JPS62140769U - - Google Patents

Info

Publication number
JPS62140769U
JPS62140769U JP1986026622U JP2662286U JPS62140769U JP S62140769 U JPS62140769 U JP S62140769U JP 1986026622 U JP1986026622 U JP 1986026622U JP 2662286 U JP2662286 U JP 2662286U JP S62140769 U JPS62140769 U JP S62140769U
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
dummy pattern
land
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986026622U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986026622U priority Critical patent/JPS62140769U/ja
Priority to KR2019860015312U priority patent/KR910006317Y1/ko
Publication of JPS62140769U publication Critical patent/JPS62140769U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands

Description

【図面の簡単な説明】
第１図ないし第３図は本考案の一実施例に係り
、第１図はプリント配線基板とそこに実装される
電子部品とを示す斜視図、第２図、第３図はそれ
ぞれランドと端子との接合前後の状態を示す平面
図、第４図および第５図はそれぞれ本考案の他の
実施例に係り、ランドと端子との接合後の状態を
示す平面図、第６図ないし第８図は従来例に係り
、第６図はプリント配線基板とそこに実装される
電子部品とを示す斜視図、第７図は半田付け状態
を示す斜視図、第８図はランドと端子との接合後
の状態を示す平面図である。 １…プリント配線基板、２…絶縁基板、３…回
路パターン、４…ランド、５…ＩＣ（電子部品）
、６…端子、７…半田ゴテ、８…半田、９…幅広
ランド、１０…独立パターン、１１…長尺ランド
。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 電子部品に突設された端子が半田付けされ
    るランドを、所定の間隔をおいて複数並設したプ
    リン配線基板において、最端部に位置する上記ラ
    ンドの近傍に、供給される半田の余剰分を溜保す
    るダミーパターンを設けたことを特徴とするプリ
    ント配線基板。 (2) 実用新案登録請求の範囲第(1)項記載におい
    て、上記ダミーパターンが隣接する上記ランドと
    一体に形成され、この一体化された部分の面積が
    他のランドよりも大きく設定されていることを特
    徴とするプリント配線基板。 (3) 実用新案登録請求の範囲第(1)項記載におい
    て、上記ダミーパターンと最端部の上記ランドと
    が所定の間隔をおいて並設されていることを特徴
    とするプリント配線基板。
JP1986026622U 1986-02-27 1986-02-27 Pending JPS62140769U (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1986026622U JPS62140769U (ja) 1986-02-27 1986-02-27
KR2019860015312U KR910006317Y1 (ko) 1986-02-27 1986-10-07 프린트 배선기판

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986026622U JPS62140769U (ja) 1986-02-27 1986-02-27

Publications (1)

Publication Number Publication Date
JPS62140769U true JPS62140769U (ja) 1987-09-05

Family

ID=12198568

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986026622U Pending JPS62140769U (ja) 1986-02-27 1986-02-27

Country Status (2)

Country Link
JP (1) JPS62140769U (ja)
KR (1) KR910006317Y1 (ja)

Also Published As

Publication number Publication date
KR910006317Y1 (ko) 1991-08-22
KR870014063U (ko) 1987-09-11

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