KR910015022A - 반도체 패키지의 외부 리이드 구부림 장치 - Google Patents

반도체 패키지의 외부 리이드 구부림 장치 Download PDF

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Publication number
KR910015022A
KR910015022A KR1019900005047A KR900005047A KR910015022A KR 910015022 A KR910015022 A KR 910015022A KR 1019900005047 A KR1019900005047 A KR 1019900005047A KR 900005047 A KR900005047 A KR 900005047A KR 910015022 A KR910015022 A KR 910015022A
Authority
KR
South Korea
Prior art keywords
punch
semiconductor package
lead bending
external lead
bending device
Prior art date
Application number
KR1019900005047A
Other languages
English (en)
Other versions
KR940005714B1 (ko
Inventor
아키라 마쓰모토
Original Assignee
키시모토 타쓰조오
가부시끼가이샤 와이.케이.시이
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 키시모토 타쓰조오, 가부시끼가이샤 와이.케이.시이 filed Critical 키시모토 타쓰조오
Publication of KR910015022A publication Critical patent/KR910015022A/ko
Application granted granted Critical
Publication of KR940005714B1 publication Critical patent/KR940005714B1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/023—Feeding of components with bending or straightening of the terminal leads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D43/00—Feeding, positioning or storing devices combined with, or arranged in, or specially adapted for use in connection with, apparatus for working or processing sheet metal, metal tubes or metal profiles; Associations therewith of cutting devices
    • B21D43/02—Advancing work in relation to the stroke of the die or tool
    • B21D43/04—Advancing work in relation to the stroke of the die or tool by means in mechanical engagement with the work
    • B21D43/05—Advancing work in relation to the stroke of the die or tool by means in mechanical engagement with the work specially adapted for multi-stage presses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Bending Of Plates, Rods, And Pipes (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)

Abstract

내용 없음

Description

반도체 패키지의 외부 리이드 구부림 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는, 본 발명의 반도체 패키지의 외부 리이드 구부림 장치의 단면도, 제2도는, 제1도의 구부림 장치의 좌측면도, 제3도는, 외부 리이드 가공전의 반도체 패키지의 정면도.

Claims (1)

  1. 외부 리이드를 구비한 반도체 패키지를 얹어놓는 것이 가능한 대(14)와, 외력에 의하여 상기 대 (14)의 방향으로 승강하는 펀치 호울더(22)와, 상기 펀치 호울더 (22)로부터 상기 대(14)위의 반도체 패키지 본체 틀 누르는 방향으로 미끄럼 동작이 자유롭게 힘이 가하여 지지된 누름펀치(20)와, 이 누름펀치(20)의 중심으로 향하여 수렴하고, 상기 외부 리이드에 경사진 윗쪽으로부터 구부림 힘을 가하는 외부 리이드 구부림 펀치(24)를 가지며, 상기 외부 리이드 구부림 펀치(24)는, 상기 누름펀치(20)가 상기 대 (14)와의 사이에서 상기 반도체 패키지를 누른 다음에, 상기 펀치 호울더(22)의 강하에 의하여 상기 누름펀치 (20)로 부터 돌출하도록 되어있는 반도체 패키지의 외부 리이드 구부림 장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019900005047A 1990-01-25 1990-04-12 반도체 패키지의 외부 리이드 구부림 장치 KR940005714B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013518A JPH03219661A (ja) 1990-01-25 1990-01-25 半導体パッケージの外部リード折曲装置
JP2-13518 1990-01-25

Publications (2)

Publication Number Publication Date
KR910015022A true KR910015022A (ko) 1991-08-31
KR940005714B1 KR940005714B1 (ko) 1994-06-23

Family

ID=11835377

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900005047A KR940005714B1 (ko) 1990-01-25 1990-04-12 반도체 패키지의 외부 리이드 구부림 장치

Country Status (5)

Country Link
US (1) US5048412A (ko)
EP (1) EP0438854B1 (ko)
JP (1) JPH03219661A (ko)
KR (1) KR940005714B1 (ko)
DE (1) DE69008149T2 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2596217Y2 (ja) * 1991-06-21 1999-06-07 山形日本電気株式会社 切断成形装置
US5531014A (en) * 1993-12-06 1996-07-02 Fierkens; Richard H. J. Electromechanical press and method of operating
CN117225941A (zh) * 2023-11-15 2023-12-15 江苏鑫瑞崚新材料科技有限公司 一种金属弯曲成型挤压机

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB844611A (en) * 1955-11-16 1960-08-17 Press Equipment Ltd Improvements relating to power presses
DE1271067B (de) * 1960-08-16 1968-06-27 Weingarten Ag Maschf Pressenstrasse zur Herstellung von Blechteilen
US3199358A (en) * 1962-07-11 1965-08-10 Textron Inc Lifter mechanism
US3557599A (en) * 1968-04-08 1971-01-26 Dayton Reliable Tool & Mfg Co Multiple station plunger press
DE2165365A1 (de) * 1970-12-31 1972-07-27 Kabushiki Kaisha Komatsu Seisakusho, Tokio Presse
DE2365980C2 (de) * 1973-09-29 1989-07-20 Günter 7500 Karlsruhe Zierpka Vorschubeinrichtung zum schrittweisen Material- und/oder Werkstücktransport, insbesondere in Pressen
JPS528578A (en) * 1975-07-11 1977-01-22 Kazuo Yamada Pressing device
US4354790A (en) * 1979-12-31 1982-10-19 Utilux Pty. Limited Feed mechanisms
JPS5784220A (en) * 1980-11-14 1982-05-26 Aisin Seiki Co Ltd Composite engine mount for vehicle engine
JPS5952858A (ja) * 1982-09-18 1984-03-27 Mitsubishi Electric Corp 半導体装置のリ−ド成形装置
JPS59141337A (ja) * 1983-02-02 1984-08-14 Kyowa Press:Kk プレスの被加工物送り装置におけるロッド駆動装置
JPS6169661A (ja) * 1984-09-14 1986-04-10 Matsumura Seisakusho:Kk Ｉｃリ−ドフレ−ム切断用自動プレス装置における移送装置
JPS6239107A (ja) * 1985-08-15 1987-02-20 Matsumura Seisakusho:Kk Ｉｃリ−ドフレ−ム切断成形用自動プレス装置
JPS6293967A (ja) * 1985-10-19 1987-04-30 Toei Seiko:Kk Ｉｃのカツト及びベンド装置
JPS6341304A (ja) * 1986-08-08 1988-02-22 Sumitomo Heavy Ind Ltd メカニカルトランスフアフイ−ダ
JPS63108919A (ja) * 1986-10-24 1988-05-13 Mitsubishi Electric Corp リ−ドフオ−ミング装置
JPS63232358A (ja) * 1987-03-20 1988-09-28 Hitachi Ltd 電子部品のリ−ド成形装置
JPH01123449A (ja) * 1987-11-07 1989-05-16 Mitsubishi Electric Corp 半導体装置のリード成形方法

Also Published As

Publication number Publication date
DE69008149T2 (de) 1994-10-27
KR940005714B1 (ko) 1994-06-23
JPH03219661A (ja) 1991-09-27
EP0438854B1 (en) 1994-04-13
DE69008149D1 (de) 1994-05-19
US5048412A (en) 1991-09-17
EP0438854A3 (en) 1992-02-26
EP0438854A2 (en) 1991-07-31

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