KR910006317Y1 - 프린트 배선기판 - Google Patents

프린트 배선기판 Download PDF

Info

Publication number
KR910006317Y1
KR910006317Y1 KR2019860015312U KR860015312U KR910006317Y1 KR 910006317 Y1 KR910006317 Y1 KR 910006317Y1 KR 2019860015312 U KR2019860015312 U KR 2019860015312U KR 860015312 U KR860015312 U KR 860015312U KR 910006317 Y1 KR910006317 Y1 KR 910006317Y1
Authority
KR
South Korea
Prior art keywords
solder
land
soldering
wiring board
printed wiring
Prior art date
Application number
KR2019860015312U
Other languages
English (en)
Korean (ko)
Other versions
KR870014063U (ko
Inventor
이찌로오 다까야마
Original Assignee
알프스 덴기 가부시기가이샤
가다오까 가쓰다로오
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 알프스 덴기 가부시기가이샤, 가다오까 가쓰다로오 filed Critical 알프스 덴기 가부시기가이샤
Publication of KR870014063U publication Critical patent/KR870014063U/ko
Application granted granted Critical
Publication of KR910006317Y1 publication Critical patent/KR910006317Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
KR2019860015312U 1986-02-27 1986-10-07 프린트 배선기판 KR910006317Y1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1986026622U JPS62140769U (ja) 1986-02-27 1986-02-27
JP26622 1986-02-27

Publications (2)

Publication Number Publication Date
KR870014063U KR870014063U (ko) 1987-09-11
KR910006317Y1 true KR910006317Y1 (ko) 1991-08-22

Family

ID=12198568

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019860015312U KR910006317Y1 (ko) 1986-02-27 1986-10-07 프린트 배선기판

Country Status (2)

Country Link
JP (1) JPS62140769U (ja)
KR (1) KR910006317Y1 (ja)

Also Published As

Publication number Publication date
JPS62140769U (ja) 1987-09-05
KR870014063U (ko) 1987-09-11

Similar Documents

Publication Publication Date Title
US5129573A (en) Method for attaching through-hole devices to a circuit board using solder paste
US4835345A (en) Printed wiring board having robber pads for excess solder
US6729532B2 (en) Component mounting method
US5842274A (en) Method of forming discrete solder portions on respective contact pads of a printed circuit board
KR910006317Y1 (ko) 프린트 배선기판
JPH01300588A (ja) プリント配線板及びそのはんだ付け方法
US5496971A (en) Circuit arrangement for multilayer printed circuit board
JPH0563346A (ja) チツプ型電子部品を搭載した装置
US4779339A (en) Method of producing printed circuit boards
JPS63124496A (ja) 多端子部品の取付方法
JPH07142821A (ja) プリント配線板
JPS63278398A (ja) プリント配線板における半田ブリッジ防止用バリアの形成方法
JPH0927666A (ja) 配線基板へのチップ部品実装構造
JP2008103547A (ja) 半田ペースト塗布方法及び電子回路基板
JPH07106745A (ja) プリント配線板及びパッドへの半田皮膜形成方法
JPH0144035B2 (ja)
JPH03262186A (ja) 印刷配線基板
JPH04105390A (ja) 基板機構
JPH04373156A (ja) クリーム半田接続方法
JPH01119085A (ja) プリント板
WO1987004040A1 (en) Multilayer printed circuit board
JPS5849653Y2 (ja) プリント配線板
KR920004037B1 (ko) 인쇄회로기판의 페인팅방법
JPS63291494A (ja) 表面実装用プリント配線板
JP2528436B2 (ja) 回路基板装置の製造方法

Legal Events

Date Code Title Description
A201 Request for examination
E601 Decision to refuse application
E902 Notification of reason for refusal
J2X1 Appeal (before the patent court)

Free format text: TRIAL NUMBER: 1990201000972; APPEAL AGAINST DECISION TO DECLINE REFUSAL

Free format text: APPEAL AGAINST DECISION TO DECLINE REFUSAL

O032 Opposition [utility model]: request for opposition
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20001229

Year of fee payment: 11

EXPY Expiration of term