KR910001925A - 웨이퍼상의 집적회로 자동 검사 시스템 및 그 작동 방법 - Google Patents

웨이퍼상의 집적회로 자동 검사 시스템 및 그 작동 방법 Download PDF

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Publication number
KR910001925A
KR910001925A KR1019890008530A KR890008530A KR910001925A KR 910001925 A KR910001925 A KR 910001925A KR 1019890008530 A KR1019890008530 A KR 1019890008530A KR 890008530 A KR890008530 A KR 890008530A KR 910001925 A KR910001925 A KR 910001925A
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KR
South Korea
Prior art keywords
wafer
sample carrier
liquid
chamber
inspection system
Prior art date
Application number
KR1019890008530A
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English (en)
Inventor
비네 미셀
Original Assignee
이반 밀러 레르너
엔. 브이. 필립스 글로아이람펜파브리켄
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이반 밀러 레르너, 엔. 브이. 필립스 글로아이람펜파브리켄 filed Critical 이반 밀러 레르너
Priority to CA002014962A priority Critical patent/CA2014962C/en
Priority to JP2116160A priority patent/JPH0771242B2/ja
Priority to DE4014389A priority patent/DE4014389A1/de
Publication of KR910001925A publication Critical patent/KR910001925A/ko
Priority to US08/194,472 priority patent/US5446505A/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2868—Complete testing stations; systems; procedures; software aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2817—Environmental-, stress-, or burn-in tests
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2862—Chambers or ovens; Tanks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

내용 없음

Description

웨이퍼상의 직접회로 자동 검사 시스템 및 그 작동 방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따른 작동 검사 시스템의 일실시예를 도시하는 개략 배치도.

Claims (4)

  1. 챔버내에 불활성 건조 가스를 도입하기 위해 건조 장치 및 가열 장치가 연결될 수 있는 적어도 하나의 입구노즐과 챔버내의 가스를 초과 압력에서 제어 및 유지하기 위한 장치가 연결될 수 있는 적어도 하나의 배출 노즐을 갖춘 챔버와, 웨이퍼를 지지하기 위해 챔버 내측에 제공되는 샘플 캐리어 및 상기 샘플 캐리어와 프로우브 카드를 서로에 대해 제어 방식으로 변위시킬 수 있는 기계 조립체로 이루어지는, 웨이퍼상의 직접 회로 자동 검사 시스템에 있어서, 냉각 장치가 덮개를 구비한 냉각 액체의 콘테이너와 샘플 캐리어 내측의 냉각 공동에 상기 액체를 안내하기 위해 상기 액체속으로 연장되는 튜브를 포함하고 있으며, 냉각 공동에는 상기 액체 및 그 액체의 증기가 배출될 수 있는 배출 노즐이 제공되어 있는 것을 특징으로 하는 웨이퍼상의 직접 회로 자동 검사 시스템.
  2. 제1항에 있어서, 상기 샘플 캐리어가 단열 지지체에 의해 기계 조립체에 고정되어 있는 것을 특징으로 하는 웨이퍼상의 집적 회로 자동 검사 시스템.
  3. 제1항 또는 제2항에 있어서, 상기 시스템이 건조 가스를 통과시키고 샘플 캐리어의 온도를 제어 또는 변화시키는 순서를 제어하는 마이크로 프로세서 또는 자동 장치를 포함하는 것을 특징으로 하는 웨이퍼상의 직접 회로 자동 검사 시스템.
  4. 제1항, 제2항 및 제3항중 어느 한 항의 자동 검사 시스템을 작동하는 방법에 있어서, 검사될 웨이퍼와 거기에 관련된 프로우브 카드를 위치 결정해주고, 건조 불활성 가스의 순환 및 가열에 의해 챔버의 내부와 샘플 캐리어를 건조시키고, 상기 캐리어내의 냉각 액체의 증발에 의해 샘플 캐리어를 냉각시키고, 샘플 캐리어의 온도를 조절하면서 웨이퍼에 대한 검사를 수행하고, 샘플 캐리어를 재가열하여 검사된 웨이퍼를 추출하는 단계들로 이루어진 것을 특징으로 하는 집적 회로 자동 검사 시스템의 작동 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019890008530A 1988-06-24 1989-06-21 웨이퍼상의 집적회로 자동 검사 시스템 및 그 작동 방법 KR910001925A (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CA002014962A CA2014962C (en) 1989-05-06 1990-04-19 Color television set
JP2116160A JPH0771242B2 (ja) 1989-05-06 1990-05-02 カラーテレビジョン受像機
DE4014389A DE4014389A1 (de) 1989-05-06 1990-05-04 Farbfernsehgeraet
US08/194,472 US5446505A (en) 1989-05-06 1994-02-09 Color television system having broadcast program adaptive video/audio adjustment apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8808502A FR2633400B1 (fr) 1988-06-24 1988-06-24 Systeme de controle automatique de circuits integres
FR8808502 1988-06-24

Publications (1)

Publication Number Publication Date
KR910001925A true KR910001925A (ko) 1991-01-31

Family

ID=9367675

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890008530A KR910001925A (ko) 1988-06-24 1989-06-21 웨이퍼상의 집적회로 자동 검사 시스템 및 그 작동 방법

Country Status (5)

Country Link
US (1) US4954774A (ko)
EP (1) EP0349042A3 (ko)
JP (1) JPH0251243A (ko)
KR (1) KR910001925A (ko)
FR (1) FR2633400B1 (ko)

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EP2813858B1 (en) * 2013-06-14 2016-06-08 Rasco GmbH Method of contacting integrated circuit components in a test system
JP6655516B2 (ja) * 2016-09-23 2020-02-26 東京エレクトロン株式会社 基板検査装置
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Also Published As

Publication number Publication date
EP0349042A2 (fr) 1990-01-03
FR2633400B1 (fr) 1990-11-09
EP0349042A3 (fr) 1990-02-28
US4954774A (en) 1990-09-04
JPH0251243A (ja) 1990-02-21
FR2633400A1 (fr) 1989-12-29

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