ltd. 電子材料用銅合金
JP4068626B2 (ja) * 2005-03-31 2008-03-26 日鉱金属株式会社 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ−Ｃｒ系銅合金及びその製造方法
JP5306591B2 (ja) * 2005-12-07 2013-10-02 古河電気工業株式会社 配線用電線導体、配線用電線、及びそれらの製造方法
US20070253858A1 (en) * 2006-04-28 2007-11-01 Maher Ababneh Copper multicomponent alloy and its use
JP5085908B2 (ja) * 2006-10-03 2012-11-28 Ｊｘ日鉱日石金属株式会社 電子材料用銅合金及びその製造方法
JP2012038823A (ja) * 2010-08-04 2012-02-23 Nitto Denko Corp 配線回路基板
DE102016008757B4 (de) 2016-07-18 2020-06-10 Wieland-Werke Ag Kupfer-Nickel-Zinn-Legierung, Verfahren zu deren Herstellung sowie deren Verwendung
DE102016008758B4 (de) * 2016-07-18 2020-06-25 Wieland-Werke Ag Kupfer-Nickel-Zinn-Legierung, Verfahren zu deren Herstellung sowie deren Verwendung
DE102016008754B4 (de) 2016-07-18 2020-03-26 Wieland-Werke Ag Kupfer-Nickel-Zinn-Legierung, Verfahren zu deren Herstellung sowie deren Verwendung
DE102016008753B4 (de) 2016-07-18 2020-03-12 Wieland-Werke Ag Kupfer-Nickel-Zinn-Legierung, Verfahren zu deren Herstellung sowie deren Verwendung
DE102016008745B4 (de) 2016-07-18 2019-09-12 Wieland-Werke Ag Kupfer-Nickel-Zinn-Legierung, Verfahren zu deren Herstellung sowie deren Verwendung

Family Cites Families (9)

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DE531304C (ko) *
DE532992C (de) * 1926-05-13 1931-09-12 Ver Deutsche Metallwerke Akt G Herstellung hochwertiger Kupferlegierungen
DE659207C (de) * 1935-12-10 1938-04-28 Aeg Verfahren zur Erhoehung der elektrischen Leitfaehigkeit von Zinnbronzen
DE2429754C3 (de) * 1974-06-21 1981-12-17 Olin Corp., 06511 New Haven, Conn. Verfahren zur Verbesserung der Kriechfestigkeit und Spannungsrelaxation von Federn aus Kupferwerkstoffen
US4114509A (en) * 1977-06-22 1978-09-19 Hartwell Corporation Fastener plunger entry resistance means
US4656003A (en) * 1984-10-20 1987-04-07 Kabushiki Kaisha Kobe Seiko Sho Copper alloy and production of the same
JPS6250425A (ja) * 1985-08-29 1987-03-05 Furukawa Electric Co Ltd:The 電子機器用銅合金
US4822560A (en) * 1985-10-10 1989-04-18 The Furukawa Electric Co., Ltd. Copper alloy and method of manufacturing the same
JP2619003B2 (ja) * 1988-08-05 1997-06-11 株式会社東芝 酸素検出素子及びその製造方法

Also Published As

Publication number Publication date
DE3725830C2 (de) 2000-03-30
DE3725830A1 (de) 1988-03-31
KR950004935B1 (ko) 1995-05-16
US5021105A (en) 1991-06-04

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