KR910006438A - 접착 테이프 - Google Patents

접착 테이프 Download PDF

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KR910006438A
KR910006438A KR1019890014003A KR890014003A KR910006438A KR 910006438 A KR910006438 A KR 910006438A KR 1019890014003 A KR1019890014003 A KR 1019890014003A KR 890014003 A KR890014003 A KR 890014003A KR 910006438 A KR910006438 A KR 910006438A
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South Korea
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mentioned
adhesive tape
phenol
base film
heat resistant
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KR1019890014003A
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KR930009213B1 (ko
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유키노리 사쿠모토
시게유키 요코야마
아키히로 시부야
아쓰시 고시무라
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이노우에 다카오
가부시키가이샤 도모에가와세이시쇼
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Priority claimed from JP63242265A external-priority patent/JPH0668100B2/ja
Priority claimed from JP63286832A external-priority patent/JP2511299B2/ja
Priority claimed from JP1041637A external-priority patent/JP2668576B2/ja
Priority claimed from JP1041638A external-priority patent/JPH02222478A/ja
Application filed by 이노우에 다카오, 가부시키가이샤 도모에가와세이시쇼 filed Critical 이노우에 다카오
Publication of KR910006438A publication Critical patent/KR910006438A/ko
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Publication of KR930009213B1 publication Critical patent/KR930009213B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49558—Insulating layers on lead frames, e.g. bridging members
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
    • C09J109/02—Copolymers with acrylonitrile
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J121/00—Adhesives based on unspecified rubbers
    • C09J121/02—Latex
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
    • C09J161/04—Condensation polymers of aldehydes or ketones with phenols only
    • C09J161/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/21—Paper; Textile fabrics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C08L2666/16—Addition or condensation polymers of aldehydes or ketones according to C08L59/00 - C08L61/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
    • C08L9/02—Copolymers with acrylonitrile
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2479/00—Presence of polyamine or polyimide
    • C09J2479/08—Presence of polyamine or polyimide polyimide
    • C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/1092—All laminae planar and face to face
    • Y10T156/1093—All laminae planar and face to face with covering of discrete laminae with additional lamina
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
    • Y10T428/2887—Adhesive compositions including addition polymer from unsaturated monomer including nitrogen containing polymer [e.g., polyacrylonitrile, polymethacrylonitrile, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
    • Y10T428/2891—Adhesive compositions including addition polymer from unsaturated monomer including addition polymer from alpha-beta unsaturated carboxylic acid [e.g., acrylic acid, methacrylic acid, etc.] Or derivative thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide

Abstract

내용 없음

Description

접착 테이프
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 접착층이 내열성 베이스 필름의 한면에 적층된 본 발명에 따른 전자부품용 접착테이프의 개략적인 단면도,
제2도는 접착층이 내열성 베이스 필름의 한면에 적층되고 보호층이 접착층 상에 추가로 적층된 본 발명에 따른 전자부품용 접착 테이프의 개략적인 단면도,
제3도는 접착층이 내열성 베이스 필름의 양면에 적층된 본 발명에 따른 전자부품용 접착 테이프의 개략적인 단면도.

Claims (7)

  1. (a)내열성 베이스 필름 및(b)언급된 베이스 필름의 적어도 한면에 적층된 접착층으로 이루어지고, 언급된 접착층을 (i)레솔형 페놀 수지 및 (ⅱ)아클로니트릴/부타디엔 공중합체로 이루어지며 언급된 아크릴로니트릴/부타디엔 공중합체 100중량부당 언급된 레솔형 페놀 수지 100∼500중량부의 비율이고 언급된 레솔형 페놀 수지는 비수페놀 A형 수지, 알킬 페놀형 수지, 페놀형 수지, 및 페놀 성분으로서 비스페놀 A, 알킬페놀 및 페놀로 이루어진 군으로부터 선택된 적어도 하나를 함유하는 이의 축중합형 페놀 수지로 이루어진 군으로부터 선택됨을 특징으로 하는 전자 부품용 접착 테이프.
  2. 제1항에 있어서, 언급된 접착층이 내열성 베이스 필름의 한면에 적층되고, 언급된 접착 테이프로부터 추출된 유기 및 무기 이온성 불순물을 함유하는 추출물이 70㎲/㎝이하의 전기전도도를 갖는 접착 테이프.
  3. 제1항에 있어서, 언급된 접착 테이프가 300ppm 이하의 농도로 슬페이트 이온을 함유하는 접착 테이프.
  4. 제1항에 있어서, 언급된 접착층이 내열성 베이스 필름의 한 면에 적층되고, 언급된 내열성 베이스 필름의 다른 면이 성형화합물에 접착되는 경우에 접착 테이프가 180박리 시험에서 200g/1.5cm이상의 접착력을 갖는 접착 테이프.
  5. 제1항에 있어서, 언급된 레솔형 페놀수지가 비스페놀 A형 수지, 알킬페놀형 수지, 및 페놀 성분으로서 알킬 페놀 및 비스페놀 A로 이루어진 군으로부터 선택된 적어도 하나를 함유하는 이의 측중합형 페놀 수지로 이루어진 군으로부터 선택되며, 언급된 아크릴로니트릴/부타디엔 공중합체가 20,000∼200,000의 수평균 분자량(MN)을 가지며, 언급된 아크릴로니트릴/부타디엔 공중합체의 수평균 분자량(MN)에 대한 중량평균 분자량(MW)의 비가 MW/MN≥2.5의 범위인 접착 테이프.
  6. 제1항에 있어서, 언급된 내열성 베이스 필름이 20300℃에서 너비 방향의 선형 열팽창의 평균 계수(ASTMD-696-44에 따라 측청)0.4×10-5∼2.5×10-5cm/cm/℃를 가지며 300℃로 3분간 가열한 후에 너비 방향의 치수변화계수 (JIS C 2318-6.3.5에 따라 측정)가 0.15%이하인 접착 테이프.
  7. 제1항에 있어서, 언급된 내열성 접착층이 무기 충전제 및 유기 충전제로 이루어진 군으로부터 선택된 적어도 하나의 충전제를 접착층의 중량을 기준으로 0.5∼80중량%의 양으로 함유하는 접착 테이프.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR8914003A 1988-09-29 1989-09-29 접착 테이프 KR930009213B1 (ko)

Applications Claiming Priority (12)

Application Number Priority Date Filing Date Title
JP?63-242265? 1988-09-29
JP242265 1988-09-29
JP63242265A JPH0668100B2 (ja) 1988-09-29 1988-09-29 電子部品用接着テープ
JP63286832A JP2511299B2 (ja) 1988-11-15 1988-11-15 電子部品用接着テ―プ
JP286832 1988-11-15
JP?63-286832? 1988-11-15
JP41637 1989-02-23
JP1041637A JP2668576B2 (ja) 1989-02-23 1989-02-23 接着テープ
JP41638 1989-02-23
JP1041638A JPH02222478A (ja) 1989-02-23 1989-02-23 接着テープ
JP?1-41637? 1989-02-23
JP?1-41638? 1989-02-23

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KR910006438A true KR910006438A (ko) 1991-04-29
KR930009213B1 KR930009213B1 (ko) 1993-09-24

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Families Citing this family (128)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2257707B (en) * 1991-05-27 1995-11-01 Nippon Zeon Co Adhesive composition
EP0714125B1 (en) * 1994-11-24 1999-12-29 Dow Corning Toray Silicone Company Limited Method of fabricating a semiconductor device
JP2896754B2 (ja) * 1995-06-08 1999-05-31 株式会社巴川製紙所 電子部品用接着テープ
EP0951064A4 (en) * 1996-12-24 2005-02-23 Nitto Denko Corp PREPARATION OF A SEMICONDUCTOR DEVICE
JP3903447B2 (ja) * 1998-01-21 2007-04-11 リンテック株式会社 粘着シート
MY124687A (en) * 1998-05-20 2006-06-30 Hitachi Chemical Co Ltd Insulating adhesive for electronic parts, and lead frame and semiconductor device using the same
US8330270B1 (en) 1998-06-10 2012-12-11 Utac Hong Kong Limited Integrated circuit package having a plurality of spaced apart pad portions
US6229200B1 (en) 1998-06-10 2001-05-08 Asat Limited Saw-singulated leadless plastic chip carrier
US7270867B1 (en) 1998-06-10 2007-09-18 Asat Ltd. Leadless plastic chip carrier
US6143981A (en) 1998-06-24 2000-11-07 Amkor Technology, Inc. Plastic integrated circuit package and method and leadframe for making the package
US6281568B1 (en) 1998-10-21 2001-08-28 Amkor Technology, Inc. Plastic integrated circuit device package and leadframe having partially undercut leads and die pad
DE19851191A1 (de) * 1998-11-06 2000-05-25 Beiersdorf Ag Abdeckband und seine Verwendung
JP2000164788A (ja) * 1998-11-20 2000-06-16 Anam Semiconductor Inc 半導体パッケ―ジ用リ―ドフレ―ムとこれを用いた半導体パッケ―ジ及びその製造方法
US6359334B1 (en) 1999-06-08 2002-03-19 Micron Technology, Inc. Thermally conductive adhesive tape for semiconductor devices and method using the same
US6774480B1 (en) 1999-07-30 2004-08-10 Micron Technology, Inc. Method and structure for manufacturing improved yield semiconductor packaged devices
JP3417354B2 (ja) * 1999-08-19 2003-06-16 ソニーケミカル株式会社 接着材料及び回路接続方法
KR100379089B1 (ko) 1999-10-15 2003-04-08 앰코 테크놀로지 코리아 주식회사 리드프레임 및 이를 이용한 반도체패키지
US6847103B1 (en) 1999-11-09 2005-01-25 Amkor Technology, Inc. Semiconductor package with exposed die pad and body-locking leadframe
US6476478B1 (en) 1999-11-12 2002-11-05 Amkor Technology, Inc. Cavity semiconductor package with exposed leads and die pad
KR100421774B1 (ko) 1999-12-16 2004-03-10 앰코 테크놀로지 코리아 주식회사 반도체패키지 및 그 제조 방법
KR100583494B1 (ko) * 2000-03-25 2006-05-24 앰코 테크놀로지 코리아 주식회사 반도체패키지
KR100559664B1 (ko) 2000-03-25 2006-03-10 앰코 테크놀로지 코리아 주식회사 반도체패키지
US7042068B2 (en) 2000-04-27 2006-05-09 Amkor Technology, Inc. Leadframe and semiconductor package made using the leadframe
DE10021243A1 (de) * 2000-04-29 2001-11-08 Beiersdorf Ag Abdeckband und seine Verwendung
KR20020058209A (ko) 2000-12-29 2002-07-12 마이클 디. 오브라이언 반도체패키지
KR100731007B1 (ko) * 2001-01-15 2007-06-22 앰코 테크놀로지 코리아 주식회사 적층형 반도체 패키지
KR100394030B1 (ko) * 2001-01-15 2003-08-06 앰코 테크놀로지 코리아 주식회사 적층형 반도체 패키지
US6605865B2 (en) 2001-03-19 2003-08-12 Amkor Technology, Inc. Semiconductor package with optimized leadframe bonding strength
US6545345B1 (en) 2001-03-20 2003-04-08 Amkor Technology, Inc. Mounting for a package containing a chip
KR100393448B1 (ko) 2001-03-27 2003-08-02 앰코 테크놀로지 코리아 주식회사 반도체 패키지 및 그 제조 방법
KR100369393B1 (ko) 2001-03-27 2003-02-05 앰코 테크놀로지 코리아 주식회사 리드프레임 및 이를 이용한 반도체패키지와 그 제조 방법
US6756658B1 (en) 2001-04-06 2004-06-29 Amkor Technology, Inc. Making two lead surface mounting high power microleadframe semiconductor packages
US6900527B1 (en) 2001-09-19 2005-05-31 Amkor Technology, Inc. Lead-frame method and assembly for interconnecting circuits within a circuit module
TW588345B (en) * 2001-09-28 2004-05-21 Sony Corp Optical recording medium and its manufacturing method
US6611047B2 (en) 2001-10-12 2003-08-26 Amkor Technology, Inc. Semiconductor package with singulation crease
US6798046B1 (en) 2002-01-22 2004-09-28 Amkor Technology, Inc. Semiconductor package including ring structure connected to leads with vertically downset inner ends
US6885086B1 (en) 2002-03-05 2005-04-26 Amkor Technology, Inc. Reduced copper lead frame for saw-singulated chip package
US6608366B1 (en) 2002-04-15 2003-08-19 Harry J. Fogelson Lead frame with plated end leads
US6627977B1 (en) 2002-05-09 2003-09-30 Amkor Technology, Inc. Semiconductor package including isolated ring structure
US6841414B1 (en) 2002-06-19 2005-01-11 Amkor Technology, Inc. Saw and etch singulation method for a chip package
US6867071B1 (en) 2002-07-12 2005-03-15 Amkor Technology, Inc. Leadframe including corner leads and semiconductor package using same
US7732914B1 (en) 2002-09-03 2010-06-08 Mclellan Neil Cavity-type integrated circuit package
US6818973B1 (en) 2002-09-09 2004-11-16 Amkor Technology, Inc. Exposed lead QFP package fabricated through the use of a partial saw process
US6919620B1 (en) 2002-09-17 2005-07-19 Amkor Technology, Inc. Compact flash memory card with clamshell leadframe
US7723210B2 (en) 2002-11-08 2010-05-25 Amkor Technology, Inc. Direct-write wafer level chip scale package
US6905914B1 (en) 2002-11-08 2005-06-14 Amkor Technology, Inc. Wafer level package and fabrication method
CN100533473C (zh) 2002-11-12 2009-08-26 Nxp股份有限公司 具有带有加固条的模块的数据载体
US6798047B1 (en) 2002-12-26 2004-09-28 Amkor Technology, Inc. Pre-molded leadframe
US6750545B1 (en) 2003-02-28 2004-06-15 Amkor Technology, Inc. Semiconductor package capable of die stacking
US6927483B1 (en) 2003-03-07 2005-08-09 Amkor Technology, Inc. Semiconductor package exhibiting efficient lead placement
US6794740B1 (en) 2003-03-13 2004-09-21 Amkor Technology, Inc. Leadframe package for semiconductor devices
US6879034B1 (en) 2003-05-01 2005-04-12 Amkor Technology, Inc. Semiconductor package including low temperature co-fired ceramic substrate
US7095103B1 (en) 2003-05-01 2006-08-22 Amkor Technology, Inc. Leadframe based memory card
US8513375B2 (en) * 2003-05-05 2013-08-20 Designer Molecules, Inc. Imide-linked maleimide and polymaleimide compounds
US7008825B1 (en) 2003-05-27 2006-03-07 Amkor Technology, Inc. Leadframe strip having enhanced testability
US6897550B1 (en) 2003-06-11 2005-05-24 Amkor Technology, Inc. Fully-molded leadframe stand-off feature
US6921967B2 (en) 2003-09-24 2005-07-26 Amkor Technology, Inc. Reinforced die pad support structure
US7875688B2 (en) * 2004-06-04 2011-01-25 Designer Molecules, Inc. Free-radical curable polyesters and methods for use thereof
US7411289B1 (en) 2004-06-14 2008-08-12 Asat Ltd. Integrated circuit package with partially exposed contact pads and process for fabricating the same
US7091581B1 (en) 2004-06-14 2006-08-15 Asat Limited Integrated circuit package and process for fabricating the same
US7786248B2 (en) * 2004-08-20 2010-08-31 Designer Molecules, Inc. Underfill compositions and methods for use thereof
US7595225B1 (en) 2004-10-05 2009-09-29 Chun Ho Fan Leadless plastic chip carrier with contact standoff
KR100635053B1 (ko) * 2005-06-21 2006-10-16 도레이새한 주식회사 전자부품용 접착테이프
US7358119B2 (en) * 2005-01-12 2008-04-15 Asat Ltd. Thin array plastic package without die attach pad and process for fabricating the same
US7348663B1 (en) 2005-07-15 2008-03-25 Asat Ltd. Integrated circuit package and method for fabricating same
US7410830B1 (en) 2005-09-26 2008-08-12 Asat Ltd Leadless plastic chip carrier and method of fabricating same
US7507603B1 (en) 2005-12-02 2009-03-24 Amkor Technology, Inc. Etch singulated semiconductor package
US7572681B1 (en) 2005-12-08 2009-08-11 Amkor Technology, Inc. Embedded electronic component package
US7902660B1 (en) 2006-05-24 2011-03-08 Amkor Technology, Inc. Substrate for semiconductor device and manufacturing method thereof
US7968998B1 (en) 2006-06-21 2011-06-28 Amkor Technology, Inc. Side leaded, bottom exposed pad and bottom exposed lead fusion quad flat semiconductor package
US7687893B2 (en) 2006-12-27 2010-03-30 Amkor Technology, Inc. Semiconductor package having leadframe with exposed anchor pads
US7829990B1 (en) 2007-01-18 2010-11-09 Amkor Technology, Inc. Stackable semiconductor package including laminate interposer
US7982297B1 (en) 2007-03-06 2011-07-19 Amkor Technology, Inc. Stackable semiconductor package having partially exposed semiconductor die and method of fabricating the same
KR100844383B1 (ko) * 2007-03-13 2008-07-07 도레이새한 주식회사 반도체 칩 적층용 접착 필름
US7868113B2 (en) 2007-04-11 2011-01-11 Designer Molecules, Inc. Low shrinkage polyester thermosetting resins
JP5133598B2 (ja) 2007-05-17 2013-01-30 日東電工株式会社 封止用熱硬化型接着シート
US7977774B2 (en) 2007-07-10 2011-07-12 Amkor Technology, Inc. Fusion quad flat semiconductor package
US7687899B1 (en) 2007-08-07 2010-03-30 Amkor Technology, Inc. Dual laminate package structure with embedded elements
US7777351B1 (en) 2007-10-01 2010-08-17 Amkor Technology, Inc. Thin stacked interposer package
US8089159B1 (en) 2007-10-03 2012-01-03 Amkor Technology, Inc. Semiconductor package with increased I/O density and method of making the same
US7847386B1 (en) 2007-11-05 2010-12-07 Amkor Technology, Inc. Reduced size stacked semiconductor package and method of making the same
US7956453B1 (en) 2008-01-16 2011-06-07 Amkor Technology, Inc. Semiconductor package with patterning layer and method of making same
US7723852B1 (en) 2008-01-21 2010-05-25 Amkor Technology, Inc. Stacked semiconductor package and method of making same
US8067821B1 (en) 2008-04-10 2011-11-29 Amkor Technology, Inc. Flat semiconductor package with half package molding
US7768135B1 (en) 2008-04-17 2010-08-03 Amkor Technology, Inc. Semiconductor package with fast power-up cycle and method of making same
US7808084B1 (en) 2008-05-06 2010-10-05 Amkor Technology, Inc. Semiconductor package with half-etched locking features
US8125064B1 (en) 2008-07-28 2012-02-28 Amkor Technology, Inc. Increased I/O semiconductor package and method of making same
US8184453B1 (en) 2008-07-31 2012-05-22 Amkor Technology, Inc. Increased capacity semiconductor package
US8637611B2 (en) 2008-08-13 2014-01-28 Designer Molecules, Inc. Amide-extended crosslinking compounds and methods for use thereof
US7847392B1 (en) 2008-09-30 2010-12-07 Amkor Technology, Inc. Semiconductor device including leadframe with increased I/O
US7989933B1 (en) 2008-10-06 2011-08-02 Amkor Technology, Inc. Increased I/O leadframe and semiconductor device including same
US8008758B1 (en) 2008-10-27 2011-08-30 Amkor Technology, Inc. Semiconductor device with increased I/O leadframe
US8089145B1 (en) 2008-11-17 2012-01-03 Amkor Technology, Inc. Semiconductor device including increased capacity leadframe
US8072050B1 (en) 2008-11-18 2011-12-06 Amkor Technology, Inc. Semiconductor device with increased I/O leadframe including passive device
US7875963B1 (en) 2008-11-21 2011-01-25 Amkor Technology, Inc. Semiconductor device including leadframe having power bars and increased I/O
US7982298B1 (en) 2008-12-03 2011-07-19 Amkor Technology, Inc. Package in package semiconductor device
US8487420B1 (en) 2008-12-08 2013-07-16 Amkor Technology, Inc. Package in package semiconductor device with film over wire
DE102008062127A1 (de) * 2008-12-16 2010-07-01 Tesa Se Flächenelement zur Erzeugung von Röntgenstrahlung
US20170117214A1 (en) 2009-01-05 2017-04-27 Amkor Technology, Inc. Semiconductor device with through-mold via
US8680656B1 (en) 2009-01-05 2014-03-25 Amkor Technology, Inc. Leadframe structure for concentrated photovoltaic receiver package
US8058715B1 (en) 2009-01-09 2011-11-15 Amkor Technology, Inc. Package in package device for RF transceiver module
US8026589B1 (en) 2009-02-23 2011-09-27 Amkor Technology, Inc. Reduced profile stackable semiconductor package
US7960818B1 (en) 2009-03-04 2011-06-14 Amkor Technology, Inc. Conformal shield on punch QFN semiconductor package
US8575742B1 (en) 2009-04-06 2013-11-05 Amkor Technology, Inc. Semiconductor device with increased I/O leadframe including power bars
US8710682B2 (en) * 2009-09-03 2014-04-29 Designer Molecules Inc, Inc. Materials and methods for stress reduction in semiconductor wafer passivation layers
US8415812B2 (en) * 2009-09-03 2013-04-09 Designer Molecules, Inc. Materials and methods for stress reduction in semiconductor wafer passivation layers
US8796561B1 (en) 2009-10-05 2014-08-05 Amkor Technology, Inc. Fan out build up substrate stackable package and method
US8937381B1 (en) 2009-12-03 2015-01-20 Amkor Technology, Inc. Thin stackable package and method
US9691734B1 (en) 2009-12-07 2017-06-27 Amkor Technology, Inc. Method of forming a plurality of electronic component packages
US8324511B1 (en) 2010-04-06 2012-12-04 Amkor Technology, Inc. Through via nub reveal method and structure
US8294276B1 (en) 2010-05-27 2012-10-23 Amkor Technology, Inc. Semiconductor device and fabricating method thereof
US8440554B1 (en) 2010-08-02 2013-05-14 Amkor Technology, Inc. Through via connected backside embedded circuit features structure and method
US8487445B1 (en) 2010-10-05 2013-07-16 Amkor Technology, Inc. Semiconductor device having through electrodes protruding from dielectric layer
US8791501B1 (en) 2010-12-03 2014-07-29 Amkor Technology, Inc. Integrated passive device structure and method
US8390130B1 (en) 2011-01-06 2013-03-05 Amkor Technology, Inc. Through via recessed reveal structure and method
US8648450B1 (en) 2011-01-27 2014-02-11 Amkor Technology, Inc. Semiconductor device including leadframe with a combination of leads and lands
TWI557183B (zh) 2015-12-16 2016-11-11 財團法人工業技術研究院 矽氧烷組成物、以及包含其之光電裝置
US8552548B1 (en) 2011-11-29 2013-10-08 Amkor Technology, Inc. Conductive pad on protruding through electrode semiconductor device
US9704725B1 (en) 2012-03-06 2017-07-11 Amkor Technology, Inc. Semiconductor device with leadframe configured to facilitate reduced burr formation
US9048298B1 (en) 2012-03-29 2015-06-02 Amkor Technology, Inc. Backside warpage control structure and fabrication method
US9129943B1 (en) 2012-03-29 2015-09-08 Amkor Technology, Inc. Embedded component package and fabrication method
CN104812580B (zh) 2012-12-27 2018-07-06 日东新兴有限公司 油浸式电动机用绝缘纸
KR101486790B1 (ko) 2013-05-02 2015-01-28 앰코 테크놀로지 코리아 주식회사 강성보강부를 갖는 마이크로 리드프레임
KR101563911B1 (ko) 2013-10-24 2015-10-28 앰코 테크놀로지 코리아 주식회사 반도체 패키지
US9673122B2 (en) 2014-05-02 2017-06-06 Amkor Technology, Inc. Micro lead frame structure having reinforcing portions and method
TWI735411B (zh) * 2014-06-18 2021-08-11 日商味之素股份有限公司 附保護薄膜之接著片
CN110467894B (zh) * 2019-09-03 2021-09-17 航天特种材料及工艺技术研究所 一种粘接剂及其制备方法和应用
CN117157367A (zh) * 2021-03-30 2023-12-01 3M创新有限公司 粘合剂前体组合物和来自其的可热膨胀的临时粘合剂

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3421961A (en) * 1966-01-10 1969-01-14 Ncr Co Method of making high density electrical connections
GB1243566A (en) * 1968-10-04 1971-08-18 Bridgestone Tire Co Ltd Solution-type adhesive
US3873638A (en) * 1971-04-26 1975-03-25 Minnesota Mining & Mfg Tacky blend of butadiene-acrylonitrile copolymer thermosettable material having acrylate and epoxy groups peroxide and epoxy curing agent
US3837984A (en) * 1972-01-19 1974-09-24 Illinois Tool Works Thermosetting adhesive and articles using the same
US3784496A (en) * 1972-02-24 1974-01-08 Dow Chemical Co Rubber and amine modified phenolic resins
JPS5214745A (en) * 1975-07-23 1977-02-03 Yoshitomi Pharmaceut Ind Ltd Preparation of phenylcarbamic acid esters
US4456496A (en) * 1975-10-02 1984-06-26 Goodyear Aerospace Corporation Method of making an elastomeric fabric container
DE2612438C2 (de) * 1976-03-24 1983-04-28 Aeg Isolier- Und Kunststoff Gmbh, 3500 Kassel Haftvermittlerschicht zur Herstellung von Leiterplatten
JPS6030353B2 (ja) * 1978-07-21 1985-07-16 旭化成株式会社 耐熱性接着層を有するポリイミドフイルム
DE3009726C2 (de) * 1979-03-15 1985-08-29 Mitsui Toatsu Chemicals, Inc., Tokio/Tokyo Phenolharzzusammensetzungen
JPS56118857A (en) * 1980-02-25 1981-09-18 Nitto Electric Ind Co Thermofusing polyimide composite film and its manufacture
JPS57146337A (en) * 1981-03-06 1982-09-09 Toshiba Corp Switching device
JPS59108072A (ja) * 1982-12-11 1984-06-22 Nitto Electric Ind Co Ltd 常温粘着性を有する熱硬化性接着シ−ト
JPS6151076A (ja) * 1984-08-21 1986-03-13 Tomoegawa Paper Co Ltd 接着テ−プ
JPS61146337A (ja) * 1984-12-21 1986-07-04 Furukawa Electric Co Ltd:The タ−ンテ−ブル式粉・粒体自動供給装置
US4578315A (en) * 1985-02-13 1986-03-25 Schenectady Chemicals Inc. Phenolic resins, carboxylic resins and the elastomers containing adhesive
US4977003A (en) * 1985-02-20 1990-12-11 Minnesota Mining And Manufacturing Company Nontacky acrylonitrile/butadiene adhesive tape
US4862245A (en) * 1985-04-18 1989-08-29 International Business Machines Corporation Package semiconductor chip
US4762747A (en) * 1986-07-29 1988-08-09 Industrial Technology Research Institute Single component aqueous acrylic adhesive compositions for flexible printed circuits and laminates made therefrom
US4892602A (en) * 1986-08-19 1990-01-09 Oike Industrial Co., Ltd. Heat-sensitive transfer medium
JPS63110034A (ja) * 1986-10-27 1988-05-14 Mazda Motor Corp ４輪駆動車のトランスフア構造
US4861648A (en) * 1988-03-14 1989-08-29 Gila River Products, Inc. Materials for laminating flexible printed circuits
JPH0715087B2 (ja) * 1988-07-21 1995-02-22 リンテック株式会社 粘接着テープおよびその使用方法
US5277972B1 (en) * 1988-09-29 1996-11-05 Tomoegawa Paper Co Ltd Adhesive tapes

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KR930009213B1 (ko) 1993-09-24
EP0361975A3 (en) 1991-11-21
US5683806A (en) 1997-11-04
EP0361975B1 (en) 1995-05-24
EP0361975A2 (en) 1990-04-04
US5891566A (en) 1999-04-06
DE68922812D1 (de) 1995-06-29
DE68922812T2 (de) 1995-12-07
US5824182A (en) 1998-10-20

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