KR890011053A - 다이본딩 장치 - Google Patents

다이본딩 장치 Download PDF

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Publication number
KR890011053A
KR890011053A KR1019880013651A KR880013651A KR890011053A KR 890011053 A KR890011053 A KR 890011053A KR 1019880013651 A KR1019880013651 A KR 1019880013651A KR 880013651 A KR880013651 A KR 880013651A KR 890011053 A KR890011053 A KR 890011053A
Authority
KR
South Korea
Prior art keywords
die
bonding device
contact
collet
collet holder
Prior art date
Application number
KR1019880013651A
Other languages
English (en)
Other versions
KR910007102B1 (ko
Inventor
노부도 야마자끼
시게루 후게
미노루 가와기시
Original Assignee
야스모 다께시
가부시끼가이샤 신가와
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 야스모 다께시, 가부시끼가이샤 신가와 filed Critical 야스모 다께시
Publication of KR890011053A publication Critical patent/KR890011053A/ko
Application granted granted Critical
Publication of KR910007102B1 publication Critical patent/KR910007102B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/82—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps
    • B29C66/822—Transmission mechanisms
    • B29C66/8227—Transmission mechanisms using springs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/92—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools
    • B29C66/924—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the pressure, the force, the mechanical power or the displacement of the joining tools
    • B29C66/9241—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the pressure, the force or the mechanical power
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/92—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools
    • B29C66/924—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the pressure, the force, the mechanical power or the displacement of the joining tools
    • B29C66/9261—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the displacement of the joining tools
    • B29C66/92611—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the displacement of the joining tools by controlling or regulating the gap between the joining tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/87—Auxiliary operations or devices
    • B29C66/872—Starting or stopping procedures

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)

Abstract

내용 없음

Description

다이본딩 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1 도는 정면도.
제 2 도는 좌측면도.
제 3 도는 평면도이다.

Claims (1)

  1. 상하 구동하는 상하 이동블록과, 이 상하 이동블록에 상하이동 자유롭게 설치된 콜릿홀더와, 이 콜릿홀더에 설치되고, 다이를 진공흡착하는 콜릿과, 상기 상하이동블록에 고정된 접촉자와, 이 접촉자 상면에 접촉하도록 상기 콜릿홀더에 고정된 접촉자와, 양접촉자가 압접하도록 부세하는 부세수단과를 구비한 것을 특징으로 하는 다이본딩장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019880013651A 1987-12-23 1988-10-20 다이본딩 장치 KR910007102B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP62325728A JPH01168033A (ja) 1987-12-23 1987-12-23 ダイボンデイング装置
JP62-325728 1987-12-23
JP?62-325728 1987-12-23

Publications (2)

Publication Number Publication Date
KR890011053A true KR890011053A (ko) 1989-08-12
KR910007102B1 KR910007102B1 (ko) 1991-09-18

Family

ID=18180015

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019880013651A KR910007102B1 (ko) 1987-12-23 1988-10-20 다이본딩 장치

Country Status (3)

Country Link
US (1) US4913763A (ko)
JP (1) JPH01168033A (ko)
KR (1) KR910007102B1 (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2501946B2 (ja) * 1990-09-26 1996-05-29 三菱電機株式会社 ダイボンド装置およびその制御方法
US5188687A (en) * 1991-03-06 1993-02-23 Labelmatic, Inc. Label pickup and applicator assembly and method
US5234530A (en) * 1991-05-20 1993-08-10 Eastman Kodak Company Apparatus for controlling assembly force
JP2001135653A (ja) * 1999-11-02 2001-05-18 Mitsubishi Electric Corp ダイボンディング装置及び半導体装置
JP2001156085A (ja) * 1999-11-30 2001-06-08 Nec Corp 搭載方法、搭載装置及び搭載処理をコンピュータに実現させるためのプログラムを記録した記録媒体
JP3549499B2 (ja) 2001-07-04 2004-08-04 松下電器産業株式会社 半導体集積回路装置ならびにｄ／ａ変換装置およびａ／ｄ変換装置
US8293043B2 (en) * 2006-07-24 2012-10-23 Asm Assembly Automation Ltd Automatic level adjustment for die bonder
US7886801B2 (en) * 2006-11-08 2011-02-15 National Research Council Of Canada Apparatus and process for stacking pieces of material
US8651159B2 (en) * 2009-06-12 2014-02-18 Asm Assembly Automation Ltd Die bonder providing a large bonding force
CN109804461B (zh) * 2016-10-08 2023-09-05 华封科技有限公司 半导体封装设备及其控制方法和控制装置
US11848219B2 (en) * 2018-04-26 2023-12-19 Shinkawa Ltd. Mounting apparatus and film supply apparatus

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1563684A (en) * 1925-01-02 1925-12-01 John E Black Veneer press and the like
US3041963A (en) * 1959-01-02 1962-07-03 Cincinnati Shaper Co Stop device for press brakes and the like
US3841140A (en) * 1972-12-18 1974-10-15 Dreis & Krump Mfg Co Control system for press brakes and the like
JPS6136939A (ja) * 1984-07-30 1986-02-21 Toshiba Corp 回路部品の圧着装置
JPS6169534A (ja) * 1984-09-11 1986-04-10 株式会社　サト− ラベル自動貼付機
GB2172947B (en) * 1985-03-25 1988-07-27 British Gas Plc Apparatus for fusion joining of thermoplastic pipes
US4749435A (en) * 1985-10-18 1988-06-07 Fuji Photo Film Co., Ltd. Apparatus for and method of producing resin laminated cards

Also Published As

Publication number Publication date
US4913763A (en) 1990-04-03
KR910007102B1 (ko) 1991-09-18
JPH01168033A (ja) 1989-07-03

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A201 Request for examination
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